Joana Maria

3.5k total citations · 1 hit paper
22 papers, 2.9k citations indexed

About

Joana Maria is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Joana Maria has authored 22 papers receiving a total of 2.9k indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Electrical and Electronic Engineering, 11 papers in Biomedical Engineering and 5 papers in Automotive Engineering. Recurrent topics in Joana Maria's work include 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (8 papers) and Nanofabrication and Lithography Techniques (6 papers). Joana Maria is often cited by papers focused on 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (8 papers) and Nanofabrication and Lithography Techniques (6 papers). Joana Maria collaborates with scholars based in United States, India and Germany. Joana Maria's co-authors include Stephen K. Gray, Ralph G. Nuzzo, John A. Rogers, Matthew E. Stewart, Lucas B. Thompson, Christopher Anderton, John A. Rogers, Seokwoo Jeon, Paul Andry and R. Polastre and has published in prestigious journals such as Chemical Reviews, Advanced Materials and Angewandte Chemie International Edition.

In The Last Decade

Joana Maria

21 papers receiving 2.8k citations

Hit Papers

Nanostructured Plasmonic Sensors 2008 2026 2014 2020 2008 500 1000 1.5k 2.0k

Peers

Joana Maria
Yong-Kweon Kim South Korea
Jawad Naciri United States
Yun Ho Kim South Korea
Yi Xu China
Joana Maria
Citations per year, relative to Joana Maria Joana Maria (= 1×) peers Dominique Baillargeat

Countries citing papers authored by Joana Maria

Since Specialization
Citations

This map shows the geographic impact of Joana Maria's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Joana Maria with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Joana Maria more than expected).

Fields of papers citing papers by Joana Maria

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Joana Maria. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Joana Maria. The network helps show where Joana Maria may publish in the future.

Co-authorship network of co-authors of Joana Maria

This figure shows the co-authorship network connecting the top 25 collaborators of Joana Maria. A scholar is included among the top collaborators of Joana Maria based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Joana Maria. Joana Maria is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Maria, Joana, et al.. (2018). Triiodothyronine impregnated alginate/gelatin/polyvinyl alcohol composite scaffold designed for exudate-intensive wound therapy. European Polymer Journal. 110. 252–264. 27 indexed citations
2.
Schultz, Mark, C. Cabral, Cornelia Tsang, et al.. (2018). Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks. 97–102. 1 indexed citations
3.
Dang, Bing, S. L. Wright, Joana Maria, et al.. (2013). NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks. 1595–1599. 2 indexed citations
4.
Knickerbocker, John, Paul Andry, E. G. Colgan, et al.. (2012). 2.5D and 3D technology challenges and test vehicle demonstrations. 85 indexed citations
5.
Colgan, E. G., Paul Andry, B. Dang, et al.. (2012). Measurement of microbump thermal resistance in 3D chip stacks. 1–7. 20 indexed citations
6.
Wright, S. L., Cornelia Tsang, Joana Maria, et al.. (2012). Micro-interconnection reliability: Thermal, electrical and mechanical stress. 16 indexed citations
7.
Yao, Jimin, Matthew V. Schulmerich, Joana Maria, et al.. (2011). Soft Embossing of Nanoscale Optical and Plasmonic Structures in Glass. ACS Nano. 5(7). 5763–5774. 29 indexed citations
8.
Maria, Joana, B. Dang, S. L. Wright, et al.. (2011). 3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections. 268–273. 28 indexed citations
9.
Dang, Bing, Paul Andry, Cornelia Tsang, et al.. (2010). CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration. 1393–1398. 36 indexed citations
10.
Stewart, Matthew E., Jimin Yao, Joana Maria, et al.. (2009). Multispectral Thin Film Biosensing and Quantitative Imaging Using 3D Plasmonic Crystals. Analytical Chemistry. 81(15). 5980–5989. 36 indexed citations
11.
Maria, Joana, Tu T. Truong, Jimin Yao, et al.. (2009). Optimization of 3D Plasmonic Crystal Structures for Refractive Index Sensing. The Journal of Physical Chemistry C. 113(24). 10493–10499. 30 indexed citations
12.
Yao, Jimin, Matthew E. Stewart, Joana Maria, et al.. (2008). Seeing Molecules by Eye: Surface Plasmon Resonance Imaging at Visible Wavelengths with High Spatial Resolution and Submonolayer Sensitivity. Angewandte Chemie International Edition. 47(27). 5013–5017. 58 indexed citations
13.
Sakuma, Katsuyuki, Paul Andry, Cornelia Tsang, et al.. (2008). 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM Journal of Research and Development. 52(6). 611–622. 126 indexed citations
14.
Stewart, Matthew E., Christopher Anderton, Lucas B. Thompson, et al.. (2008). Nanostructured Plasmonic Sensors. Chemical Reviews. 108(2). 494–521. 2026 indexed citations breakdown →
15.
Yao, Jimin, Matthew E. Stewart, Joana Maria, et al.. (2008). Seeing Molecules by Eye: Surface Plasmon Resonance Imaging at Visible Wavelengths with High Spatial Resolution and Submonolayer Sensitivity. Angewandte Chemie. 120(27). 5091–5095. 1 indexed citations
16.
Sakuma, Katsuyuki, Paul Andry, B. Dang, et al.. (2007). 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections. 627–632. 70 indexed citations
17.
Truong, Tu T., Rongsheng Lin, Seokwoo Jeon, et al.. (2007). Soft Lithography Using Acryloxy Perfluoropolyether Composite Stamps. Langmuir. 23(5). 2898–2905. 114 indexed citations
18.
Jeon, Seokwoo, et al.. (2005). Soft‐Contact Optical Lithography Using Transparent Elastomeric Stamps and Application to Nanopatterned Organic Light‐Emitting Devices. Advanced Functional Materials. 15(9). 1435–1439. 49 indexed citations
19.
Maria, Joana, Seokwoo Jeon, & John A. Rogers. (2004). Nanopatterning with conformable phase masks. Journal of Photochemistry and Photobiology A Chemistry. 166(1-3). 149–154. 25 indexed citations
20.
Jeon, Seokwoo, Etienne Menard, Jang‐Ung Park, et al.. (2004). Three‐Dimensional Nanofabrication with Rubber Stamps and Conformable Photomasks. Advanced Materials. 16(15). 1369–1373. 103 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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