B. Dang
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- 3D IC and TSV technologies 25
- Electronic Packaging and Soldering Technologies 17
- Semiconductor materials and devices 6
- Electrical and Thermal Properties of Materials 5
- Integrated Circuits and Semiconductor Failure Analysis 3
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies 5
- Hardware and Architecture top 5%
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- Advanced Surface Polishing Techniques 3
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- Semiconductor materials and interfaces 3
- Co-authors
- Paul AndryCornelia TsangS. L. WrightJohn KnickerbockerBucknell C. WebbR. PolastreR. HortonE. Sprogis
- Journals
- IBM Journal of Research and Development (5 papers)IEEE Electron Device Letters (2 papers)Journal of Microelectromechanical Systems (1 paper)
- Partner nations
- United StatesJapanCanada
In The Last Decade
B. Dang
29 papers receiving 1.4k citations
Hit Papers
Peers
Comparison fields: 5 of 58
- Electrical and Electronic Engineering 1.4k
- Automotive Engineering 250
- Hardware and Architecture 82
- Electronic, Optical and Magnetic Materials 114
- Biomedical Engineering 230
Countries citing papers authored by B. Dang
This map shows the geographic impact of B. Dang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Dang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Dang more than expected).
Fields of papers citing papers by B. Dang
This network shows the impact of papers produced by B. Dang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Dang. The network helps show where B. Dang may publish in the future.
Co-authorship network
The 25 scholars most cited alongside B. Dang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2023 | 5 | |
| 3 | 2018 | 34 | |
| 4 | 2015 | 2 | |
| 5 | 2012 | 85 | |
| 6 | 2011 | 28 | |
| 7 | 2011 | 6 | |
| 8 | 2009 | 8 | |
| 9 | 2008 | 126 | |
| 10 | 2008 | 183 | |
| 11 | 2008 | 3 | |
| 12 | Three-dimensional silicon integrationbreakdown → | 2008 | 396 |
| 13 | 2007 | 70 | |
| 14 | 2007 | 1 | |
| 15 | 2006 | 18 | |
| 16 | 2005 | 199 | |
| 17 | 2005 | 17 | |
| 18 | 2004 | 1 | |
| 19 | 2002 | 6 | |
| 20 | 2001 | 13 |
About B. Dang
B. Dang is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Atomic and Molecular Physics, and Optics, having authored 29 papers that have together received 1.5k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (17 papers), Semiconductor materials and devices (6 papers), Electrical and Thermal Properties of Materials (5 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Advanced Surface Polishing Techniques (3 papers), Semiconductor materials and interfaces (3 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Automotive Engineering (250 citations) and Hardware and Architecture (82 citations). B. Dang has collaborated with scholars based in United States, Japan and Canada. Frequent co-authors include Paul Andry, Cornelia Tsang, S. L. Wright, John Knickerbocker, Bucknell C. Webb, R. Polastre, R. Horton, E. Sprogis, C.S. Patel and Katsuyuki Sakuma. Their work appears in journals such as IBM Journal of Research and Development, IEEE Electron Device Letters, Journal of Microelectromechanical Systems, IEEE Transactions on Advanced Packaging and Oxidation of Metals.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.