M.B. Kleiner
Impact in
- Hardware and Architecture top 10%
-
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Low-power high-performance VLSI design
Papers in
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- Parallel Computing and Optimization Techniques 5
-
- 3D IC and TSV technologies 4
- Advanced Memory and Neural Computing 3
- Low-power high-performance VLSI design 3
- Semiconductor materials and devices 3
- CCD and CMOS Imaging Sensors 2
- Journals
- Journal of Systems Architecture (1 paper)IEEE Transactions on Electron Devices (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (1 paper)Fraunhofer-Publica (Fraunhofer-Gesellschaft) (1 paper)
- Partner nations
- GermanyUnited States
In The Last Decade
M.B. Kleiner
16 papers receiving 386 citations
Peers
Comparison fields: 5 of 38
- Hardware and Architecture 40
- Electrical and Electronic Engineering 262
- Mechanical Engineering 132
- Automotive Engineering 25
- Biomedical Engineering 71
Countries citing papers authored by M.B. Kleiner
This map shows the geographic impact of M.B. Kleiner's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M.B. Kleiner with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M.B. Kleiner more than expected).
Fields of papers citing papers by M.B. Kleiner
This network shows the impact of papers produced by M.B. Kleiner. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M.B. Kleiner. The network helps show where M.B. Kleiner may publish in the future.
Co-authors
The 25 scholars most cited alongside M.B. Kleiner, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 2 | |
| 2 | 2002 | 2 | |
| 3 | 2002 | 3 | |
| 4 | 2002 | 4 | |
| 5 | 2002 | 31 | |
| 6 | 2002 | 6 | |
| 7 | Vertically integrated circuits. A key technology for future high performance systems | 1997 | 1 |
| 8 | 1997 | 1 | |
| 9 | 1996 | 34 | |
| 10 | 1996 | 85 | |
| 11 | 1996 | 12 | |
| 12 | Performance Improvement of the Memory Hierarchy of RISC Systems by Applications of 3-D Technology. | 1995 | 1 |
| 13 | Thermal Conductivity of Thin Silicon Dioxide Films in Integrated Circuits | 1995 | 31 |
| 14 | 1995 | 23 | |
| 15 | 1995 | 122 | |
| 16 | 1995 | 49 |
About M.B. Kleiner
M.B. Kleiner is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering, Computer Networks and Communications, Signal Processing and Philosophy, having authored 16 papers that have together received 407 indexed citations. Recurring topics across this work include Parallel Computing and Optimization Techniques (5 papers), Interconnection Networks and Systems (4 papers), 3D IC and TSV technologies (4 papers), Advanced Memory and Neural Computing (3 papers), Low-power high-performance VLSI design (3 papers), Semiconductor materials and devices (3 papers), Heat Transfer and Optimization (2 papers) and CCD and CMOS Imaging Sensors (2 papers). The work is most often cited by research in Hardware and Architecture (40 citations), Electrical and Electronic Engineering (262 citations), Mechanical Engineering (132 citations), Automotive Engineering (25 citations) and Biomedical Engineering (71 citations). M.B. Kleiner has collaborated with scholars based in Germany and United States. Frequent co-authors include S.A. Kuhn, W. Weber, Peter Ramm, Werner Weber, R. Thewes, Johannes Weber, Jennifer Heath, G. Bronner, Thomas Vogelsang and Armin Klumpp. Their work appears in journals such as Journal of Systems Architecture, IEEE Transactions on Electron Devices, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, IEEE Transactions on Components Packaging and Manufacturing Technology Part A and Fraunhofer-Publica (Fraunhofer-Gesellschaft).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.