M. Scheuermann

1.8k total citations
47 papers, 964 citations indexed

About

M. Scheuermann is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, M. Scheuermann has authored 47 papers receiving a total of 964 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 21 papers in Condensed Matter Physics and 17 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in M. Scheuermann's work include Physics of Superconductivity and Magnetism (21 papers), 3D IC and TSV technologies (11 papers) and Quantum and electron transport phenomena (9 papers). M. Scheuermann is often cited by papers focused on Physics of Superconductivity and Magnetism (21 papers), 3D IC and TSV technologies (11 papers) and Quantum and electron transport phenomena (9 papers). M. Scheuermann collaborates with scholars based in United States, Germany and Denmark. M. Scheuermann's co-authors include C. C. Tsuei, Modest M. Oprysko, J. Mannhart, P. Chaudhari, Junhong Chi, D. Dimos, R. H. Koch, James R. Lhota, P. K. Kuo and J. T. Chen and has published in prestigious journals such as Nature, Physical Review Letters and Physical review. B, Condensed matter.

In The Last Decade

M. Scheuermann

43 papers receiving 912 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
M. Scheuermann United States 15 670 412 301 279 123 47 964
G. Kunkel Germany 10 1.0k 1.6× 581 1.4× 428 1.4× 491 1.8× 214 1.7× 25 1.3k
E. Sarnelli Italy 16 741 1.1× 411 1.0× 169 0.6× 391 1.4× 94 0.8× 96 937
Gin-ichiro Oya Japan 13 458 0.7× 258 0.6× 188 0.6× 224 0.8× 145 1.2× 66 676
Y. Bruynseraede Belgium 19 910 1.4× 771 1.9× 134 0.4× 341 1.2× 195 1.6× 81 1.2k
Z. G. Ivanov Sweden 21 1.1k 1.6× 609 1.5× 371 1.2× 495 1.8× 459 3.7× 171 1.5k
V. Mosser France 18 366 0.5× 817 2.0× 673 2.2× 198 0.7× 255 2.1× 72 1.3k
V. Jeudy France 17 500 0.7× 740 1.8× 178 0.6× 403 1.4× 227 1.8× 74 924
K. Schlenga Germany 14 535 0.8× 273 0.7× 122 0.4× 254 0.9× 77 0.6× 30 679
J. Kircher Germany 19 534 0.8× 372 0.9× 390 1.3× 256 0.9× 289 2.3× 37 1.1k
T. Dahm Germany 21 1.2k 1.8× 519 1.3× 232 0.8× 564 2.0× 114 0.9× 70 1.5k

Countries citing papers authored by M. Scheuermann

Since Specialization
Citations

This map shows the geographic impact of M. Scheuermann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Scheuermann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Scheuermann more than expected).

Fields of papers citing papers by M. Scheuermann

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Scheuermann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Scheuermann. The network helps show where M. Scheuermann may publish in the future.

Co-authorship network of co-authors of M. Scheuermann

This figure shows the co-authorship network connecting the top 25 collaborators of M. Scheuermann. A scholar is included among the top collaborators of M. Scheuermann based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Scheuermann. M. Scheuermann is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Defila, Rico, Antonietta Di Giulio, & M. Scheuermann. (2022). Forschungsverbundmanagement.
2.
Scheuermann, M., Shurong Tian, R. P. Robertazzi, et al.. (2016). Thermal analysis of multi-layer functional 3D logic stacks. 1–4. 7 indexed citations
3.
Defila, Rico, Antonietta Di Giulio, & M. Scheuermann. (2015). Managementverantwortliche inter- und transdisziplinärer Verbünde – Rollen, Kompetenzen, Karrieren. edoc (University of Basel). 2 indexed citations
4.
Defila, Rico, Antonietta Di Giulio, & M. Scheuermann. (2015). Managementverantwortliche inter- und transdisziplinärer Verbünde – Rollen, Kompetenzen, Karrieren: Einführung in das Schwerpunktheft "Managementverantwortliche inter- und transdisziplinärer Verbünde = Managers of inter- and transdisciplinary research groups". 1 indexed citations
5.
Zhao, Xin, Yang Wan, M. Scheuermann, & Sung Kyu Lim. (2013). Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs. 363–370. 19 indexed citations
6.
Zhao, Xin, M. Scheuermann, & Sung Kyu Lim. (2013). Analysis and Modeling of DC Current Crowding for TSV-Based 3-D Connections and Power Integrity. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(1). 123–133. 11 indexed citations
7.
Xu, Zheng, Xiaoxiong Gu, M. Scheuermann, et al.. (2012). Modeling of power delivery into 3D chips on silicon interposer. 683–689. 15 indexed citations
8.
Goren, D., Danny Elad, M. Scheuermann, et al.. (2011). Design and Modeling Methodology of Vertical Interconnects for 3DI Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(2). 163–167. 8 indexed citations
9.
Giulio, Antonietta Di, Rico Defila, & M. Scheuermann. (2008). Das Management von Forschungsverbünden. Eine anspruchsvolle wissenschaftliche Tätigkeit. Bern Open Repository and Information System (University of Bern). 1 indexed citations
10.
Jiang, Lijun, Seshadri Kolluri, E. G. Colgan, et al.. (2008). Thermal modeling of on-chip interconnects and 3D packaging using EM tools. The HKU Scholars Hub (University of Hong Kong). 19. 279–282. 11 indexed citations
11.
Bassous, E., M. Scheuermann, V. P. Kesan, et al.. (2002). A high-speed silicon metal-semiconductor-metal photodetector fully integrable with (Bi)CMOS circuits. 7. 187–190. 2 indexed citations
12.
Deutsch, A., et al.. (1993). Characterization of resistive transmission lines to 70 GHz with ultrafast optoelectronics. IEEE Microwave and Guided Wave Letters. 3(3). 75–77. 9 indexed citations
13.
Huebener, R. P., F. Kober, H.-C. Ri, et al.. (1991). Seebeck and Nernst effect in the mixed state of slightly oxygen deficient YBaCuO. Physica C Superconductivity. 181(4-6). 345–354. 25 indexed citations
14.
Scheuermann, M., et al.. (1989). Ultra-High Bandwidth Detachable Optoelectronic Probes. HSMT22–HSMT22. 7 indexed citations
15.
Koch, R. H., C. P. Umbach, Modest M. Oprysko, et al.. (1988). DC Sqiids made from YBa2Cu3Oy. Physica C Superconductivity. 153-155. 1685–1689. 14 indexed citations
16.
Davidson, A., A. Palevski, Michael Brady, et al.. (1988). I n s i t u resistance of Y1Ba2Cu3Ox films during anneal. Applied Physics Letters. 52(2). 157–159. 18 indexed citations
17.
Tsuei, C. C., et al.. (1987). Formation of thin film YBaCuO Superconductors from Cu/BaO/Y2O3 Layer Structures. MRS Proceedings. 99. 1 indexed citations
18.
Scheuermann, M., et al.. (1986). Simulations of fine structures on the zero field steps of Josephson tunnel junctions. Applied Physics Letters. 48(2). 189–191. 8 indexed citations
19.
Tang, D.D., et al.. (1986). Minority carrier transport in silicon. 20–23. 5 indexed citations
20.
Scheuermann, M., et al.. (1983). Interaction between microwaves and a single vortex in a long Josephson tunnel junction. Journal of Applied Physics. 54(6). 3286–3290. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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