Boon Long Lau

688 total citations
60 papers, 508 citations indexed

About

Boon Long Lau is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Boon Long Lau has authored 60 papers receiving a total of 508 indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 31 papers in Mechanical Engineering and 7 papers in Biomedical Engineering. Recurrent topics in Boon Long Lau's work include Heat Transfer and Optimization (28 papers), 3D IC and TSV technologies (24 papers) and Electronic Packaging and Soldering Technologies (21 papers). Boon Long Lau is often cited by papers focused on Heat Transfer and Optimization (28 papers), 3D IC and TSV technologies (24 papers) and Electronic Packaging and Soldering Technologies (21 papers). Boon Long Lau collaborates with scholars based in Singapore, United Kingdom and Germany. Boon Long Lau's co-authors include Xiaowu Zhang, Yong Han, Gongyue Tang, Yoke Choy Leong, Hengyun Zhang, Sharon Xiaodai Lim, Xiaobai Wang, Songlin Liu, Yosephine Andriani and Liang Ding and has published in prestigious journals such as Journal of Lightwave Technology, IEEE Electron Device Letters and IEEE Transactions on Components Packaging and Manufacturing Technology.

In The Last Decade

Boon Long Lau

56 papers receiving 495 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Boon Long Lau Singapore 12 290 262 75 61 58 60 508
J. Wakil United States 11 348 1.2× 376 1.4× 117 1.6× 47 0.8× 76 1.3× 21 694
Sung Joo Hong South Korea 13 242 0.8× 196 0.7× 67 0.9× 41 0.7× 53 0.9× 39 488
Siva P. Gurrum United States 9 157 0.5× 158 0.6× 111 1.5× 37 0.6× 44 0.8× 34 364
Vadim Gektin United States 9 230 0.8× 211 0.8× 72 1.0× 30 0.5× 39 0.7× 28 413
Hilton Toy United States 6 268 0.9× 121 0.5× 46 0.6× 33 0.5× 41 0.7× 9 346
K.E. Goodson United States 10 211 0.7× 112 0.4× 124 1.7× 73 1.2× 84 1.4× 25 397
R. J. Bezama United States 7 482 1.7× 129 0.5× 54 0.7× 90 1.5× 67 1.2× 10 547
Navas Khan Singapore 15 157 0.5× 545 2.1× 38 0.5× 49 0.8× 132 2.3× 46 666
Jae-Mo Koo United States 13 587 2.0× 262 1.0× 60 0.8× 201 3.3× 260 4.5× 21 845
Dimeji Ibitayo United States 14 224 0.8× 326 1.2× 91 1.2× 11 0.2× 22 0.4× 34 461

Countries citing papers authored by Boon Long Lau

Since Specialization
Citations

This map shows the geographic impact of Boon Long Lau's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Boon Long Lau with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Boon Long Lau more than expected).

Fields of papers citing papers by Boon Long Lau

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Boon Long Lau. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Boon Long Lau. The network helps show where Boon Long Lau may publish in the future.

Co-authorship network of co-authors of Boon Long Lau

This figure shows the co-authorship network connecting the top 25 collaborators of Boon Long Lau. A scholar is included among the top collaborators of Boon Long Lau based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Boon Long Lau. Boon Long Lau is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Feng, Huicheng, Gongyue Tang, Xiaowu Zhang, et al.. (2024). Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(3). 397–405. 8 indexed citations
2.
Zhang, Xiaowu, Gongyue Tang, Boon Long Lau, et al.. (2024). Embedded Backside Cooling Solution for Two Stacked High-Power Chips. 1156–1161.
3.
Gourikutty, Sajay Bhuvanendran Nair, Jiaqi Wu, Teck Guan Lim, et al.. (2024). 1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics. Journal of Lightwave Technology. 43(4). 1979–1986. 1 indexed citations
4.
Feng, Huicheng, Gongyue Tang, Xiaowu Zhang, et al.. (2023). Development of Crossflow Manifold for Two-Phase Liquid Cooling of 3D ICs via 3D Printing. 1012–1016. 5 indexed citations
5.
6.
Andriani, Yosephine, Xiaobai Wang, Debbie Hwee Leng Seng, et al.. (2020). Effect of Boron Nitride Nanosheets on Properties of a Commercial Epoxy Molding Compound Used in Fan-Out Wafer-Level Packaging. IEEE Transactions on Components Packaging and Manufacturing Technology. 10(6). 990–999. 9 indexed citations
7.
Chen, Zhaohui, Xiaowu Zhang, Boon Long Lau, et al.. (2018). Package Level Warpage Simulation of Fan-out Wafer Level Package (FOWLP) Considering Viscoelastic Material Properties. 836–842. 8 indexed citations
8.
Han, Yong, et al.. (2017). Package-Level Si Micro-Fluid Cooler with Enhanced Jet Array for High Performance 3D Systems. 4. 1654–1659. 1 indexed citations
9.
10.
Ho, Soon Wee, et al.. (2016). Laser de-bonding process development of glass substrate for Fan-out wafer level packaging. 43–46. 8 indexed citations
11.
Han, Yong, et al.. (2016). Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(1). 50–57. 24 indexed citations
12.
13.
Han, Yong, Boon Long Lau, Gongyue Tang, & Xiaowu Zhang. (2015). Micro-channel heat sink with multiple interactive pressure-driven or electro-osmotic flows. 129. 1–5. 3 indexed citations
14.
Han, Yong, Boon Long Lau, Gongyue Tang, & Xiaowu Zhang. (2015). Heat dissipation improvement with diamond heat spreader on hybrid Si micro-cooler for GaN devices. 603–606. 4 indexed citations
15.
Han, Yong, Boon Long Lau, Gongyue Tang, & Xiaowu Zhang. (2015). Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(12). 1740–1746. 35 indexed citations
16.
Han, Yong, et al.. (2015). Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package. IEEE Design and Test. 32(4). 32–39. 4 indexed citations
17.
Choi, Jae Woong, et al.. (2014). TSV Cu Filling Failure Modes and Mechanisms Causing the Failures. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(4). 581–587. 26 indexed citations
18.
Han, Yong, et al.. (2014). Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(6). 983–990. 41 indexed citations
19.
Han, Yong, Boon Long Lau, Hengyun Zhang, & Xiaowu Zhang. (2014). Package-level Si-based micro-jet impingement cooling solution with multiple drainage micro-trenches. 330–334. 21 indexed citations
20.
Lau, Boon Long, et al.. (2013). Development of package level hybrid silicon heat sink for hotspots cooling. 32. 741–746. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026