Cheng‐Chieh Hsieh

700 total citations
13 papers, 516 citations indexed

About

Cheng‐Chieh Hsieh is a scholar working on Electrical and Electronic Engineering, Computational Mechanics and Mechanical Engineering. According to data from OpenAlex, Cheng‐Chieh Hsieh has authored 13 papers receiving a total of 516 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 3 papers in Computational Mechanics and 3 papers in Mechanical Engineering. Recurrent topics in Cheng‐Chieh Hsieh's work include Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Heat Transfer and Optimization (2 papers). Cheng‐Chieh Hsieh is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Heat Transfer and Optimization (2 papers). Cheng‐Chieh Hsieh collaborates with scholars based in Taiwan, United States and Canada. Cheng‐Chieh Hsieh's co-authors include Shi‐Chune Yao, Cristina H. Amon, S. C. Yao, Jayathi Y. Murthy, Sreekant Narumanchi, Yousef Alyousef, Gary K. Fedder, Douglas Yu, Shin-Puu Jeng and Chewn-Pu Jou and has published in prestigious journals such as International Journal of Heat and Mass Transfer, Energy and Experimental Thermal and Fluid Science.

In The Last Decade

Cheng‐Chieh Hsieh

12 papers receiving 485 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Cheng‐Chieh Hsieh Taiwan	6	311	177	152	82	80	13	516
Andrew Stillwell United States	13	713 2.3×	172 1.0×	51 0.3×	43 0.5×	43 0.5×	30	911
Jae-Mo Koo United States	13	262 0.8×	587 3.3×	201 1.3×	260 3.2×	39 0.5×	21	845
Gilhwan Cha United States	10	120 0.4×	173 1.0×	53 0.3×	108 1.3×	30 0.4×	12	345
Doosan Back United States	6	133 0.4×	504 2.8×	95 0.6×	86 1.0×	43 0.5×	7	642
Gerd Schlottig Switzerland	13	378 1.2×	356 2.0×	58 0.4×	99 1.2×	17 0.2×	58	684
Yoshinori Hamamoto Japan	13	196 0.6×	457 2.6×	185 1.2×	161 2.0×	54 0.7×	49	706
Stephan M. Senn Switzerland	9	194 0.6×	299 1.7×	78 0.5×	141 1.7×	166 2.1×	13	563
U. Kloter Switzerland	10	205 0.7×	592 3.3×	182 1.2×	90 1.1×	17 0.2×	13	722
Michael D. Sinanis United States	10	212 0.7×	507 2.9×	96 0.6×	92 1.1×	38 0.5×	29	722
R. J. Bezama United States	7	129 0.4×	482 2.7×	90 0.6×	67 0.8×	35 0.4×	10	547

Countries citing papers authored by Cheng‐Chieh Hsieh

Since Specialization

Citations

This map shows the geographic impact of Cheng‐Chieh Hsieh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cheng‐Chieh Hsieh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cheng‐Chieh Hsieh more than expected).

Fields of papers citing papers by Cheng‐Chieh Hsieh

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Cheng‐Chieh Hsieh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cheng‐Chieh Hsieh. The network helps show where Cheng‐Chieh Hsieh may publish in the future.

Co-authorship network of co-authors of Cheng‐Chieh Hsieh

This figure shows the co-authorship network connecting the top 25 collaborators of Cheng‐Chieh Hsieh. A scholar is included among the top collaborators of Cheng‐Chieh Hsieh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Cheng‐Chieh Hsieh. Cheng‐Chieh Hsieh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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13 of 13 papers shown

Hsieh, Cheng‐Chieh, Siyu Chen, Siyu Chen, et al.. (2025). Disability‐Adjusted Life Years ( DALYs ) due to Breast, Cervical, Colorectal and Oral Cancers in Taiwan Regions. Cancer Medicine. 14(1). e70592–e70592.

Hsieh, Cheng‐Chieh, et al.. (2025). Direct-to-Silicon Liquid Cooling Integrated on Cowos ^® Platform. 743–747. 2 indexed citations

Hsieh, Cheng‐Chieh, et al.. (2024). An Energy-efficient Si-integrated Micro-cooler for High Power and Power-density Computing Applications. 1025–1029. 3 indexed citations

Chen, Chih‐Yuan, Cheng‐Chieh Hsieh, Jason Wu, et al.. (2023). A Thermally Friendly Bonding Scheme for 3D System Integration. 1973–1976. 4 indexed citations

Wang, Chin-Liang & Cheng‐Chieh Hsieh. (2022). Joint Fine Time Synchronization and Channel Estimation Using Deep Learning for Wireless Communication Systems. 2022 IEEE 95th Vehicular Technology Conference: (VTC2022-Spring). 1–6. 1 indexed citations

Hsieh, Cheng‐Chieh, et al.. (2016). Analysis and Comparison of Thermal Performance of Advanced Packaging Technologies for State-of-the-Art Mobile Applications. 1430–1438. 18 indexed citations

Banijamali, Bahareh, Cheng‐Chieh Hsieh, Suresh Ramalingam, et al.. (2013). Reliability evaluation of a CoWoS-enabled 3D IC package. 35–40. 40 indexed citations

Kuo, Feng-Wei, Cheng‐Chieh Hsieh, Tzu-Jin Yeh, et al.. (2012). High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration. 14.1.1–14.1.4. 101 indexed citations

Hsieh, Cheng‐Chieh & Shi‐Chune Yao. (2005). Evaporative heat transfer characteristics of a water spray on micro-structured silicon surfaces. International Journal of Heat and Mass Transfer. 49(5-6). 962–974. 133 indexed citations

10.

Yao, Shi‐Chune, et al.. (2005). Micro-electro-mechanical systems (MEMS)-based micro-scale direct methanol fuel cell development. Energy. 31(5). 636–649. 113 indexed citations

11.

Fedder, Gary K., et al.. (2004). Thermo-Fluids Considerations in the Development of a Silicon-based Micro-scale Direct Methanol Fuel Cell. 171–180. 2 indexed citations

12.

Hsieh, Cheng‐Chieh & Shi‐Chune Yao. (2002). Heat transfer of water sprays on enhanced silicon surfaces. Proceeding of International Heat Transfer Conference 12. 2 indexed citations

13.

Amon, Cristina H., et al.. (2001). MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics. Experimental Thermal and Fluid Science. 25(5). 231–242. 97 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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