Darvin Edwards
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Mechanical Engineering top 5%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
Papers in
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- Electronic Packaging and Soldering Technologies 22
- 3D IC and TSV technologies 13
- Integrated Circuits and Semiconductor Failure Analysis 8
-
- Mechanical Behavior of Composites 5
- Material Properties and Processing 4
- Journals
- IEEE Transactions on Components and Packaging Technologies (2 papers)Microelectronics Reliability (2 papers)IEEE Transactions on Device and Materials Reliability (2 papers)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)Journal of Electronic Materials (1 paper)
- Partner nations
- United StatesTaiwanCanada
In The Last Decade
Darvin Edwards
32 papers receiving 937 citations
Peers
Comparison fields: 5 of 55
- Electrical and Electronic Engineering 781
- Mechanical Engineering 424
- General Materials Science 31
- Mechanics of Materials 159
- Electronic, Optical and Magnetic Materials 101
Countries citing papers authored by Darvin Edwards
This map shows the geographic impact of Darvin Edwards's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Darvin Edwards with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Darvin Edwards more than expected).
Fields of papers citing papers by Darvin Edwards
This network shows the impact of papers produced by Darvin Edwards. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Darvin Edwards. The network helps show where Darvin Edwards may publish in the future.
Co-authors
The 25 scholars most cited alongside Darvin Edwards, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 1 | |
| 2 | 2010 | 22 | |
| 3 | 2010 | 3 | |
| 4 | 2010 | 5 | |
| 5 | 2010 | 0 | |
| 6 | 2010 | 55 | |
| 7 | 2010 | 12 | |
| 8 | 2010 | 15 | |
| 9 | 2009 | 12 | |
| 10 | 2009 | 52 | |
| 11 | 2008 | 85 | |
| 12 | 2008 | 4 | |
| 13 | 2008 | 0 | |
| 14 | 2007 | 2 | |
| 15 | 2003 | 5 | |
| 16 | 2002 | 13 | |
| 17 | 2000 | 32 | |
| 18 | 1995 | 12 | |
| 19 | 1989 | 27 | |
| 20 | 1981 | 41 |
About Darvin Edwards
Darvin Edwards is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Hardware and Architecture and Industrial and Manufacturing Engineering, having authored 35 papers that have together received 991 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (13 papers), Integrated Circuits and Semiconductor Failure Analysis (8 papers), Advanced Surface Polishing Techniques (6 papers), Mechanical Behavior of Composites (5 papers), Material Properties and Processing (4 papers), Microstructure and mechanical properties (4 papers) and Heat Transfer and Optimization (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (781 citations), Mechanical Engineering (424 citations), General Materials Science (31 citations), Mechanics of Materials (159 citations) and Electronic, Optical and Magnetic Materials (101 citations). Darvin Edwards has collaborated with scholars based in United States, Taiwan and Canada. Frequent co-authors include R.J. Stierman, Jie-Hua Zhao, Tz-Cheng Chiu, Kejun Zeng, K. N. Tu, Paul S. Ho, Xuejun Fan, Vikas Gupta, Ganesh Subbarayan and Jie-Hua Zhao. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Microelectronics Reliability, IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Electronics Packaging Manufacturing and Journal of Electronic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.