Michael Gaynes

1.7k total citations
60 papers, 1.4k citations indexed

About

Michael Gaynes is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Michael Gaynes has authored 60 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 39 papers in Electrical and Electronic Engineering, 30 papers in Mechanical Engineering and 13 papers in Mechanics of Materials. Recurrent topics in Michael Gaynes's work include Heat Transfer and Optimization (24 papers), Electronic Packaging and Soldering Technologies (24 papers) and 3D IC and TSV technologies (21 papers). Michael Gaynes is often cited by papers focused on Heat Transfer and Optimization (24 papers), Electronic Packaging and Soldering Technologies (24 papers) and 3D IC and TSV technologies (21 papers). Michael Gaynes collaborates with scholars based in United States, Switzerland and Japan. Michael Gaynes's co-authors include Timothy Chainer, Mark Schultz, Pritish R. Parida, Roger Schmidt, E. G. Colgan, R. Polastre, N. LaBianca, J. H. Magerlein, B. K. Furman and R. J. Bezama and has published in prestigious journals such as Applied Physics Letters, Journal of Heat Transfer and IBM Journal of Research and Development.

In The Last Decade

Michael Gaynes

58 papers receiving 1.3k citations

Peers

Countries citing papers authored by Michael Gaynes

Since Specialization

Citations

This map shows the geographic impact of Michael Gaynes's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael Gaynes with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael Gaynes more than expected).

Fields of papers citing papers by Michael Gaynes

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Michael Gaynes. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael Gaynes. The network helps show where Michael Gaynes may publish in the future.

Co-authorship network of co-authors of Michael Gaynes

This figure shows the co-authorship network connecting the top 25 collaborators of Michael Gaynes. A scholar is included among the top collaborators of Michael Gaynes based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Michael Gaynes. Michael Gaynes is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Eulerian multiphase conjugate model for embedded two-phase liquid cooled microprocessor 2018 ·Pritish R. Parida, Mark Schultz, (unknown), Fanghao Yang, Michael Gaynes, Arvind Sridhar, Gerard McVicker, Thomas Brunschwiler, Timothy Chainer	3
2	Using electrical capacitance and mechanically representative hardware to evaluate the thermal mechanical stability of thermal interface materials 2018 ·(unknown), (unknown), Michael Gaynes	1
3	Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices 2017 ·Pritish R. Parida, Arvind Sridhar, Mark Schultz, Fanghao Yang, Michael Gaynes, E. G. Colgan, Bing Dang, Gerard McVicker, Thomas Brunschwiler, John Knickerbocker, Timothy Chainer	10
4	Thermal model for embedded two-phase liquid cooled microprocessor 2017 ·Pritish R. Parida, Arvind Sridhar, Augusto Vega, Mark Schultz, Michael Gaynes, (unknown), Gerard McVicker, Thomas Brunschwiler, Alper Buyuktosunoglu, Timothy Chainer	14
5	Experimental investigation of water cooled server microprocessors and memory devices in an energy efficient chiller-less data center 2012 ·Pritish R. Parida, Milnes P. David, Madhusudan Iyengar, Mark Schultz, Michael Gaynes, Vinod Kamath, (unknown), Timothy Chainer	28
6	Experimental characterization of an energy efficient chiller-less data center test facility with warm water cooled servers 2012 ·Milnes P. David, Madhusudan Iyengar, Pritish R. Parida, Robert E. Simons, Mark Schultz, Michael Gaynes, Roger Schmidt, Timothy Chainer	45
7	Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates 2012 ·Jae-Woong Nah, Michael Gaynes, E Perfecto, Claudius Feger	9
8	High-efficiency thin-film InGaP/InGaAs/Ge tandem solar cells enabled by controlled spalling technology 2012 ·Applied Physics Letters ·Davood Shahrjerdi, Stephen W. Bedell, Chris Ebert, C. Bayram, Bahman Hekmatshoar, Keith Fogel, Paul Lauro, Michael Gaynes, Tayfun Gokmen, J. A. Ott, D. K. Sadana	83
9	Impact of operating conditions on a chiller-less data center test facility with liquid cooled servers 2012 ·Milnes P. David, Madhusudan Iyengar, Pritish R. Parida, Robert E. Simons, Mark Schultz, Michael Gaynes, Roger Schmidt, Timothy Chainer	19
10	Vacuum underfill technology for advanced packaging 2011 ·(unknown), (unknown), Michael Gaynes, C. Feger, Katsuyuki Sakuma, John Knickerbocker, Yasumitsu Orii, (unknown), Masahiro Hasegawa, Toshiyuki Sato, (unknown), Osamu Suzuki, (unknown), (unknown), (unknown), Koji Ishikawa, (unknown)	3
11	Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging 2011 ·Jae-Woong Nah, Michael Gaynes, Claudius Feger, (unknown), Hiroshi Suzuki	27
12	Using In situ Capacitance Measurements to Monitor the Stability of Thermal Interface Materials in Complex PCB Assemblies 2010 ·IMAPSource Proceedings ·Michael Gaynes, Timothy Chainer, E. J. Yarmchuk, (unknown), David L. Edwards, (unknown), (unknown)	1
13	The over-bump applied resin wafer-level underfill process: Process, material and reliability 2009 ·Claudius Feger, N. LaBianca, Michael Gaynes, S.E. Steen, Zhen Liu, (unknown), Mark Francis	29
14	A Practical Implementation of Silicon Microchannel Coolers for High Power Chips 2007 ·IEEE Transactions on Components and Packaging Technologies ·E. G. Colgan, B. K. Furman, Michael Gaynes, (unknown), N. LaBianca, J. H. Magerlein, R. Polastre, Mary Beth Rothwell, R. J. Bezama, (unknown), (unknown), Hilton Toy, J. Wakil, Jeffrey A. Zitz, Roger Schmidt	197
15	Thermal Development, Modeling and Characterization of the Cell Processor Module 2006 ·J. Wakil, (unknown), Michael Gaynes, Hendrik F. Hamann, Alan J. Weger, (unknown), Paul Harvey, E. J. Yarmchuk, (unknown)	3
16	A study of the thermal characteristics of a conductive adhesive chip attach process 2002 ·Sanjeev B. Sathe, (unknown), (unknown), Michael Gaynes	2
17	Double sided flexible carrier with discretes and thermally enhanced FCA/COF 2002 ·(unknown), Michael Gaynes, (unknown)	2
18	Analysis And Characterization Of Electrically Conductive Adhesives 1996 ·MRS Proceedings ·Michael Gaynes, L. J. Matienzo, Jeffrey A. Zimmerman, (unknown)	6
19	Evaluation of contact resistance for isotropic electrically conductive adhesives 1995 ·IEEE Transactions on Components Packaging and Manufacturing Technology Part B ·Michael Gaynes, (unknown), Ravi F. Saraf, J.M. Roldan	53
20	Electrical contact failure mechanisms relevant to electronic packages 1991 ·(unknown), Michael Gaynes, (unknown), (unknown)	12

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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