Paul Andry

3.6k total citations · 1 hit paper
64 papers, 2.6k citations indexed

About

Paul Andry is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering. According to data from OpenAlex, Paul Andry has authored 64 papers receiving a total of 2.6k indexed citations (citations by other indexed papers that have themselves been cited), including 61 papers in Electrical and Electronic Engineering, 11 papers in Automotive Engineering and 8 papers in Biomedical Engineering. Recurrent topics in Paul Andry's work include 3D IC and TSV technologies (52 papers), Electronic Packaging and Soldering Technologies (32 papers) and Semiconductor materials and devices (21 papers). Paul Andry is often cited by papers focused on 3D IC and TSV technologies (52 papers), Electronic Packaging and Soldering Technologies (32 papers) and Semiconductor materials and devices (21 papers). Paul Andry collaborates with scholars based in United States, Japan and Canada. Paul Andry's co-authors include Cornelia Tsang, John Knickerbocker, S. L. Wright, R. Polastre, E. Sprogis, Bucknell C. Webb, B. Dang, R. Horton, C.S. Patel and Katsuyuki Sakuma and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Journal of Solid-State Circuits.

In The Last Decade

Paul Andry

63 papers receiving 2.5k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Three-dimensional silicon integration

2008 396 citations John Knickerbocker, Paul Andry et al. IBM Journal of Research and Development profile →

Peers

Countries citing papers authored by Paul Andry

Since Specialization

Citations

This map shows the geographic impact of Paul Andry's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Paul Andry with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Paul Andry more than expected).

Fields of papers citing papers by Paul Andry

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Paul Andry. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Paul Andry. The network helps show where Paul Andry may publish in the future.

Co-authorship network of co-authors of Paul Andry

This figure shows the co-authorship network connecting the top 25 collaborators of Paul Andry. A scholar is included among the top collaborators of Paul Andry based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Paul Andry. Paul Andry is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System 2021 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·Katsuyuki Sakuma, (unknown), Paul Andry, C. Cabral, (unknown), (unknown), R. Divakaruni	4
2	3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for $55\ \mu\mathrm{m}-75\ \mu \mathrm{m}$ Mixed Pitch Interconnections on High Density Laminate 2021 ·Katsuyuki Sakuma, (unknown), Paul Andry, C. Cabral, (unknown), (unknown), Shidong Li, (unknown), (unknown)	4
3	Factors in the selection of temporary wafer handlers for 3D/2.5D integration 2014 ·Bing Dang, Bucknell C. Webb, Cornelia Tsang, Paul Andry, John Knickerbocker	10
4	High-density silicon carrier transmission line design for chip-to-chip interconnects 2011 ·Xiaoxiong Gu, (unknown), Bing Dang, Cornelia Tsang, Paul Andry, Timothy O. Dickson, Michael P. Beakes, John Knickerbocker, Daniel J. Friedman	19
5	3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections 2011 ·Joana Maria, B. Dang, S. L. Wright, Cornelia Tsang, Paul Andry, R. Polastre, (unknown), L. B. Wiggins, John Knickerbocker	28
6	Low-profile 3D silicon-on-silicon multi-chip assembly 2011 ·Paul Andry, B. Dang, John Knickerbocker, (unknown), (unknown)	6
7	IMC bonding for 3D interconnection 2010 ·Katsuyuki Sakuma, (unknown), Sayuri Kohara, K. Matsumoto, (unknown), (unknown), (unknown), (unknown), Paul Andry, Cornelia Tsang, John Knickerbocker, Yasumitsu Orii	53
8	Novel adhesive development for CMOS-compatible thin wafer handling 2010 ·(unknown), Kazuyoshi Nakada, (unknown), Paul Andry, John Knickerbocker, Christopher Rosenthal	31
9	CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration 2010 ·Bing Dang, Paul Andry, Cornelia Tsang, Joana Maria, R. Polastre, Robert Trzcinski, (unknown), John Knickerbocker	36
10	Investigations of Cu bond structures and demonstration of a wafer-level 3D integration scheme with W TSVs 2010 ·Kuan‐Neng Chen, C. Cabral, (unknown), Paul Andry, Jian‐Qiang Lu	2
11	3D chip stack with integrated decoupling capacitors 2009 ·Bing Dang, S. L. Wright, Paul Andry, E. Sprogis, (unknown), Cornelia Tsang, R. Polastre, John Knickerbocker	11
12	Reliable through silicon vias for 3D silicon applications 2009 ·(unknown), M. J. Interrante, Paul Andry, B. Dang, Cornelia Tsang, R. W. Liptak, (unknown), E. Sprogis, (unknown), Viet Giang Truong, (unknown), John Knickerbocker	8
13	3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections 2008 ·IBM Journal of Research and Development ·Katsuyuki Sakuma, Paul Andry, Cornelia Tsang, S. L. Wright, B. Dang, C.S. Patel, Bucknell C. Webb, Joana Maria, E. Sprogis, S. K. Kang, R. Polastre, R. Horton, John Knickerbocker	126
14	Die-to-Wafer 3D Integration Technology for High Yield and Throughput 2008 ·Katsuyuki Sakuma, Paul Andry, Cornelia Tsang, (unknown), C.S. Patel, (unknown), E. Sprogis, John Knickerbocker	4
15	3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections 2007 ·Katsuyuki Sakuma, Paul Andry, B. Dang, Joana Maria, Cornelia Tsang, Chirag Patel, S. L. Wright, Bucknell C. Webb, E. Sprogis, S. K. Kang, R. Polastre, R. Horton, John Knickerbocker	70
16	Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications 2006 ·S. L. Wright, R. Polastre, H. Gan, L.P. Buchwalter, R. Horton, Paul Andry, E. Sprogis, Chirag Patel, Cornelia Tsang, John Knickerbocker, J. R. Lloyd, A. Sharma, (unknown)	73
17	Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection 2005 ·IBM Journal of Research and Development ·John Knickerbocker, Paul Andry, L.P. Buchwalter, A. Deutsch, R. Horton, K.A. Jenkins, Young Kwark, Gerard McVicker, C.S. Patel, R. Polastre, Christian Schuster, A. Sharma, Sri M. Sri-Jayantha, C.W. Surovic, Cornelia Tsang, Bucknell C. Webb, S. L. Wright, (unknown), E. Sprogis, B. Dang	199
18	Comparison of diamond-like carbon film deposition by electron cyclotron resonance with benzene and methane 1996 ·Journal of materials research/Pratt's guide to venture capital sources ·Paul Andry, (unknown), W. J. Varhue	37
19	Low-Temperature Growth of Si:Er by Electron Cyclotron Resonance Pecvd Using Metal Organics 1996 ·MRS Proceedings ·Paul Andry, W. J. Varhue, Ellen Adams, (unknown), P. B. Klein, R. L. Hengehold, (unknown)	1
20	Erbium-doped silicon films grown by plasma-enhanced chemical-vapor deposition 1995 ·Journal of Applied Physics ·(unknown), Paul Andry, W. J. Varhue, Ellen Adams, (unknown), P. B. Klein	19

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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