Cheryl Selvanayagam

1.0k total citations
39 papers, 790 citations indexed

About

Cheryl Selvanayagam is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Mechanical Engineering. According to data from OpenAlex, Cheryl Selvanayagam has authored 39 papers receiving a total of 790 indexed citations (citations by other indexed papers that have themselves been cited), including 37 papers in Electrical and Electronic Engineering, 6 papers in Materials Chemistry and 4 papers in Mechanical Engineering. Recurrent topics in Cheryl Selvanayagam's work include Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (29 papers) and Advancements in Photolithography Techniques (6 papers). Cheryl Selvanayagam is often cited by papers focused on Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (29 papers) and Advancements in Photolithography Techniques (6 papers). Cheryl Selvanayagam collaborates with scholars based in Singapore, United States and Netherlands. Cheryl Selvanayagam's co-authors include Xiaowu Zhang, John H. Lau, T.C. Chai, Kripesh Vaidyanathan, S. Seah, S.K.W. Seah, Nagarajan Raghavan, Pham Luu Trung Duong, R. Rajoo and E.H. Wong and has published in prestigious journals such as IEEE Access, Materials Letters and Journal of Electronic Materials.

In The Last Decade

Cheryl Selvanayagam

38 papers receiving 760 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Cheryl Selvanayagam Singapore 14 733 135 114 99 73 39 790
Soon Wee Ho Singapore 15 674 0.9× 115 0.9× 74 0.6× 72 0.7× 28 0.4× 55 736
Sri M. Sri-Jayantha United States 8 672 0.9× 109 0.8× 85 0.7× 104 1.1× 25 0.3× 14 776
Joeri De Vos Belgium 17 797 1.1× 176 1.3× 107 0.9× 75 0.8× 40 0.5× 98 861
Maaike M. Visser Taklo Norway 14 526 0.7× 150 1.1× 45 0.4× 101 1.0× 37 0.5× 54 603
Yasumitsu Orii Japan 15 566 0.8× 69 0.5× 114 1.0× 162 1.6× 20 0.3× 72 622
Navas Khan Singapore 15 545 0.7× 132 1.0× 137 1.2× 157 1.6× 22 0.3× 46 666
Meng-Kai Shih Taiwan 12 418 0.6× 108 0.8× 25 0.2× 84 0.8× 64 0.9× 64 500
Tai Chong Chai Singapore 12 450 0.6× 68 0.5× 63 0.6× 111 1.1× 42 0.6× 56 474
Suresh Ramalingam United States 13 513 0.7× 117 0.9× 63 0.6× 32 0.3× 28 0.4× 38 563
David Ho Singapore 12 583 0.8× 113 0.8× 32 0.3× 70 0.7× 34 0.5× 47 632

Countries citing papers authored by Cheryl Selvanayagam

Since Specialization
Citations

This map shows the geographic impact of Cheryl Selvanayagam's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cheryl Selvanayagam with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cheryl Selvanayagam more than expected).

Fields of papers citing papers by Cheryl Selvanayagam

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Cheryl Selvanayagam. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cheryl Selvanayagam. The network helps show where Cheryl Selvanayagam may publish in the future.

Co-authorship network of co-authors of Cheryl Selvanayagam

This figure shows the co-authorship network connecting the top 25 collaborators of Cheryl Selvanayagam. A scholar is included among the top collaborators of Cheryl Selvanayagam based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Cheryl Selvanayagam. Cheryl Selvanayagam is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Selvanayagam, Cheryl, et al.. (2022). Global Optimization of Surface Warpage for Inverse Design of Ultra-Thin Electronic Packages Using Tensor Train Decomposition. IEEE Access. 10. 48589–48602. 6 indexed citations
2.
Selvanayagam, Cheryl, Pham Luu Trung Duong, & Nagarajan Raghavan. (2020). Learning Localized Spatial Material Properties of Substrates in Ultra-Thin Packages Using Markov Chain Monte Carlo and Finite Element Analysis. IEEE Access. 8. 50163–50170. 8 indexed citations
3.
Fu, Lei, et al.. (2020). Cu Pillar Bump Development for 7-nm Chip Package Interaction (CPI) Technology. Journal of Microelectronics and Electronic Packaging. 17(1). 1–8. 4 indexed citations
4.
Selvanayagam, Cheryl, Pham Luu Trung Duong, & Nagarajan Raghavan. (2020). Inverse Design of Substrate from Warpage Surrogate Model Using Global Optimisation Algorithms in Ultra-Thin Packages. 2309–2316. 6 indexed citations
5.
Selvanayagam, Cheryl, et al.. (2019). Machine Learning Approach to Improve Accuracy of Warpage Simulations. 834–841. 8 indexed citations
6.
Fu, Lei, et al.. (2019). Cu pillar bump development for 7nm Chip package interaction (CPI) technology. IMAPSource Proceedings. 2019(1). 176–182. 4 indexed citations
7.
8.
Wong, E.H., et al.. (2016). Constitutive modeling of solder alloys for drop-impact applications. Microelectronics Reliability. 67. 135–142. 5 indexed citations
9.
Selvanayagam, Cheryl. (2016). Using FEA to determine test speed for high speed shear test on BGA based on field conditions. 345–349. 1 indexed citations
10.
Selvanayagam, Cheryl, et al.. (2012). Simulation approach to improving BGA reliability on coreless packages. 12. 659–664.
11.
Zhang, Xiaowu, et al.. (2012). Design and development of micro-sensors for measuring localised stresses during copper wirebonding. 8. 244–250. 1 indexed citations
12.
Zhang, Xiaowu, R. Rajoo, Cheryl Selvanayagam, et al.. (2011). Low-Stress Bond Pad Design for Low-Temperature Solder Interconnections on Through-Silicon Vias (TSVs). IEEE Transactions on Components Packaging and Manufacturing Technology. 1(4). 510–518. 8 indexed citations
13.
Selvanayagam, Cheryl, Xiaowu Zhang, R. Rajoo, & D. Pinjala. (2011). Modeling Stress in Silicon With TSVs and Its Effect on Mobility. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(9). 1328–1335. 33 indexed citations
14.
Zhang, Xiaowu, R. Rajoo, Cheryl Selvanayagam, et al.. (2010). A low stress bond pad design for low temperature solder interconnections on through silicon vias (TSVs). 1657–1663. 1 indexed citations
15.
16.
Selvanayagam, Cheryl, John H. Lau, Xiaowu Zhang, et al.. (2009). Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps. IEEE Transactions on Advanced Packaging. 32(4). 720–728. 211 indexed citations
17.
Seah, S.K.W., E.H. Wong, Cheryl Selvanayagam, et al.. (2008). A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests. 1102–1107. 2 indexed citations
18.
Wong, E.H., Cheryl Selvanayagam, S.K.W. Seah, et al.. (2008). Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling. Journal of Electronic Materials. 37(6). 829–836. 64 indexed citations
19.
Selvanayagam, Cheryl, John H. Lau, Xiaowu Zhang, et al.. (2008). Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps. 1073–1081. 80 indexed citations
20.
Selvanayagam, Cheryl, E.H. Wong, S.K.W. Seah, et al.. (2007). Constitutive Properties of Bulk Solder at `Drop-Impact' Strain Rates. 8. 360–364. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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