Da‐Yuan Shih

3.3k total citations
73 papers, 2.7k citations indexed

About

Da‐Yuan Shih is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Da‐Yuan Shih has authored 73 papers receiving a total of 2.7k indexed citations (citations by other indexed papers that have themselves been cited), including 69 papers in Electrical and Electronic Engineering, 36 papers in Mechanical Engineering and 13 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Da‐Yuan Shih's work include Electronic Packaging and Soldering Technologies (60 papers), 3D IC and TSV technologies (49 papers) and Advanced Welding Techniques Analysis (16 papers). Da‐Yuan Shih is often cited by papers focused on Electronic Packaging and Soldering Technologies (60 papers), 3D IC and TSV technologies (49 papers) and Advanced Welding Techniques Analysis (16 papers). Da‐Yuan Shih collaborates with scholars based in United States, South Korea and Canada. Da‐Yuan Shih's co-authors include Sung K. Kang, Paul Lauro, C. C. Goldsmith, S. K. Kang, Donald W. Henderson, Karl J. Puttlitz, Timothy Gosselin, Jin Yu, Hyuck Mo Lee and D. W. Henderson and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Journal of Solid-State Circuits.

In The Last Decade

Da‐Yuan Shih

71 papers receiving 2.6k citations

Peers

Countries citing papers authored by Da‐Yuan Shih

Since Specialization

Citations

This map shows the geographic impact of Da‐Yuan Shih's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Da‐Yuan Shih with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Da‐Yuan Shih more than expected).

Fields of papers citing papers by Da‐Yuan Shih

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Da‐Yuan Shih. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Da‐Yuan Shih. The network helps show where Da‐Yuan Shih may publish in the future.

Co-authorship network of co-authors of Da‐Yuan Shih

This figure shows the co-authorship network connecting the top 25 collaborators of Da‐Yuan Shih. A scholar is included among the top collaborators of Da‐Yuan Shih based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Da‐Yuan Shih. Da‐Yuan Shih is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Generic rules to achieve bump electromigration immortality for 3D IC integration 2013 ·(unknown), Da‐Yuan Shih, (unknown), Chih‐Hang Tung, (unknown), (unknown), (unknown), (unknown)	15
2	Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging 2009 ·Journal of Electronic Materials ·Moon Gi Cho, Sung K. Kang, Sun-Kyoung Seo, Da‐Yuan Shih, Hyuck Mo Lee	18
3	The effects of Ag, Cu compositions and Zn doping on the electromigration performance of Pb-free solders 2009 ·Minhua Lu, Da‐Yuan Shih, Paul Lauro, Sung K. Kang, C. C. Goldsmith, Sun-Kyoung Seo	7
4	Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders 2009 ·Journal of materials research/Pratt's guide to venture capital sources ·Moon Gi Cho, Sung K. Kang, Sun-Kyoung Seo, Da‐Yuan Shih, Hyuck Mo Lee	15
5	The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy 2009 ·Journal of Electronic Materials ·Sun-Kyoung Seo, Sung K. Kang, Moon Gi Cho, Da‐Yuan Shih, Hyuck Mo Lee	55
6	Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM 2008 ·Minhua Lu, Paul Lauro, Da‐Yuan Shih, R. Polastre, C. C. Goldsmith, Donald W. Henderson, Hongqing Zhang, Moon Gi Cho	24
7	An overview of Pb-free, flip-chip wafer-bumping technologies 2008 ·JOM ·Sung K. Kang, (unknown), Da‐Yuan Shih	17
8	Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging 2007 ·Journal of Electronic Materials ·Moon Gi Cho, Sung K. Kang, Da‐Yuan Shih, Hyuck Mo Lee	121
9	Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process 2007 ·Journal of materials research/Pratt's guide to venture capital sources ·Sung K. Kang, (unknown), Paul Lauro, Da‐Yuan Shih	32
10	Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints 2004 ·Won Kyoung Choi, Sung K. Kang, (unknown), Da‐Yuan Shih	6
11	Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P 2004 ·Journal of Electronic Materials ·Yoonchul Sohn, Jin Yu, S. K. Kang, Da‐Yuan Shih, Woojin Choi	25
12	The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints 2004 ·MATERIALS TRANSACTIONS ·Sung K. Kang, Paul Lauro, Da‐Yuan Shih, Donald W. Henderson, (unknown), Timothy Gosselin, (unknown), C. C. Goldsmith, Karl J. Puttlitz, (unknown), Won Kyoung Choi	36
13	The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue 2004 ·Journal of materials research/Pratt's guide to venture capital sources ·Donald W. Henderson, (unknown), Timothy Gosselin, (unknown), David E. King, Tia‐Marje Korhonen, M. A. Korhonen, L.P. Lehman, E. J. Cotts, Sung K. Kang, Paul Lauro, Da‐Yuan Shih, C. C. Goldsmith, Karl J. Puttlitz	169
14	Factors affecting the interconnection resistance and yield in the fabrication of multilayer polyimide/metal thin film structures 2003 ·Da‐Yuan Shih, (unknown), C. Narayan, John E. Lewis, Wendy Graham, S. Nunes, J. Paraszczak, (unknown), E. Galligan, (unknown), (unknown), E Perfecto, C. A. Chang, A. Deutsch, (unknown), John J. Ritsko, J. Wilczyńskí	2
15	Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders 2003 ·Journal of Electronic Materials ·Paul Lauro, Sung K. Kang, Won Kyoung Choi, Da‐Yuan Shih	39
16	Adhesion test standardization for multichip module packages 2002 ·Da‐Yuan Shih, (unknown), (unknown), Paul Lauro, (unknown), (unknown), J. Paraszczak, S. Purushothaman, Alfred Viehbeck, (unknown), (unknown), Hua-Ching Tong, (unknown), R. H. Lacombe	3
17	A novel elastomeric connector for packaging interconnections, testing and burn-in applications 2002 ·Da‐Yuan Shih, (unknown), Paul Lauro, Keith Fogel, (unknown), G. F. Walker, J. C. Hedrick, Liang Shi, Fuad E. Doany, Jane M. Shaw	1
18	An XPS study of argon ion beam and oxygen RIE modified BPDA-PDA polyimide as related to adhesion 1996 ·Journal of Adhesion Science and Technology ·R. Flitsch, Da‐Yuan Shih	18
19	The reduction of Au—Al intermetallic formation and electromigration in hydrogen environments 1979 ·IEEE Transactions on Electron Devices ·Da‐Yuan Shih, P. J. Ficalora	25
20	The Reduction of Au-Al Intermetallic Formation and Electromigration in Hydrogen Environments 1978 ·Reliability physics ·Da‐Yuan Shih, P. J. Ficalora	11

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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