Kamal Sikka
- Mechanical Engineering top 10%
- Electrical and Electronic Engineering
- Materials Chemistry
- Computational Mechanics top 10%
- Biomedical Engineering
- Co-authors
- K. E. TorranceTimothy S. FisherXiaojin WeiBahgat SammakiaSrikanth RangarajanScott N. SchiffresCong Hiep HoangCharles Arvin
- Topics
- Electronic Packaging and Soldering Technologies (29 papers)3D IC and TSV technologies (26 papers)Heat Transfer and Optimization (25 papers)
- Journals
- International Journal of Heat and Mass TransferApplied Thermal EngineeringJournal of Quantitative Spectroscopy and Radiative Transfer
- Partner nations
- United StatesJapanCanada
In The Last Decade
Kamal Sikka
59 papers receiving 496 citations
Peers
Comparison fields: 5 of 48
- Mechanical Engineering 300
- Electrical and Electronic Engineering 264
- Materials Chemistry 82
- Computational Mechanics 77
- Biomedical Engineering 74
Countries citing papers authored by Kamal Sikka
This map shows the geographic impact of Kamal Sikka's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kamal Sikka with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kamal Sikka more than expected).
Fields of papers citing papers by Kamal Sikka
This network shows the impact of papers produced by Kamal Sikka. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kamal Sikka. The network helps show where Kamal Sikka may publish in the future.
Co-authorship network of co-authors of Kamal Sikka
This figure shows the co-authorship network connecting the top 25 collaborators of Kamal Sikka. A scholar is included among the top collaborators of Kamal Sikka based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kamal Sikka. Kamal Sikka is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 7 | |
| 2 | 0 | |
| 3 | 9 | |
| 4 | 3 | |
| 5 | 6 | |
| 6 | 4 | |
| 7 | 12 | |
| 8 | 3 | |
| 9 | 3 | |
| 10 | 4 | |
| 11 | 4 | |
| 12 | 1 | |
| 13 | 1 | |
| 14 | 0 | |
| 15 | 9 | |
| 16 | 23 | |
| 17 | 26 | |
| 18 | 3 | |
| 19 | 9 | |
| 20 | 2 |
About Kamal Sikka
Kamal Sikka is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Mechanics of Materials, having authored 62 papers that have together received 530 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (26 papers) and Heat Transfer and Optimization (25 papers). The work is most often cited by research in Mechanical Engineering (300 citations), Electrical and Electronic Engineering (264 citations) and Computational Mechanics (77 citations). Kamal Sikka has collaborated with scholars based in United States, Japan and Canada. Frequent co-authors include K. E. Torrance, Timothy S. Fisher, Xiaojin Wei, Bahgat Sammakia, Srikanth Rangarajan, Scott N. Schiffres, Cong Hiep Hoang, Charles Arvin, Yaser Hadad and Michael F. Modest. Their work appears in journals such as International Journal of Heat and Mass Transfer, Applied Thermal Engineering and Journal of Quantitative Spectroscopy and Radiative Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.