IEEE Transactions on Advanced Packaging 24.2k citations
1.0k papers ·
indexed · active since 1950
Topics 3D IC and TSV technologies Electromagnetic Compatibility and Noise Suppression Electronic Packaging and Soldering Technologies Overview Impact Peers Geography Research Space Peers IEEE Transactions on Advanced Packaging
Comparison fields: 5 of 136 Electrical and Electronic Engineering 20.3k Biomedical Engineering 4.0k Aerospace Engineering 3.0k Mechanical Engineering 2.9k Materials Chemistry 2.1k Atomic and Molecular Physics, and Optics 1.9k Astronomy and Astrophysics 1.8k Mechanics of Materials 1.5k Electronic, Optical and Magnetic Materials 1.2k Polymers and Plastics 716 Hardware and Architecture 605 Control and Systems Engineering 596 Automotive Engineering 571 Computational Mechanics 563 Condensed Matter Physics 478 Civil and Structural Engineering 420 Computer Networks and Communications 395 Statistical and Nonlinear Physics 377 Statistics, Probability and Uncertainty 302 Cellular and Molecular Neuroscience 246 Industrial and Manufacturing Engineering 227 Media Technology 203 Surfaces, Coatings and Films 200 Computational Theory and Mathematics 176 Artificial Intelligence 138 Ceramics and Composites 136 Computer Vision and Pattern Recognition 134 Cognitive Neuroscience 121 Numerical Analysis 105 Molecular Biology 104 Bioengineering 97 General Materials Science 95 Organic Chemistry 94 Renewable Energy, Sustainability and the Environment 92 Human-Computer Interaction 91 Cell Biology 90 Ocean Engineering 85 Biomaterials 72 Management Science and Operations Research 55 Cardiology and Cardiovascular Medicine 51 Spectroscopy 43 Atmospheric Science 41 Industrial and Manufacturing Engineering 39 Environmental Engineering 34 Building and Construction 33 Radiology, Nuclear Medicine and Imaging 32 Nuclear and High Energy Physics 30 Plant Science 29 Pollution 26 Fluid Flow and Transfer Processes 25 Safety, Risk, Reliability and Quality 24 Information Systems 23 Signal Processing 21 Electrochemistry 18 Biophysics 16 Instrumentation 15 Radiation 14 Ophthalmology 13 Geophysics 13 Structural Biology 13 Surgery 11 Neurology 11 Management of Technology and Innovation 10 General Health Professions 10 Energy Engineering and Power Technology 10 Process Chemistry and Technology 9 Water Science and Technology 9 Philosophy 9 Transportation 9 Sociology and Political Science 9 Inorganic Chemistry 9 Computational Mathematics 8 Orthodontics 8 Global and Planetary Change 8 Public Health, Environmental and Occupational Health 8 Computer Graphics and Computer-Aided Design 8 Oceanography 7 Metals and Alloys 6 Physical and Theoretical Chemistry 6 Applied Mathematics 6 Food Science 5 Catalysis 5 Physiology 5 Software 5 Neurology 4 Pediatrics, Perinatology and Child Health 4 Architecture 4 Pulmonary and Respiratory Medicine 4 Social Psychology 4 Pharmaceutical Science 4 Analytical Chemistry 4 Biotechnology 3 Management Information Systems 3 Urban Studies 3 Physiology 3 Molecular Medicine 3 Environmental Chemistry 3 Management, Monitoring, Policy and Law 3 Ecology, Evolution, Behavior and Systematics 3 Oncology 2 Rehabilitation 2 Ecology 2 Genetics 2 Accounting 2 Acoustics and Ultrasonics 2 Ecological Modeling 2 Education 2 Oral Surgery 2 Earth-Surface Processes 2 Animal Science and Zoology 2 Statistics and Probability 2 Algebra and Number Theory 1 Genetics 1 Biochemistry 1 Emergency Medicine 1 Health Information Management 1 Economics and Econometrics 1 Reproductive Medicine 1 Geometry and Topology 1 Periodontics 1 Anesthesiology and Pain Medicine 1 Marketing 1 Developmental Neuroscience 1 Geology 1 Medical Laboratory Technology 1 Infectious Diseases 1 Modeling and Simulation 1 Pharmacology 1 Demography 1 Archeology 1 Nuclear Energy and Engineering 1 Endocrinology, Diabetes and Metabolism 1 Computer Science Applications 1 Museology 1 Speech and Hearing 1 Strategy and Management 1
Electrical and Electronic Engineering 20.3k Biomedical Engineering 4.0k Aerospace Engineering 3.0k Mechanical Engineering 2.9k Materials Chemistry 2.1k IET Science Measurement & Technology China
IEEE Transactions on Components and Packaging Technologies United States
Applied Physics Reviews China
Nature Electronics United States
Science Robotics United States
IEEE Instrumentation & Measurement Magazine United States
Progress in Aerospace Sciences United States
IEEE Electrical Insulation Magazine United States
Citations per field
0 0.5× 1.5× 2× 2.3×
IET Science Measurement & Technology · 1× This map shows the geographic impact of research published in IEEE Transactions on Advanced Packaging. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in IEEE Transactions on Advanced Packaging with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites IEEE Transactions on Advanced Packaging more than expected).
This network shows the impact of papers published in IEEE Transactions on Advanced Packaging. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in IEEE Transactions on Advanced Packaging.
About IEEE Transactions on Advanced Packaging The 1.0k papers published in IEEE Transactions on Advanced Packaging in the last decades have received a total of 24.2k indexed citations . Papers published in IEEE Transactions on Advanced Packaging usually cover Electrical and Electronic Engineering (922 papers), Astronomy and Astrophysics (73 papers) and Mechanics of Materials (107 papers) specifically the topics of 3D IC and TSV technologies (341 papers), Electromagnetic Compatibility and Noise Suppression (335 papers) and Electronic Packaging and Soldering Technologies (312 papers). The most active scholars publishing in IEEE Transactions on Advanced Packaging are R. Boudreau , Madhavan Swaminathan , M. Nakhla , S. Grivet‐Talocia , Rao Tummala , C.P. Wong , István Novák , Gerhard Tröster , Ramachandra Achar and Liwei Lin .
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive
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research landscape, it—like all bibliographic datasets—has inherent limitations. These include
incomplete records, variations in author disambiguation, differences in journal indexing, and
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Rankless may not fully capture the entirety of a scholar's output or impact.
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