Stephen Mick

1.4k total citations · 1 hit paper
24 papers, 1.0k citations indexed

About

Stephen Mick is a scholar working on Electrical and Electronic Engineering, Surfaces, Coatings and Films and Structural Biology. According to data from OpenAlex, Stephen Mick has authored 24 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 6 papers in Surfaces, Coatings and Films and 3 papers in Structural Biology. Recurrent topics in Stephen Mick's work include 3D IC and TSV technologies (12 papers), Semiconductor Lasers and Optical Devices (10 papers) and Advancements in PLL and VCO Technologies (7 papers). Stephen Mick is often cited by papers focused on 3D IC and TSV technologies (12 papers), Semiconductor Lasers and Optical Devices (10 papers) and Advancements in PLL and VCO Technologies (7 papers). Stephen Mick collaborates with scholars based in United States and Japan. Stephen Mick's co-authors include Paul D. Franzon, John Wilson, J. Q. Xu, M.B. Steer, W. Rhett Davis, Christopher Mineo, Hua Hao, Ambarish Mukund Sule, Lei Luo and David P. Nackashi and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, IEEE Transactions on Microwave Theory and Techniques and IEEE Transactions on Nuclear Science.

In The Last Decade

Stephen Mick

23 papers receiving 988 citations

Hit Papers

Demystifying 3D ICs: The ... 2005 2026 2012 2019 2005 200 400 600

Author Peers

Peers are selected by citation overlap in the author's most active subfields. citations · hero ref

Author Last Decade Papers Cites
Stephen Mick 835 269 200 118 111 24 1.0k
A. Spessot 1.5k 1.8× 78 0.3× 118 0.6× 223 1.9× 159 1.4× 113 1.6k
Anna W. Topol 1.6k 1.9× 246 0.9× 198 1.0× 208 1.8× 129 1.2× 24 1.7k
Armin Klumpp 714 0.9× 32 0.1× 22 0.1× 162 1.4× 88 0.8× 44 781
S.E. Steen 825 1.0× 176 0.7× 73 0.4× 151 1.3× 124 1.1× 30 921
Victor Moroz 1.4k 1.7× 18 0.1× 66 0.3× 276 2.3× 82 0.7× 117 1.5k
S. L. Wright 1.8k 2.2× 101 0.4× 98 0.5× 278 2.4× 123 1.1× 51 2.0k
B. Prévitali 1.4k 1.6× 26 0.1× 29 0.1× 320 2.7× 148 1.3× 81 1.4k
Ritwik Chatterjee 909 1.1× 59 0.2× 45 0.2× 108 0.9× 60 0.5× 31 952
Hidetoshi Tanaka 226 0.3× 82 0.3× 26 0.1× 167 1.4× 157 1.4× 42 680
Digh Hisamoto 3.0k 3.6× 21 0.1× 75 0.4× 575 4.9× 366 3.3× 85 3.1k

Countries citing papers authored by Stephen Mick

Since Specialization
Citations

This map shows the geographic impact of Stephen Mick's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Stephen Mick with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Stephen Mick more than expected).

Fields of papers citing papers by Stephen Mick

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Stephen Mick. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Stephen Mick. The network helps show where Stephen Mick may publish in the future.

Co-authorship network of co-authors of Stephen Mick

This figure shows the co-authorship network connecting the top 25 collaborators of Stephen Mick. A scholar is included among the top collaborators of Stephen Mick based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Stephen Mick. Stephen Mick is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Mick, Stephen, et al.. (2019). Real-Time Electron Counting for Continuous TEM Imaging of Sensitive Samples. Microscopy and Microanalysis. 25(S2). 1718–1719. 2 indexed citations
2.
Mick, Stephen, et al.. (2013). Application of Low Energy Broad Ion Beam Milling to Improve the Quality of FIB Prepared TEM Samples. Microscopy and Microanalysis. 19(S2). 1326–1327. 1 indexed citations
3.
Erdman, Natasha, et al.. (2011). Time-Resolved EDS Studies with Rapid Heating and FEG-SEM. Microscopy and Microanalysis. 17(S2). 514–515.
4.
Allard, Lawrence F., Wilbur C. Bigelow, Miguel José–Yacamán, et al.. (2009). A new MEMS‐based system for ultra‐high‐resolution imaging at elevated temperatures. Microscopy Research and Technique. 72(3). 208–215. 118 indexed citations
5.
Chandrasekar, Karthik, John Wilson, Zhiping Feng, et al.. (2008). Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling. IEEE Transactions on Advanced Packaging. 31(4). 749–758. 2 indexed citations
6.
Quispe, Joel, John Damiano, Stephen Mick, et al.. (2007). An Improved Holey Carbon Film for Cryo-Electron Microscopy. Microscopy and Microanalysis. 13(5). 365–371. 46 indexed citations
7.
Jonge, Niels de, et al.. (2007). Scanning Transmission Electron Microscopy of Biological Specimens in Water. Microscopy and Microanalysis. 13(S02). 8 indexed citations
8.
Luo, Lei, et al.. (2006). A 36Gb/s ACCI Multi-Channel Bus using a Fully Differential Pulse Receiver. 773–776. 10 indexed citations
9.
Wilson, John, Lei Luo, J. Q. Xu, et al.. (2006). AC Coupled Interconnect using Buried Bumps for Laminated Organic Packages. 39. 41–48. 5 indexed citations
10.
Luo, Lei, John Wilson, J. Q. Xu, Stephen Mick, & Paul D. Franzon. (2006). Signal integrity and robustness of ACCI packaged systems. 11–14. 4 indexed citations
11.
Wilson, John, Stephen Mick, J. Q. Xu, et al.. (2006). Fully integrated AC coupled interconnect using buried bumps. 7–10. 8 indexed citations
12.
Wilson, John, et al.. (2005). 2.8Gb/s Inductively Coupled Interconnect for 3-D ICs. 352–355. 18 indexed citations
13.
Luo, Lei, John Wilson, Stephen Mick, et al.. (2005). 3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver. IEEE Journal of Solid-State Circuits. 41(1). 287–296. 70 indexed citations
14.
Chandrasekar, Karthik, Zhiping Feng, John Wilson, Stephen Mick, & Paul D. Franzon. (2005). Inductively Coupled Board-to-Board Connectors. 2. 1109–1113. 2 indexed citations
15.
Mick, Stephen. (2005). Analysis and Design Considerations for AC Coupled Interconnection Systems. NCSU Libraries Repository (North Carolina State University Libraries). 3 indexed citations
16.
Kim, Taeyun, J. Nath, John Wilson, et al.. (2004). A High K Nanocomposite for High Density Chip-to-Package Interconnections. MRS Proceedings. 833. 7 indexed citations
17.
Mick, Stephen, et al.. (2004). Causal Reduced-Order Modeling of Distributed Structures in a Transient Circuit Simulator. IEEE Transactions on Microwave Theory and Techniques. 52(9). 2207–2214. 10 indexed citations
18.
Xu, J. Q., Stephen Mick, John Wilson, et al.. (2004). AC coupled interconnect for dense 3-D ICs. IEEE Transactions on Nuclear Science. 51(5). 2156–2160. 21 indexed citations
19.
Mick, Stephen, John Wilson, & Paul D. Franzon. (2003). 4 Gbps high-density AC coupled interconnection. 133–140. 61 indexed citations
20.
Mick, Stephen, Lei Luo, John Wilson, & Paul D. Franzon. (2003). Buried solder bump connections for high-density capacitive coupling. Electrical Performance of Electronic Packaging. 205–208. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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