B. Dang

1.8k total citations · 1 hit paper
29 papers, 1.5k citations indexed

About

B. Dang is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering. According to data from OpenAlex, B. Dang has authored 29 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 5 papers in Automotive Engineering and 4 papers in Biomedical Engineering. Recurrent topics in B. Dang's work include 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (17 papers) and Semiconductor materials and devices (6 papers). B. Dang is often cited by papers focused on 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (17 papers) and Semiconductor materials and devices (6 papers). B. Dang collaborates with scholars based in United States, Japan and Vietnam. B. Dang's co-authors include Paul Andry, Cornelia Tsang, S. L. Wright, John Knickerbocker, Bucknell C. Webb, R. Polastre, R. Horton, E. Sprogis, C.S. Patel and Katsuyuki Sakuma and has published in prestigious journals such as IEEE Electron Device Letters, IBM Journal of Research and Development and Journal of Microelectromechanical Systems.

In The Last Decade

B. Dang

29 papers receiving 1.4k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Three-dimensional silicon integration

2008 396 citations John Knickerbocker, Paul Andry et al. IBM Journal of Research and Development profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
B. Dang United States	17	1.4k	250	230	125	114	29	1.5k
E. Sprogis United States	18	1.7k 1.2×	267 1.1×	246 1.1×	91 0.7×	152 1.3×	31	1.7k
Katsuyuki Sakuma Japan	20	1.8k 1.3×	386 1.5×	383 1.7×	150 1.2×	153 1.3×	82	1.9k
R. Horton United States	17	1.5k 1.1×	225 0.9×	228 1.0×	97 0.8×	128 1.1×	31	1.6k
Cornelia Tsang United States	26	2.2k 1.6×	377 1.5×	360 1.6×	196 1.6×	166 1.5×	51	2.4k
Anne Jourdain Belgium	24	1.4k 1.0×	179 0.7×	451 2.0×	75 0.6×	86 0.8×	114	1.5k
R. Polastre United States	21	1.8k 1.3×	286 1.1×	339 1.5×	493 3.9×	158 1.4×	42	2.2k
Anna W. Topol United States	11	1.6k 1.1×	149 0.6×	208 0.9×	49 0.4×	105 0.9×	24	1.7k
John Knickerbocker United States	26	2.4k 1.8×	392 1.6×	453 2.0×	267 2.1×	179 1.6×	89	2.7k
Paul Andry United States	28	2.4k 1.8×	405 1.6×	382 1.7×	149 1.2×	210 1.8×	64	2.6k
Serguei Stoukatch Belgium	13	645 0.5×	92 0.4×	234 1.0×	90 0.7×	54 0.5×	54	787

Countries citing papers authored by B. Dang

Since Specialization

Citations

This map shows the geographic impact of B. Dang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Dang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Dang more than expected).

Fields of papers citing papers by B. Dang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by B. Dang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Dang. The network helps show where B. Dang may publish in the future.

Co-authorship network of co-authors of B. Dang

This figure shows the co-authorship network connecting the top 25 collaborators of B. Dang. A scholar is included among the top collaborators of B. Dang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with B. Dang. B. Dang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

1.

Dang, B., Ju Tang, Yan Shang, & Deng’an Cai. (2025). Shear Failure Analysis of 3D Seven-Directional Braided Composites. Coatings. 15(2). 223–223. 1 indexed citations

2.

Nguyen, Vu T., Binh Thang Tran, Chinh Van Dang, et al.. (2023). Sleep Quality and Poor Sleep-related Factors Among Healthcare Workers During the COVID-19 Pandemic in Vietnam. Journal of Preventive Medicine and Public Health. 56(4). 319–326. 5 indexed citations

3.

Knickerbocker, John, R. Budd, B. Dang, et al.. (2018). Heterogeneous Integration Technology Demonstrations for Future Healthcare, IoT, and AI Computing Solutions. 1519–1528. 34 indexed citations

4.

Andry, Paul, R. Budd, R. Polastre, et al.. (2014). Advanced wafer bonding and laser debonding. 883–887. 20 indexed citations

5.

Colgan, E. G., Paul Andry, B. Dang, et al.. (2012). Measurement of microbump thermal resistance in 3D chip stacks. 1–7. 20 indexed citations

6.

Wright, S. L., Cornelia Tsang, Joana Maria, et al.. (2012). Micro-interconnection reliability: Thermal, electrical and mechanical stress. 16 indexed citations

7.

Maria, Joana, B. Dang, S. L. Wright, et al.. (2011). 3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections. 268–273. 28 indexed citations

8.

Andry, Paul, et al.. (2011). Low-profile 3D silicon-on-silicon multi-chip assembly. 553–559. 6 indexed citations

9.

Interrante, M. J., Paul Andry, B. Dang, et al.. (2009). Reliable through silicon vias for 3D silicon applications. 63–66. 8 indexed citations

10.

Sakuma, Katsuyuki, Paul Andry, Cornelia Tsang, et al.. (2008). 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM Journal of Research and Development. 52(6). 611–622. 126 indexed citations

11.

Shih, Da‐Yuan, B. Dang, Minhua Lu, et al.. (2008). C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications. 1–7. 3 indexed citations

12.

Knickerbocker, John, Paul Andry, B. Dang, et al.. (2008). Three-dimensional silicon integration. IBM Journal of Research and Development. 52(6). 553–569. 396 indexed citations breakdown →

13.

Knickerbocker, John, Paul Andry, B. Dang, et al.. (2008). 3D silicon integration. 538–543. 183 indexed citations

14.

Sakuma, Katsuyuki, Paul Andry, B. Dang, et al.. (2007). 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections. 627–632. 70 indexed citations

15.

Dang, B., Muhannad S. Bakir, C.S. Patel, Hiren Thacker, & J.D. Meindl. (2006). Sea-of-Leads MEMS I/O Interconnects for Low-k IC Packaging. Journal of Microelectromechanical Systems. 15(3). 523–530. 18 indexed citations

16.

Bakir, Muhannad S., et al.. (2005). Sea of leads compliant I/O interconnect process integration for the ultimate enabling of chips with low-k interlayer dielectrics. IEEE Transactions on Advanced Packaging. 28(3). 488–494. 17 indexed citations

17.

Knickerbocker, John, Paul Andry, L.P. Buchwalter, et al.. (2005). Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM Journal of Research and Development. 49(4.5). 725–753. 199 indexed citations

18.

Dang, B., Chirag Patel, Hiren Thacker, et al.. (2004). Optimal implementation of sea of leads (SoL) compliant interconnect technology. 99–101. 1 indexed citations

19.

Dang, B., et al.. (2002). Wetting characteristics of Pb-free solder pastes and Pb-free PWB finishes. 18 29. 1338–1344. 6 indexed citations

20.

Dang, B., Jeffrey W. Fergus, William F. Gale, & Tao Zhou. (2001). Effect of Copper on the Oxidation Behavior of Ti–48Al–2Cr–2Nb. Oxidation of Metals. 56(1-2). 15–32. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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