Won Kyoung Choi
- General Materials Science top 2%
- Metallurgical and Alloy Processes 2
-
- Electronic Packaging and Soldering Technologies 29
- 3D IC and TSV technologies 23
- Electromagnetic Compatibility and Noise Suppression 2
- Mechanical Engineering top 5%
- Advanced Welding Techniques Analysis 11
- Intermetallics and Advanced Alloy Properties 5
- Aerospace Engineering top 10%
- Aluminum Alloy Microstructure Properties 4
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies 6
- Co-authors
- Hyuck Mo LeeSung K. KangDa‐Yuan ShihTimothy GosselinSeung Wook YoonJong Hoon KimDonald W. HendersonKarl J. Puttlitz
- Journals
- Journal of Electronic Materials (5 papers)Journal of materials research/Pratt's guide to venture capital sources (3 papers)JOM (2 papers)
- Partner nations
- South KoreaSingaporeUnited States
In The Last Decade
Won Kyoung Choi
32 papers receiving 979 citations
Peers
Comparison fields: 5 of 37
- General Materials Science 60
- Electrical and Electronic Engineering 977
- Mechanical Engineering 628
- Aerospace Engineering 179
- Automotive Engineering 59
Countries citing papers authored by Won Kyoung Choi
This map shows the geographic impact of Won Kyoung Choi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Won Kyoung Choi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Won Kyoung Choi more than expected).
Fields of papers citing papers by Won Kyoung Choi
This network shows the impact of papers produced by Won Kyoung Choi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Won Kyoung Choi. The network helps show where Won Kyoung Choi may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Won Kyoung Choi, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 16 | |
| 2 | 2011 | 8 | |
| 3 | 2011 | 9 | |
| 4 | 2011 | 8 | |
| 5 | 2011 | 9 | |
| 6 | 2009 | 27 | |
| 7 | 2009 | 3 | |
| 8 | 2009 | 15 | |
| 9 | 2008 | 18 | |
| 10 | 2008 | 20 | |
| 11 | 2008 | 7 | |
| 12 | 2006 | 15 | |
| 13 | 2005 | 38 | |
| 14 | 2004 | 6 | |
| 15 | 2004 | 36 | |
| 16 | 2003 | 39 | |
| 17 | 2003 | 143 | |
| 18 | 2002 | 52 | |
| 19 | 1999 | 28 | |
| 20 | 1999 | 10 |
About Won Kyoung Choi
Won Kyoung Choi is a scholar working on General Materials Science, Electrical and Electronic Engineering, Automotive Engineering, Mechanical Engineering and Aerospace Engineering, having authored 32 papers that have together received 1.0k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (23 papers), Advanced Welding Techniques Analysis (11 papers), Additive Manufacturing and 3D Printing Technologies (6 papers), Intermetallics and Advanced Alloy Properties (5 papers), Aluminum Alloy Microstructure Properties (4 papers), Metallurgical and Alloy Processes (2 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers). The work is most often cited by research in General Materials Science (60 citations), Electrical and Electronic Engineering (977 citations), Mechanical Engineering (628 citations), Aerospace Engineering (179 citations) and Automotive Engineering (59 citations). Won Kyoung Choi has collaborated with scholars based in South Korea, Singapore and United States. Frequent co-authors include Hyuck Mo Lee, Sung K. Kang, Da‐Yuan Shih, Timothy Gosselin, Seung Wook Yoon, Jong Hoon Kim, Donald W. Henderson, Karl J. Puttlitz, Sung‐Il Cho and Donovan N. Leonard. Their work appears in journals such as Journal of Electronic Materials, Journal of materials research/Pratt's guide to venture capital sources, JOM, Scripta Materialia and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.