C. C. Goldsmith

1.3k total citations
36 papers, 1.0k citations indexed

About

C. C. Goldsmith is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, C. C. Goldsmith has authored 36 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 29 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 12 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in C. C. Goldsmith's work include Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (16 papers) and Copper Interconnects and Reliability (12 papers). C. C. Goldsmith is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (16 papers) and Copper Interconnects and Reliability (12 papers). C. C. Goldsmith collaborates with scholars based in United States, South Korea and Canada. C. C. Goldsmith's co-authors include Da‐Yuan Shih, Donald W. Henderson, Paul Lauro, Minhua Lu, Timothy Gosselin, Karl J. Puttlitz, Sung K. Kang, I. C. Noyan, Amit Sarkhel and T. Shaw and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films.

In The Last Decade

C. C. Goldsmith

35 papers receiving 980 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
C. C. Goldsmith United States	15	944	524	225	198	174	36	1.0k
S. K. Kang United States	23	1.5k 1.6×	821 1.6×	111 0.5×	166 0.8×	119 0.7×	57	1.6k
Hsiang‐Yao Hsiao Taiwan	9	736 0.8×	379 0.7×	298 1.3×	68 0.3×	123 0.7×	10	888
Yi-Shao Lai Taiwan	18	555 0.6×	248 0.5×	211 0.9×	47 0.2×	224 1.3×	41	787
K. N. Tu United States	9	813 0.9×	398 0.8×	301 1.3×	109 0.6×	47 0.3×	12	848
P. A. Totta United States	11	660 0.7×	319 0.6×	164 0.7×	57 0.3×	78 0.4×	22	761
S.-M. Kuo United States	12	459 0.5×	360 0.7×	135 0.6×	89 0.4×	103 0.6×	16	756
J. P. Lucas United States	26	1.3k 1.4×	1.4k 2.6×	58 0.3×	290 1.5×	295 1.7×	39	1.7k
Jin Onuki Japan	14	647 0.7×	240 0.5×	284 1.3×	54 0.3×	109 0.6×	119	789
Tetsuroh Minemura Japan	15	376 0.4×	346 0.7×	86 0.4×	59 0.3×	96 0.6×	61	799
Won Kyoung Choi South Korea	16	977 1.0×	628 1.2×	48 0.2×	179 0.9×	43 0.2×	32	1.0k

Countries citing papers authored by C. C. Goldsmith

Since Specialization

Citations

This map shows the geographic impact of C. C. Goldsmith's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. C. Goldsmith with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. C. Goldsmith more than expected).

Fields of papers citing papers by C. C. Goldsmith

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. C. Goldsmith. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. C. Goldsmith. The network helps show where C. C. Goldsmith may publish in the future.

Co-authorship network of co-authors of C. C. Goldsmith

This figure shows the co-authorship network connecting the top 25 collaborators of C. C. Goldsmith. A scholar is included among the top collaborators of C. C. Goldsmith based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. C. Goldsmith. C. C. Goldsmith is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Lu, Minhua, Paul Lauro, & C. C. Goldsmith. (2011). Study of Interfacial Reaction and Electromigration Reliability of Pb-Free Solders With Nickel Iron Barrier Layer. 453–456. 3 indexed citations

Lu, Minhua, Da‐Yuan Shih, Paul Lauro, et al.. (2009). The effects of Ag, Cu compositions and Zn doping on the electromigration performance of Pb-free solders. 18. 922–929. 7 indexed citations

Lu, Minhua, Da‐Yuan Shih, Sung K. Kang, C. C. Goldsmith, & P. Flaitz. (2009). Effect of Zn doping on SnAg solder microstructure and electromigration stability. Journal of Applied Physics. 106(5). 22 indexed citations

Lu, Minhua, Paul Lauro, Da‐Yuan Shih, et al.. (2008). Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM. 360–365. 24 indexed citations

Murray, Conal E., C. C. Goldsmith, T. M. Shaw, J. P. Doyle, & I. C. Noyan. (2006). Thermal stress evolution in embedded Cu/low-k dielectric composite features. Applied Physics Letters. 89(1). 9 indexed citations

Murray, Conal E., C. C. Goldsmith, & I. C. Noyan. (2005). Spatially transient stress effects in thin films by X-ray diffraction. Powder Diffraction. 20(2). 112–116. 1 indexed citations

Kang, Sung K., Paul Lauro, Da‐Yuan Shih, et al.. (2004). The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints. MATERIALS TRANSACTIONS. 45(3). 695–702. 36 indexed citations

Henderson, Donald W., Timothy Gosselin, David E. King, et al.. (2004). The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue. Journal of materials research/Pratt's guide to venture capital sources. 19(6). 1608–1612. 169 indexed citations

Noyan, I. C., et al.. (2004). Finite size effects in stress analysis of interconnect structures. Applied Physics Letters. 85(5). 724–726. 22 indexed citations

10.

Ray, Sumit Kumar, et al.. (2002). Evaluation of lead(Pb)-free ceramic ball grid array (CBGA): Wettability, microstructure and reliability. 978–986. 6 indexed citations

11.

Kang, S. K., Da‐Yuan Shih, Keith Fogel, et al.. (2002). Interfacial reaction studies on lead (Pb)-free solder alloys. IEEE Transactions on Electronics Packaging Manufacturing. 25(3). 155–161. 69 indexed citations

12.

Noyan, I. C., T. Shaw, & C. C. Goldsmith. (1997). Inhomogeneous strain states in sputter deposited tungsten thin films. Journal of Applied Physics. 82(9). 4300–4302. 46 indexed citations

13.

DeHaven, Patrick W. & C. C. Goldsmith. (1993). Stress Mapping Near Simulated Defects in Thin Film Wiring Using X-ray Microbeam Diffraction. MRS Proceedings. 309. 3 indexed citations

14.

Goldsmith, C. C., et al.. (1993). Residual Stress in Thin Films of Aluminum/Hafnium. Advances in X-ray Analysis. 37. 157–165. 4 indexed citations

15.

DeHaven, Patrick W. & C. C. Goldsmith. (1993). Stress Mapping Near Simulated Defects in Thin Film Wiring Using X-ray Microbeam Diffraction. MRS Proceedings. 308. 2 indexed citations

16.

Noyan, I. C. & C. C. Goldsmith. (1990). Thermal Stress Relaxation in Vapor Deposited Thin Films. Advances in X-ray Analysis. 34. 587–600. 10 indexed citations

17.

Goldsmith, C. C., et al.. (1987). Small, Area X-Ray Diffraction Techniques: Errors in Strain Measurement. Advances in X-ray Analysis. 31. 77–85. 1 indexed citations

18.

Goldsmith, C. C., et al.. (1983). Small Area X-Ray Diffraction Techniques; Applications of the Micro-Diffractometer to Phase Identification and Strain Determination. Advances in X-ray Analysis. 27. 229–238. 5 indexed citations

19.

Goldsmith, C. C., et al.. (1978). A structural comparison of electroless and electroplated nickel. Thin Solid Films. 53(2). 217–222. 4 indexed citations

20.

Goldsmith, C. C., et al.. (1973). Precipitation and solid solution effects in aluminum-copper thin films and their influence on electromigration. Journal of Applied Physics. 44(6). 2452–2455. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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