Roger Schmidt
Impact in
- Mechanical Engineering top 0.5%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms
- Hardware and Architecture top 2%
- Parallel Computing and Optimization Techniques
Papers in ⓘ
-
- Heat Transfer and Optimization 121
- Heat Transfer and Boiling Studies 44
- Co-authors
- Madhusudan Iyengar (45 shared papers)Bahgat Sammakia (38 shared papers)Ethan Cruz (9 shared papers)M. Iyengar (6 shared papers)Robert E. Simons (8 shared papers)James W. VanGilder (3 shared papers)Richard C. Chu (5 shared papers)Michael Ellsworth (5 shared papers)
- Journals
- Journal of Electronic Packaging (9 papers)IBM Journal of Research and Development (5 papers)IEEE Transactions on Components and Packaging Technologies (5 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (4 papers)Journal of Heat Transfer (3 papers)
- Partner nations
- United StatesSwitzerlandTaiwan
In The Last Decade
Roger Schmidt
142 papers receiving 2.9k citations
Peers
Comparison fields: 5 of 72
- Mechanical Engineering 2.4k
- Hardware and Architecture 367
- Computational Mechanics 548
- Building and Construction 304
- Information Systems 465
Countries citing papers authored by Roger Schmidt
This map shows the geographic impact of Roger Schmidt's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Roger Schmidt with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Roger Schmidt more than expected).
Fields of papers citing papers by Roger Schmidt
This network shows the impact of papers produced by Roger Schmidt. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Roger Schmidt. The network helps show where Roger Schmidt may publish in the future.
Co-authors
The 25 scholars most cited alongside Roger Schmidt, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 149 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 197 | |
| 2 | 2004 | 186 | |
| 3 | 2005 | 164 | |
| 4 | 2002 | 88 | |
| 5 | 2005 | 87 | |
| 6 | 2012 | 82 | |
| 7 | 2005 | 81 | |
| 8 | 2005 | 74 | |
| 9 | 2004 | 61 | |
| 10 | 2006 | 56 | |
| 11 | 2010 | 55 | |
| 12 | 2007 | 52 | |
| 13 | 2001 | 52 | |
| 14 | 2008 | 51 | |
| 15 | 2015 | 48 | |
| 16 | 2009 | 47 | |
| 17 | 2008 | 46 | |
| 18 | 2012 | 45 | |
| 19 | 2006 | 45 | |
| 20 | 2010 | 43 |
About Roger Schmidt
Roger Schmidt is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Hardware and Architecture, Computational Mechanics and Information Systems, having authored 149 papers that have together received 3.1k indexed citations. Recurring topics across this work include Heat Transfer and Optimization (121 papers), Heat Transfer and Boiling Studies (44 papers), Parallel Computing and Optimization Techniques (31 papers), Cloud Computing and Resource Management (23 papers), Advanced Data Storage Technologies (20 papers), Thermal Analysis in Power Transmission (16 papers), Building Energy and Comfort Optimization (14 papers) and Lattice Boltzmann Simulation Studies (13 papers). The work is most often cited by research in Mechanical Engineering (2.4k citations), Hardware and Architecture (367 citations), Computational Mechanics (548 citations), Building and Construction (304 citations) and Information Systems (465 citations). Roger Schmidt has collaborated with scholars based in United States, Switzerland and Taiwan. Frequent co-authors include Madhusudan Iyengar, Bahgat Sammakia, Ethan Cruz, M. Iyengar, Robert E. Simons, James W. VanGilder, Richard C. Chu, Michael Ellsworth, Saurabh Shrivastava and Michael Gaynes. Their work appears in journals such as Journal of Electronic Packaging, IBM Journal of Research and Development, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Components Packaging and Manufacturing Technology and Journal of Heat Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.