R. Rajoo

1.1k total citations
53 papers, 897 citations indexed

About

R. Rajoo is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Materials Chemistry. According to data from OpenAlex, R. Rajoo has authored 53 papers receiving a total of 897 indexed citations (citations by other indexed papers that have themselves been cited), including 48 papers in Electrical and Electronic Engineering, 12 papers in Mechanics of Materials and 11 papers in Materials Chemistry. Recurrent topics in R. Rajoo's work include Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (31 papers) and Integrated Circuits and Semiconductor Failure Analysis (12 papers). R. Rajoo is often cited by papers focused on Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (31 papers) and Integrated Circuits and Semiconductor Failure Analysis (12 papers). R. Rajoo collaborates with scholars based in Singapore, United States and Australia. R. Rajoo's co-authors include E.H. Wong, T.B. Lim, Sau Koh, S.K.W. Seah, K.C. Chan, K.H. Lee, Yiu‐Wing Mai, K.T. Tsai, Xiaowu Zhang and Cheryl Selvanayagam and has published in prestigious journals such as Sensors and Actuators B Chemical, Journal of Applied Polymer Science and Journal of Electronic Materials.

In The Last Decade

R. Rajoo

50 papers receiving 849 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
R. Rajoo Singapore 17 746 308 172 99 93 53 897
Olaf Wittler Germany 13 468 0.6× 150 0.5× 151 0.9× 57 0.6× 88 0.9× 97 598
J.F.J.M. Caers Netherlands 18 665 0.9× 202 0.7× 291 1.7× 90 0.9× 42 0.5× 67 748
J. Liu Sweden 15 432 0.6× 163 0.5× 96 0.6× 54 0.5× 136 1.5× 40 550
Karel Dušek Czechia 15 592 0.8× 96 0.3× 344 2.0× 95 1.0× 76 0.8× 113 760
Sabuj Mallik United Kingdom 17 677 0.9× 187 0.6× 572 3.3× 304 3.1× 121 1.3× 67 1.2k
Deepak Marla India 15 252 0.3× 210 0.7× 325 1.9× 118 1.2× 293 3.2× 65 700
Darvin Edwards United States 15 781 1.0× 159 0.5× 424 2.5× 91 0.9× 134 1.4× 35 991
P.J. Bolt Netherlands 14 280 0.4× 186 0.6× 284 1.7× 279 2.8× 82 0.9× 38 622
Jinling Gao United States 13 345 0.5× 123 0.4× 129 0.8× 160 1.6× 61 0.7× 41 669
Raj Bhatti United Kingdom 11 335 0.4× 100 0.3× 379 2.2× 262 2.6× 80 0.9× 33 692

Countries citing papers authored by R. Rajoo

Since Specialization
Citations

This map shows the geographic impact of R. Rajoo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. Rajoo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. Rajoo more than expected).

Fields of papers citing papers by R. Rajoo

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by R. Rajoo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. Rajoo. The network helps show where R. Rajoo may publish in the future.

Co-authorship network of co-authors of R. Rajoo

This figure shows the co-authorship network connecting the top 25 collaborators of R. Rajoo. A scholar is included among the top collaborators of R. Rajoo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with R. Rajoo. R. Rajoo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Zhang, Li, Ling Xie, Hong Ji, et al.. (2011). A self-contained disposable cartridge microsystem for dengue viral ribonucleic acid extraction. Sensors and Actuators B Chemical. 160(1). 1557–1564. 8 indexed citations
3.
Xing, Fa, et al.. (2011). Design and reliability analysis of pyramidal shape 3-layer stacked TSV die package. 129. 1428–1435. 4 indexed citations
4.
Zhang, Xiaowu, R. Rajoo, Cheryl Selvanayagam, et al.. (2011). Application of piezoresistive stress sensor in wafer bumping and drop impact test of embedded ultra thin device. 1276–1282. 6 indexed citations
5.
Zhang, Xiaowu, R. Rajoo, Cheryl Selvanayagam, et al.. (2010). A low stress bond pad design for low temperature solder interconnections on through silicon vias (TSVs). 1657–1663. 1 indexed citations
6.
Lim, Ying Ying, R. Rajoo, & Ser Choong Chong. (2010). Design and fabrication of embedded passives on thin flexible substrates and reliability evaluation of passives performance. 681–686. 1 indexed citations
7.
Rajoo, R., et al.. (2010). Embedding of 15um thin chip and passives in thin flexible substrate. 77. 489–496. 6 indexed citations
8.
Xie, Ling, C.S. Premachandran, Zhang Li, et al.. (2009). Design of a fully-enclosed disposable bio-micro fluidic cartridge with self-contained reagents for infectious diseases diagnostic applications. National University of Singapore. 180–184. 1 indexed citations
9.
Rajoo, R., et al.. (2008). Development of Stretch Solder Interconnections for Wafer Level Packaging. IEEE Transactions on Advanced Packaging. 31(2). 377–385.
10.
Rajoo, R., Erich H. Kisi, & D.J. O’Connor. (2008). Micro Impact Testing of Lead Free Solder Joints. Advanced materials research. 32. 99–102. 1 indexed citations
11.
Zhao, Xiujuan, J.F.J.M. Caers, J.W.C. de Vries, E.H. Wong, & R. Rajoo. (2007). A Component Level Test Method for Evaluating the Resistance of Pb-free BGA Solder Joints to Brittle Fracture under Shock Impact. 1522–1529. 23 indexed citations
12.
Zhao, Xiujuan, J.F.J.M. Caers, J.W.C. de Vries, et al.. (2006). Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps. 174–178. 18 indexed citations
13.
Seah, S.K.W., E.H. Wong, Yiu‐Wing Mai, R. Rajoo, & Chwee Teck Lim. (2006). Failure Mechanisms of Interconnections in Drop Impact. National University of Singapore. 1484–1492. 9 indexed citations
14.
Rajoo, R., et al.. (2006). Reliability Performance of Stretch Solder Interconnections. 26. 43–49. 9 indexed citations
15.
Rajoo, R., et al.. (2006). Super Stretched Solder Interconnects for Wafer Level Packaging. National University of Singapore. 1227–1232. 5 indexed citations
16.
Priyadarshi, Anish, Shimin Li, Subodh G. Mhaisalkar, et al.. (2005). Characterization of optical properties of acrylate based adhesives exposed to different temperature conditions. Journal of Applied Polymer Science. 98(3). 950–956. 23 indexed citations
17.
Wong, E.H., et al.. (2005). Drop Impact: Fundamentals and Impact Characterisation of Solder Joints. 1202–1209. 68 indexed citations
18.
19.
Sundaram, V., Fuhan Liu, S.M. Hosseini, et al.. (2004). Ultra-high density board technology for sub-100 ?m pitch nano-wafer level packaging. 6. 125–129. 2 indexed citations
20.
Wong, E.H., Sau Koh, K.H. Lee, & R. Rajoo. (2002). Comprehensive treatment of moisture induced failure-recent advances. IEEE Transactions on Electronics Packaging Manufacturing. 25(3). 223–230. 57 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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