Siva P. Gurrum
- Electrical and Electronic Engineering
- Mechanical Engineering
- Materials Chemistry
- Biomedical Engineering
- Computational Mechanics
- Co-authors
- Yogendra JoshiAndrei G. FedorovWilliam P. KingJungho KimDarvin EdwardsWataru NakayamaMartin GallK. Ramakrishna
- Topics
- Electronic Packaging and Soldering Technologies (21 papers)3D IC and TSV technologies (11 papers)Thermal properties of materials (4 papers)
- Journals
- Journal of Applied PhysicsInternational Journal of Heat and Mass TransferJournal of Materials Science
- Partner nations
- United States
In The Last Decade
Siva P. Gurrum
29 papers receiving 343 citations
Peers
Comparison fields: 5 of 42
- Electrical and Electronic Engineering 158
- Mechanical Engineering 157
- Materials Chemistry 111
- Biomedical Engineering 44
- Computational Mechanics 37
Countries citing papers authored by Siva P. Gurrum
This map shows the geographic impact of Siva P. Gurrum's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Siva P. Gurrum with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Siva P. Gurrum more than expected).
Fields of papers citing papers by Siva P. Gurrum
This network shows the impact of papers produced by Siva P. Gurrum. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Siva P. Gurrum. The network helps show where Siva P. Gurrum may publish in the future.
Co-authorship network of co-authors of Siva P. Gurrum
This figure shows the co-authorship network connecting the top 25 collaborators of Siva P. Gurrum. A scholar is included among the top collaborators of Siva P. Gurrum based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Siva P. Gurrum. Siva P. Gurrum is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 3 | |
| 3 | 12 | |
| 4 | 1 | |
| 5 | 1 | |
| 6 | 1 | |
| 7 | 2 | |
| 8 | 8 | |
| 9 | 1 | |
| 10 | 5 | |
| 11 | 0 | |
| 12 | 5 | |
| 13 | 25 | |
| 14 | 4 | |
| 15 | 28 | |
| 16 | 15 | |
| 17 | 5 | |
| 18 | 10 | |
| 19 | 8 | |
| 20 | 0 |
About Siva P. Gurrum
Siva P. Gurrum is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Hardware and Architecture, having authored 34 papers that have together received 364 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (11 papers) and Thermal properties of materials (4 papers). The work is most often cited by research in Mechanical Engineering (157 citations), Electrical and Electronic Engineering (158 citations) and Ceramics and Composites (14 citations). Siva P. Gurrum has collaborated with scholars based in United States. Frequent co-authors include Yogendra Joshi, Andrei G. Fedorov, William P. King, Jungho Kim, Darvin Edwards, Wataru Nakayama, Martin Gall, K. Ramakrishna, Ying Sun and Guangxu Li. Their work appears in journals such as Journal of Applied Physics, International Journal of Heat and Mass Transfer and Journal of Materials Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.