Gongyue Tang

1.2k total citations
69 papers, 907 citations indexed

About

Gongyue Tang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Gongyue Tang has authored 69 papers receiving a total of 907 indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 36 papers in Mechanical Engineering and 10 papers in Biomedical Engineering. Recurrent topics in Gongyue Tang's work include Heat Transfer and Optimization (32 papers), Silicon Carbide Semiconductor Technologies (24 papers) and Heat Transfer and Boiling Studies (20 papers). Gongyue Tang is often cited by papers focused on Heat Transfer and Optimization (32 papers), Silicon Carbide Semiconductor Technologies (24 papers) and Heat Transfer and Boiling Studies (20 papers). Gongyue Tang collaborates with scholars based in Singapore, United States and United Kingdom. Gongyue Tang's co-authors include Chun Yang, Hongren Gong, Xiaowu Zhang, John C. Chai, Yong Han, Boon Long Lau, Yee Cheong Lam, Deguang Yan, Haiqing Gong and Tai Chong Chai and has published in prestigious journals such as Langmuir, Nanoscale and International Journal of Heat and Mass Transfer.

In The Last Decade

Gongyue Tang

59 papers receiving 884 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Gongyue Tang Singapore 15 499 441 280 95 46 69 907
Bernd Michel Germany 14 136 0.3× 519 1.2× 191 0.7× 17 0.2× 96 2.1× 90 708
D.W. Berning United States 23 176 0.4× 1.5k 3.3× 144 0.5× 10 0.1× 86 1.9× 73 1.6k
W.D. Greason Canada 16 178 0.4× 603 1.4× 86 0.3× 63 0.7× 183 4.0× 89 813
Jiwoo Hong South Korea 16 273 0.5× 383 0.9× 182 0.7× 92 1.0× 35 0.8× 43 595
Ibraheem Haneef United Kingdom 15 294 0.6× 364 0.8× 61 0.2× 35 0.4× 128 2.8× 33 583
A. Katsuki Japan 12 223 0.4× 569 1.3× 191 0.7× 23 0.2× 96 2.1× 69 753
Shaowei Zhu China 14 162 0.3× 164 0.4× 638 2.3× 255 2.7× 134 2.9× 46 897
J. Wakil United States 11 76 0.2× 376 0.9× 348 1.2× 47 0.5× 117 2.5× 21 694
Jaisuk Yoo South Korea 9 315 0.6× 66 0.1× 363 1.3× 137 1.4× 76 1.7× 29 592

Countries citing papers authored by Gongyue Tang

Since Specialization
Citations

This map shows the geographic impact of Gongyue Tang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Gongyue Tang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Gongyue Tang more than expected).

Fields of papers citing papers by Gongyue Tang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Gongyue Tang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Gongyue Tang. The network helps show where Gongyue Tang may publish in the future.

Co-authorship network of co-authors of Gongyue Tang

This figure shows the co-authorship network connecting the top 25 collaborators of Gongyue Tang. A scholar is included among the top collaborators of Gongyue Tang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Gongyue Tang. Gongyue Tang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Feng, Huicheng, Gongyue Tang, & Xiaowu Zhang. (2025). Investigation of coolant-dependent thermal performance in backside-embedded micro-pin fin arrays for high-power microelectronics cooling. International Journal of Thermal Sciences. 220. 110273–110273.
2.
Feng, Huicheng, et al.. (2025). Thermal Characterization of HBMs Integrated via Hybrid Bonding. 1621–1627. 1 indexed citations
3.
4.
Feng, Huicheng, Gongyue Tang, Xiaowu Zhang, et al.. (2024). Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(3). 397–405. 8 indexed citations
5.
Zhang, Xiaowu, Gongyue Tang, Boon Long Lau, et al.. (2024). Embedded Backside Cooling Solution for Two Stacked High-Power Chips. 1156–1161.
6.
Feng, Huicheng, et al.. (2024). Thermal Design and Analysis of a Flip-Chip GaN-on-SiC HEMT. 1208–1213.
7.
Tang, Gongyue, et al.. (2023). Development and Demonstration of a Novel Immersion Two Phase Cooling High Power SiC Power Module. 1553–1558. 4 indexed citations
8.
Feng, Huicheng, Gongyue Tang, Xiaowu Zhang, et al.. (2023). Development of Crossflow Manifold for Two-Phase Liquid Cooling of 3D ICs via 3D Printing. 1012–1016. 5 indexed citations
9.
Tang, Gongyue, et al.. (2022). Static/Transient Thermal Analysis and Design Optimization of a Lead Frame Based Dual Side Cooling SiC Power Module. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 554–560. 3 indexed citations
10.
Tang, Gongyue, et al.. (2021). Thermal design and analysis for double side cooling 6-in-1 SiC power module. 17. 508–512. 1 indexed citations
11.
12.
Tang, Gongyue, et al.. (2019). Thermal Analysis and Material Selection of the SiC Based Intelligent Power Package. 479–484. 1 indexed citations
13.
Han, Yong, et al.. (2017). Package-Level Si Micro-Fluid Cooler with Enhanced Jet Array for High Performance 3D Systems. 4. 1654–1659. 1 indexed citations
14.
Han, Yong, et al.. (2016). Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(1). 50–57. 24 indexed citations
15.
Han, Yong, Boon Long Lau, Gongyue Tang, & Xiaowu Zhang. (2015). Micro-channel heat sink with multiple interactive pressure-driven or electro-osmotic flows. 129. 1–5. 3 indexed citations
16.
Han, Yong, Boon Long Lau, Gongyue Tang, & Xiaowu Zhang. (2015). Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(12). 1740–1746. 35 indexed citations
17.
Han, Yong, Boon Long Lau, Gongyue Tang, & Xiaowu Zhang. (2015). Heat dissipation improvement with diamond heat spreader on hybrid Si micro-cooler for GaN devices. 603–606. 4 indexed citations
18.
Tang, Gongyue, et al.. (2006). Joule heating and its effects on electroosmotic flow in microfluidic channels. Journal of Physics Conference Series. 34. 925–930. 14 indexed citations
19.
Tang, Gongyue, Chun Yang, John C. Chai, & Hongren Gong. (2003). Joule heating effect on electroosmotic flow and mass species transport in a microcapillary. International Journal of Heat and Mass Transfer. 47(2). 215–227. 164 indexed citations
20.
Tang, Gongyue, et al.. (2003). Numerical analysis of the thermal effect on electroosmotic flow and electrokinetic mass transport in microchannels. Analytica Chimica Acta. 507(1). 27–37. 74 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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