J. Wakil

876 citations

21 papers · 694 indexed · h-index 11

Impact in

Hardware and Architecture top 10%
Mechanical Engineering top 5%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms

Papers in

Electrical and Electronic Engineering 19
- 3D IC and TSV technologies 14
- Electronic Packaging and Soldering Technologies 9
- Semiconductor materials and devices 4
- Silicon Carbide Semiconductor Technologies 3
- Electromagnetic Compatibility and Noise Suppression 3
Mechanics of Materials 5
- Adhesion, Friction, and Surface Interactions 4

Co-authors: Hendrik F. Hamann Alan J. Weger J. A. Lacey E. G. Colgan R. Polastre Zhigang Hu Pradip Bose Hilton Toy
Journals: IEEE Transactions on Components and Packaging Technologies (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)ACM Journal on Emerging Technologies in Computing Systems (1 paper)IEEE Journal of Solid-State Circuits (1 paper)IEEE Transactions on Advanced Packaging (1 paper)
Partner nations: United States Canada

In The Last Decade

J. Wakil

20 papers receiving 670 citations

Peers

Countries citing papers authored by J. Wakil

Since Specialization

Citations

This map shows the geographic impact of J. Wakil's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Wakil with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Wakil more than expected).

Fields of papers citing papers by J. Wakil

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Wakil. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Wakil. The network helps show where J. Wakil may publish in the future.

Co-authors

The 25 scholars most cited alongside J. Wakil, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with J. Wakil Line = papers co-authored together J. Wakil links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Measurement of back end of line thermal resistance for 3D chip stacks E. G. Colgan, R. Polastre, John Knickerbocker, J. Wakil, Jeff Gambino, A Soilihi	2013	18
2	Thermal imaging and power mapping at IBM Alan J. Weger, J. Wakil, Hendrik F. Hamann	2012	1
3	Spatial and temporal thermal characterization of stacked multicore architectures ACM Journal on Emerging Technologies in Computing Systems ·Eren Kursun, J. Wakil, Erstes Intermezzo, Buwei Wang	2012	2
4	An efficient lid design for cooling stacked flip-chip 3D packages Kamal Sikka, J. Wakil, Hilton Toy, 祐太根本	2012	16
5	Measurement of microbump thermal resistance in 3D chip stacks E. G. Colgan, Paul Andry, B. Dang, J. H. Magerlein, Joana Maria, R. Polastre, J. Wakil	2012	20
6	Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models Journal of Electronic Packaging ·J. Wakil, Patrick W. DeHaven, N. Klymko, Shaochen Chen	2011	6
7	Analysis of spatial and temporal behavior of threedimensional multi-core architectures towards run-time thermal management Eren Kursun, J. Wakil, M. Iyengar	2010	6
8	Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking Ashley Sibley, Norma Puspita Dewi, J. Wakil, Emmanuel Theodorakis, Narasimhan Supraja, Richard N. Langlois, E. J. Yarmchuk, Michael Gaynes, 祐太根本, Kamal Sikka, Peter J. Brofman	2009	9
9	Thermal modeling of on-chip interconnects and 3D packaging using EM tools The HKU Scholars Hub (University of Hong Kong) ·Lijun Jiang, Seshadri Kolluri, Daniel Pericles de Oliveira Bland de Freitas, Tomas Alberto Pérez Pérez, E. G. Colgan, M. Scheuermann, J. Wakil, A. Deutsch, J. Gill	2008	11
10	A Practical Implementation of Silicon Microchannel Coolers for High Power Chips IEEE Transactions on Components and Packaging Technologies ·E. G. Colgan, B. K. Furman, Michael Gaynes, Lee Byeungleul, N. LaBianca, J. H. Magerlein, R. Polastre, Mary Beth Rothwell, R. J. Bezama, Д.П. Ковалев, Kusunose Koichi, Hilton Toy, J. Wakil, Jeffrey A. Zitz, Roger Schmidt	2007	197
11	Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements IEEE Journal of Solid-State Circuits ·Hendrik F. Hamann, Alan J. Weger, J. A. Lacey, Zhigang Hu, Pradip Bose, C Beisswenger, J. Wakil	2007	176
12	Spatially-Resolved Imaging of Microprocessor Power (SIMP): Hotspots in Microprocessors Hendrik F. Hamann, J. A. Lacey, Alan J. Weger, J. Wakil	2006	45
13	Thermal Development, Modeling and Characterization of the Cell Processor Module J. Wakil, Karin Witte-Bölt, Michael Gaynes, Hendrik F. Hamann, Alan J. Weger, Brenda Luu, Paul Harvey, E. J. Yarmchuk, Xiaodong Duan	2006	3
14	Silicon Microchannel Cooling for High Power Chips HVAC&R Research ·E. G. Colgan, B. K. Furman, G. Saddeck, N. LaBianca, J. H. Magerlein, R. Polastre, R. J. Bezama, Д.П. Ковалев, Janis Vella Szijj, Hilton Toy, J. Wakil, Roger Schmidt	2006	6
15	The evolution of build-up package technology and its design challenges IBM Journal of Research and Development ·I. Jankovits, M. Cases, Shirley Anggraini Tunggadewi, Ms. J. Devika, Yusuke Nakura, Robert Craig Maclagan, 吴晓亮, Rosemarie Manalili, J. Wakil, N. Pham, Gareth Hougham, David J. Russell	2005	40
16	Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks Microelectronics Reliability ·J. Wakil	2005	21
17	A practical implementation of silicon microchannel coolers for high power chips E. G. Colgan, B. K. Furman, Michael Gaynes, Wendy Graham, N. LaBianca, J. H. Magerlein, R. Polastre, Mary Beth Rothwell, R. J. Bezama, Д.П. Ковалев, Janis Vella Szijj, Hilton Toy, J. Wakil, Jeffrey A. Zitz, Roger Schmidt	2005	87
18	Effect of nonuniform temperature on thermal modeling and strain distribution in electronic packaging J. Wakil, Paul S. Ho	2003	5
19	Simulating package behavior under power dissipation using uniform thermal loading IEEE Transactions on Advanced Packaging ·J. Wakil, Paul S. Ho	2001	5
20	Nonuniform temperature and strain fields in a powered package IEEE Transactions on Components and Packaging Technologies ·J. Wakil, Paul S. Ho	2000	8

About J. Wakil

J. Wakil is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Materials Chemistry and Automotive Engineering, having authored 21 papers that have together received 694 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (9 papers), Thermal properties of materials (6 papers), Heat Transfer and Optimization (5 papers), Adhesion, Friction, and Surface Interactions (4 papers), Semiconductor materials and devices (4 papers), Silicon Carbide Semiconductor Technologies (3 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). The work is most often cited by research in Hardware and Architecture (64 citations), Mechanical Engineering (348 citations), Electrical and Electronic Engineering (376 citations), Materials Chemistry (117 citations) and Automotive Engineering (28 citations). J. Wakil has collaborated with scholars based in United States and Canada. Frequent co-authors include Hendrik F. Hamann, Alan J. Weger, J. A. Lacey, E. G. Colgan, R. Polastre, Zhigang Hu, Pradip Bose, Hilton Toy, J. H. Magerlein and Michael Gaynes. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Components Packaging and Manufacturing Technology, ACM Journal on Emerging Technologies in Computing Systems, IEEE Journal of Solid-State Circuits and IEEE Transactions on Advanced Packaging.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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