D. Pinjala
-
- 3D IC and TSV technologies 48
- Electronic Packaging and Soldering Technologies 47
- Photonic and Optical Devices 13
- Electromagnetic Compatibility and Noise Suppression 8
- Semiconductor Lasers and Optical Devices 7
- Mechanical Engineering top 5%
- Heat Transfer and Optimization 26
- Heat Transfer and Boiling Studies 12
- Automotive Engineering top 5%
- Biomedical Engineering top 10%
- Nanofabrication and Lithography Techniques 7
- Computational Mechanics top 10%
- Co-authors
- K.C. TohHengyun ZhangTeck Neng WongYogendra JoshiJohn H. LauNavas KhanV. KripeshXiaowu Zhang
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (7 papers)IEEE Transactions on Components and Packaging Technologies (4 papers)Heat Transfer Engineering (2 papers)
- Partner nations
- SingaporeUnited StatesHong Kong
In The Last Decade
D. Pinjala
83 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 46
- Electrical and Electronic Engineering 877
- Mechanical Engineering 475
- Automotive Engineering 150
- Biomedical Engineering 269
- Computational Mechanics 113
Countries citing papers authored by D. Pinjala
This map shows the geographic impact of D. Pinjala's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Pinjala with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Pinjala more than expected).
Fields of papers citing papers by D. Pinjala
This network shows the impact of papers produced by D. Pinjala. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Pinjala. The network helps show where D. Pinjala may publish in the future.
Co-authorship network
The 25 scholars most cited alongside D. Pinjala, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 40 | |
| 2 | 2011 | 7 | |
| 3 | 2010 | 1 | |
| 4 | 2010 | 5 | |
| 5 | 2009 | 35 | |
| 6 | 2009 | 52 | |
| 7 | 2008 | 1 | |
| 8 | 2007 | 1 | |
| 9 | 2006 | 10 | |
| 10 | 2006 | 1 | |
| 11 | 2005 | 31 | |
| 12 | 2005 | 40 | |
| 13 | 2004 | 1 | |
| 14 | 2004 | 29 | |
| 15 | 2004 | 51 | |
| 16 | 2004 | 144 | |
| 17 | 2004 | 1 | |
| 18 | 2004 | 1 | |
| 19 | 2003 | 4 | |
| 20 | 2003 | 15 |
About D. Pinjala
D. Pinjala is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Computational Mechanics, Automotive Engineering and Atomic and Molecular Physics, and Optics, having authored 84 papers that have together received 1.3k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (48 papers), Electronic Packaging and Soldering Technologies (47 papers), Heat Transfer and Optimization (26 papers), Photonic and Optical Devices (13 papers), Heat Transfer and Boiling Studies (12 papers), Electromagnetic Compatibility and Noise Suppression (8 papers), Semiconductor Lasers and Optical Devices (7 papers) and Nanofabrication and Lithography Techniques (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (877 citations), Mechanical Engineering (475 citations), Automotive Engineering (150 citations), Biomedical Engineering (269 citations) and Computational Mechanics (113 citations). D. Pinjala has collaborated with scholars based in Singapore, United States and Hong Kong. Frequent co-authors include K.C. Toh, Hengyun Zhang, Teck Neng Wong, Yogendra Joshi, John H. Lau, Navas Khan, V. Kripesh, Xiaowu Zhang, Poi-Siong Teo and Soon Wee Ho. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Components and Packaging Technologies, Heat Transfer Engineering, Applied Physics Letters and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.