Paul Andry

3.6k total citations · 1 hit paper
64 papers, 2.6k citations indexed

About

Paul Andry is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering. According to data from OpenAlex, Paul Andry has authored 64 papers receiving a total of 2.6k indexed citations (citations by other indexed papers that have themselves been cited), including 61 papers in Electrical and Electronic Engineering, 11 papers in Automotive Engineering and 8 papers in Biomedical Engineering. Recurrent topics in Paul Andry's work include 3D IC and TSV technologies (52 papers), Electronic Packaging and Soldering Technologies (32 papers) and Semiconductor materials and devices (21 papers). Paul Andry is often cited by papers focused on 3D IC and TSV technologies (52 papers), Electronic Packaging and Soldering Technologies (32 papers) and Semiconductor materials and devices (21 papers). Paul Andry collaborates with scholars based in United States, Japan and Canada. Paul Andry's co-authors include Cornelia Tsang, John Knickerbocker, S. L. Wright, R. Polastre, E. Sprogis, Bucknell C. Webb, B. Dang, R. Horton, C.S. Patel and Katsuyuki Sakuma and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Journal of Solid-State Circuits.

In The Last Decade

Paul Andry

63 papers receiving 2.5k citations

Hit Papers

align trajectories sort by overperformance

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Three-dimensional silicon integration

2008 396 citations John Knickerbocker, Paul Andry et al. IBM Journal of Research and Development profile →

Author Peers

Peers are selected by citation overlap in the author's most active subfields. citations · hero ref

Author						Papers	Cites
Paul Andry	2.4k	405	382	233	210	64	2.6k
John Knickerbocker	2.4k 1.0×	392 1.0×	453 1.2×	142 0.6×	179 0.9×	89	2.7k
Cornelia Tsang	2.2k 0.9×	377 0.9×	360 0.9×	84 0.4×	166 0.8×	51	2.4k
Bucknell C. Webb	1.7k 0.7×	262 0.6×	289 0.8×	115 0.5×	258 1.2×	52	1.9k
R. Polastre	1.8k 0.8×	286 0.7×	339 0.9×	175 0.8×	158 0.8×	42	2.2k
S. L. Wright	1.8k 0.8×	286 0.7×	278 0.7×	123 0.5×	178 0.8×	51	2.0k
Michele Stucchi	2.3k 0.9×	195 0.5×	241 0.6×	141 0.6×	365 1.7×	132	2.4k
Katsuyuki Sakuma	1.8k 0.7×	386 1.0×	383 1.0×	98 0.4×	153 0.7×	82	1.9k
E. Sprogis	1.7k 0.7×	267 0.7×	246 0.6×	82 0.4×	152 0.7×	31	1.7k
B. Dang	1.4k 0.6×	250 0.6×	230 0.6×	82 0.4×	114 0.5×	29	1.5k
R. Horton	1.5k 0.6×	225 0.6×	228 0.6×	60 0.3×	128 0.6×	31	1.6k

Countries citing papers authored by Paul Andry

Since Specialization

Citations

This map shows the geographic impact of Paul Andry's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Paul Andry with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Paul Andry more than expected).

Fields of papers citing papers by Paul Andry

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Paul Andry. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Paul Andry. The network helps show where Paul Andry may publish in the future.

Co-authorship network of co-authors of Paul Andry

This figure shows the co-authorship network connecting the top 25 collaborators of Paul Andry. A scholar is included among the top collaborators of Paul Andry based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Paul Andry. Paul Andry is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Sakuma, Katsuyuki, et al.. (2021). 3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(5). 875–878. 4 indexed citations

Sakuma, Katsuyuki, et al.. (2021). 3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for $55\ \mu\mathrm{m}-75\ \mu \mathrm{m}$ Mixed Pitch Interconnections on High Density Laminate. 292–297. 4 indexed citations

Sikka, Kamal, Ravi Bonam, Yang Liu, et al.. (2021). Direct Bonded Heterogeneous Integration (DBHi) Si Bridge. 136–147. 31 indexed citations

Schultz, Mark, C. Cabral, Cornelia Tsang, et al.. (2018). Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks. 97–102. 1 indexed citations

Dang, Bing, Bucknell C. Webb, Cornelia Tsang, Paul Andry, & John Knickerbocker. (2014). Factors in the selection of temporary wafer handlers for 3D/2.5D integration. 576–581. 10 indexed citations

Dang, Bing, S. L. Wright, Joana Maria, et al.. (2013). NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks. 1595–1599. 2 indexed citations

Gu, Xiaoxiong, Bing Dang, Cornelia Tsang, et al.. (2011). High-density silicon carrier transmission line design for chip-to-chip interconnects. 27–30. 19 indexed citations

Maria, Joana, B. Dang, S. L. Wright, et al.. (2011). 3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections. 268–273. 28 indexed citations

Sakuma, Katsuyuki, Sayuri Kohara, K. Matsumoto, et al.. (2010). IMC bonding for 3D interconnection. 864–871. 53 indexed citations

10.

Nakada, Kazuyoshi, et al.. (2010). Novel adhesive development for CMOS-compatible thin wafer handling. 1239–1244. 31 indexed citations

11.

Chen, Kuan‐Neng, et al.. (2010). Investigations of Cu bond structures and demonstration of a wafer-level 3D integration scheme with W TSVs. 162–163. 2 indexed citations

12.

Dang, Bing, Paul Andry, Cornelia Tsang, et al.. (2010). CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration. 1393–1398. 36 indexed citations

13.

Interrante, M. J., Paul Andry, B. Dang, et al.. (2009). Reliable through silicon vias for 3D silicon applications. 63–66. 8 indexed citations

14.

Dang, Bing, S. L. Wright, Paul Andry, et al.. (2009). 3D chip stack with integrated decoupling capacitors. 1–5. 11 indexed citations

15.

Sakuma, Katsuyuki, Paul Andry, Cornelia Tsang, et al.. (2008). 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM Journal of Research and Development. 52(6). 611–622. 126 indexed citations

16.

Sakuma, Katsuyuki, Paul Andry, B. Dang, et al.. (2007). 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections. 627–632. 70 indexed citations

17.

Knickerbocker, John, C.S. Patel, Paul Andry, et al.. (2006). 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE Journal of Solid-State Circuits. 41(8). 1718–1725. 151 indexed citations

18.

Wright, S. L., R. Polastre, H. Gan, et al.. (2006). Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications. 633–640. 73 indexed citations

19.

Knickerbocker, John, Paul Andry, L.P. Buchwalter, et al.. (2005). Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM Journal of Research and Development. 49(4.5). 725–753. 199 indexed citations

20.

Andry, Paul, et al.. (1995). Erbium-doped silicon films grown by plasma-enhanced chemical-vapor deposition. Journal of Applied Physics. 78(10). 6241–6248. 19 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact