Siva P. Gurrum

468 total citations
34 papers, 364 citations indexed

About

Siva P. Gurrum is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Siva P. Gurrum has authored 34 papers receiving a total of 364 indexed citations (citations by other indexed papers that have themselves been cited), including 29 papers in Electrical and Electronic Engineering, 9 papers in Mechanics of Materials and 8 papers in Mechanical Engineering. Recurrent topics in Siva P. Gurrum's work include Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (11 papers) and Thermal properties of materials (4 papers). Siva P. Gurrum is often cited by papers focused on Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (11 papers) and Thermal properties of materials (4 papers). Siva P. Gurrum collaborates with scholars based in United States. Siva P. Gurrum's co-authors include Yogendra Joshi, Andrei G. Fedorov, William P. King, Jungho Kim, Darvin Edwards, Wataru Nakayama, Martin Gall, K. Ramakrishna, Ganesh Subbarayan and Guangxu Li and has published in prestigious journals such as Journal of Applied Physics, International Journal of Heat and Mass Transfer and Journal of Materials Science.

In The Last Decade

Siva P. Gurrum

29 papers receiving 343 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Siva P. Gurrum United States 9 158 157 111 44 37 34 364
Boon Long Lau Singapore 12 262 1.7× 290 1.8× 75 0.7× 58 1.3× 61 1.6× 60 508
K.E. Goodson United States 10 112 0.7× 211 1.3× 124 1.1× 84 1.9× 73 2.0× 25 397
T.F. Lemczyk Canada 11 122 0.8× 205 1.3× 55 0.5× 37 0.8× 37 1.0× 14 347
J. Wakil United States 11 376 2.4× 348 2.2× 117 1.1× 76 1.7× 47 1.3× 21 694
Gihyun Bae South Korea 12 138 0.9× 208 1.3× 121 1.1× 41 0.9× 20 0.5× 48 400
Jiang Taiwan 7 135 0.9× 145 0.9× 69 0.6× 46 1.0× 18 0.5× 38 389
M.B. Kleiner Germany 8 262 1.7× 132 0.8× 62 0.6× 71 1.6× 9 0.2× 16 407
S.A. Kuhn Germany 8 258 1.6× 130 0.8× 62 0.6× 69 1.6× 9 0.2× 12 401
Junhao Zhu China 12 133 0.8× 150 1.0× 121 1.1× 61 1.4× 23 0.6× 37 367
Junjia He China 11 171 1.1× 41 0.3× 116 1.0× 24 0.5× 26 0.7× 31 310

Countries citing papers authored by Siva P. Gurrum

Since Specialization
Citations

This map shows the geographic impact of Siva P. Gurrum's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Siva P. Gurrum with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Siva P. Gurrum more than expected).

Fields of papers citing papers by Siva P. Gurrum

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Siva P. Gurrum. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Siva P. Gurrum. The network helps show where Siva P. Gurrum may publish in the future.

Co-authorship network of co-authors of Siva P. Gurrum

This figure shows the co-authorship network connecting the top 25 collaborators of Siva P. Gurrum. A scholar is included among the top collaborators of Siva P. Gurrum based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Siva P. Gurrum. Siva P. Gurrum is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
3.
Subbarayan, Ganesh, et al.. (2020). A Mechanistic Model for Plastic Metal Line Ratcheting Induced BEOL Cracks in Molded Packages. 1121–1127. 3 indexed citations
4.
Gurrum, Siva P., et al.. (2018). Correlated Model for Wafer Warpage Prediction of Arbitrarily Patterned Films. 2116–2120. 12 indexed citations
5.
Subbarayan, Ganesh, et al.. (2018). Estimating the Modulus and Yield Strength of the Top-Layer Film on Multilayer BEOL Stacks. IEEE Transactions on Device and Materials Reliability. 18(3). 438–449. 1 indexed citations
6.
7.
Subbarayan, Ganesh, et al.. (2016). Estimation of passivated metal stack modulus through simulations of Micro-indentation. 92. 1326–1332. 1 indexed citations
8.
9.
Gurrum, Siva P., et al.. (2014). A stress-based effective film technique for wafer warpage prediction of arbitrarily patterned films. 821–828. 8 indexed citations
10.
Srinivasan, Venkat, et al.. (2011). Delamination prediction in lead frame packages using adhesion measurements and interfacial fracture modeling. 29. 1269–1275. 1 indexed citations
11.
Gurrum, Siva P., Jie-Hua Zhao, & Darvin Edwards. (2010). Inclusion interaction and effective material properties in a particle-filled composite material system. Journal of Materials Science. 46(1). 101–107. 5 indexed citations
12.
13.
Gurrum, Siva P., William P. King, & Yogendra Joshi. (2008). A semianalytical solution for the 3ω method including the effect of heater thermal conduction. Journal of Applied Physics. 103(11). 15 indexed citations
14.
Gurrum, Siva P., et al.. (2008). A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method. Journal of Electronic Packaging. 130(3). 25 indexed citations
15.
Gurrum, Siva P., et al.. (2008). Size Effect on the Thermal Conductivity of Thin Metallic Films Investigated by Scanning Joule Expansion Microscopy. Journal of Heat Transfer. 130(8). 28 indexed citations
16.
Gurrum, Siva P., et al.. (2005). Scanning Joule Expansion Microscopy of a Constriction in Thin Metallic Film. Journal of Heat Transfer. 127(8). 809–809. 5 indexed citations
17.
18.
Gurrum, Siva P., Yogendra Joshi, William P. King, & K. Ramakrishna. (2004). Numerical Simulation of Electron Transport Through Constriction in a Metallic Thin Film. IEEE Electron Device Letters. 25(10). 696–698. 10 indexed citations
19.
Gurrum, Siva P., et al.. (2004). Thermal Issues in Next-Generation Integrated Circuits. IEEE Transactions on Device and Materials Reliability. 4(4). 709–714. 125 indexed citations
20.
Gurrum, Siva P., et al.. (2003). Thermal Issues in Next Generation Integrated Circuits. 659–664. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Boon Long Lau Breakdown of academic impact, for papers by K.E. Goodson Breakdown of academic impact, for papers by T.F. Lemczyk Breakdown of academic impact, for papers by J. Wakil Breakdown of academic impact, for papers by Gihyun Bae Breakdown of academic impact, for papers by Jiang Breakdown of academic impact, for papers by M.B. Kleiner Breakdown of academic impact, for papers by S.A. Kuhn Breakdown of academic impact, for papers by Junhao Zhu Breakdown of academic impact, for papers by Junjia He
Rankless by CCL
2026