Jeffrey A. Zitz

536 total citations
10 papers, 324 citations indexed

About

Jeffrey A. Zitz is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Computer Networks and Communications. According to data from OpenAlex, Jeffrey A. Zitz has authored 10 papers receiving a total of 324 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 1 paper in Computer Networks and Communications. Recurrent topics in Jeffrey A. Zitz's work include Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Heat Transfer and Optimization (4 papers). Jeffrey A. Zitz is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Heat Transfer and Optimization (4 papers). Jeffrey A. Zitz collaborates with scholars based in United States, Austria and Japan. Jeffrey A. Zitz's co-authors include R. Polastre, Hilton Toy, Mary Beth Rothwell, E. G. Colgan, R. J. Bezama, J. Wakil, Roger Schmidt, J. H. Magerlein, N. LaBianca and B. K. Furman and has published in prestigious journals such as Materials & Design and IEEE Transactions on Components and Packaging Technologies.

In The Last Decade

Jeffrey A. Zitz

9 papers receiving 318 citations

Peers

Countries citing papers authored by Jeffrey A. Zitz

Since Specialization

Citations

This map shows the geographic impact of Jeffrey A. Zitz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jeffrey A. Zitz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jeffrey A. Zitz more than expected).

Fields of papers citing papers by Jeffrey A. Zitz

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jeffrey A. Zitz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jeffrey A. Zitz. The network helps show where Jeffrey A. Zitz may publish in the future.

Co-authorship network of co-authors of Jeffrey A. Zitz

This figure shows the co-authorship network connecting the top 25 collaborators of Jeffrey A. Zitz. A scholar is included among the top collaborators of Jeffrey A. Zitz based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jeffrey A. Zitz. Jeffrey A. Zitz is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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10 of 10 papers shown

#	Work	Indexed citations
1	Explainable machine learning and feature engineering applied to nanoindentation data 2025 ·Materials & Design ·(unknown), (unknown), (unknown), (unknown), Jeffrey A. Zitz, Thomas Klünsner, Harald Leitner, Lukas Exl, Megan J. Cordill	3
2	A systematic experimental investigation of thermal degradation mechanisms in lidded flip-chip packages: Effects of thermal aging and cyclic loading 2017 ·Tuhin Sinha, Jeffrey A. Zitz	0
3	Thermal-mechanical Co-design of Cold Plate, Second Level Thermal Interface Material (TIM2) and Heat Spreaders for Optimal Thermal Performance for High-end Processor Cooling 2016 ·Xuan Wei, (unknown), (unknown), Yishuang Yu, (unknown), Peter Kelly, (unknown), (unknown), Jeffrey A. Zitz, Kamal Sikka	5
4	Chip Package Interaction: An Experiment Study on White Bump Mitigation Using Flat Laminates 2014 ·(unknown), Jeffrey A. Zitz, (unknown), Kamal Sikka	1
5	Bonding technologies for chip level and wafer level 3D integration 2014 ·Katsuyuki Sakuma, Spyridon Skordas, Jeffrey A. Zitz, E Perfecto, (unknown), (unknown), Richard N. Langlois, (unknown), (unknown), Wei‐Hung Lin, (unknown), Sayuri Kohara, (unknown), M. Angyal, (unknown), Daniel S. Berger, John Knickerbocker, Subramanian S. Iyer	7
6	Thermal and mechanical analysis and design of the IBM Power 775 water cooled supercomputing central electronics complex 2012 ·(unknown), (unknown), (unknown), Michael Ellsworth, (unknown), Arvind Kumar Sinha, Jeffrey A. Zitz	10
7	A Practical Implementation of Silicon Microchannel Coolers for High Power Chips 2007 ·IEEE Transactions on Components and Packaging Technologies ·E. G. Colgan, B. K. Furman, Michael Gaynes, (unknown), N. LaBianca, J. H. Magerlein, R. Polastre, Mary Beth Rothwell, R. J. Bezama, (unknown), (unknown), Hilton Toy, J. Wakil, Jeffrey A. Zitz, Roger Schmidt	197
8	A practical implementation of silicon microchannel coolers for high power chips 2005 ·E. G. Colgan, B. K. Furman, Michael Gaynes, Wendy Graham, N. LaBianca, J. H. Magerlein, R. Polastre, Mary Beth Rothwell, R. J. Bezama, (unknown), (unknown), Hilton Toy, J. Wakil, Jeffrey A. Zitz, Roger Schmidt	87
9	Internal Thermal Management of IBM P-Server Large Format Multi-Chip Modules Utilizing Small Gap Technology 2005 ·(unknown), Gaetano Messina, (unknown), Jeffrey A. Zitz, Wei Zou	4
10	Immersion cooling of a multichip module by pool boiling of FC-86. 1993 ·Jeffrey A. Zitz, Arthur E. Bergles	10

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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