Hilton Toy

420 total citations
9 papers, 346 citations indexed

About

Hilton Toy is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Hilton Toy has authored 9 papers receiving a total of 346 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 2 papers in Mechanics of Materials. Recurrent topics in Hilton Toy's work include Heat Transfer and Optimization (5 papers), 3D IC and TSV technologies (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). Hilton Toy is often cited by papers focused on Heat Transfer and Optimization (5 papers), 3D IC and TSV technologies (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). Hilton Toy collaborates with scholars based in United States and Switzerland. Hilton Toy's co-authors include J. Wakil, Roger Schmidt, J. H. Magerlein, N. LaBianca, R. Polastre, Mary Beth Rothwell, B. K. Furman, Michael Gaynes, E. G. Colgan and R. J. Bezama and has published in prestigious journals such as IEEE Transactions on Components and Packaging Technologies, HVAC&R Research and IMAPSource Proceedings.

In The Last Decade

Hilton Toy

9 papers receiving 339 citations

Peers

Countries citing papers authored by Hilton Toy

Since Specialization

Citations

This map shows the geographic impact of Hilton Toy's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hilton Toy with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hilton Toy more than expected).

Fields of papers citing papers by Hilton Toy

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hilton Toy. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hilton Toy. The network helps show where Hilton Toy may publish in the future.

Co-authorship network of co-authors of Hilton Toy

This figure shows the co-authorship network connecting the top 25 collaborators of Hilton Toy. A scholar is included among the top collaborators of Hilton Toy based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hilton Toy. Hilton Toy is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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9 of 9 papers shown

#	Title	Journal	Authors	Indexed citations
1	Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers		Shidong Li, Daniel M. Kuchta et al.	2
2	Thermal and Reliability Demonstration of a Large Die on a Low CTE Chip Scale Package	IMAPSource Proceedings	Tomoyuki Yamada, Masahiro Fukui et al.	1
3	An efficient lid design for cooling stacked flip-chip 3D packages		Kamal Sikka, J. Wakil et al.	16
4	A Practical Implementation of Silicon Microchannel Coolers for High Power Chips	IEEE Transactions on Components and Packaging Technologies	E. G. Colgan, B. K. Furman et al.	197
5	Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces		R. Linderman, Thomas Brunschwiler et al.	28
6	Silicon Microchannel Cooling for High Power Chips	HVAC&R Research	E. G. Colgan, B. K. Furman et al.	6
7	A practical implementation of silicon microchannel coolers for high power chips		E. G. Colgan, B. K. Furman et al.	87
8	Package cooling designs for a dual-chip electronic package with one high power chip		Hilton Toy, Kamal Sikka et al.	4
9	Gap-reduced thermal paste package design for cooling single flip-chip electronic modules		Kamal Sikka, Hilton Toy et al.	5

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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