Chee Lip Gan

7.2k total citations · 2 hit papers
221 papers, 5.9k citations indexed

About

Chee Lip Gan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Chee Lip Gan has authored 221 papers receiving a total of 5.9k indexed citations (citations by other indexed papers that have themselves been cited), including 141 papers in Electrical and Electronic Engineering, 74 papers in Electronic, Optical and Magnetic Materials and 60 papers in Materials Chemistry. Recurrent topics in Chee Lip Gan's work include Electronic Packaging and Soldering Technologies (71 papers), Semiconductor materials and devices (52 papers) and Copper Interconnects and Reliability (51 papers). Chee Lip Gan is often cited by papers focused on Electronic Packaging and Soldering Technologies (71 papers), Semiconductor materials and devices (52 papers) and Copper Interconnects and Reliability (51 papers). Chee Lip Gan collaborates with scholars based in Singapore, United States and China. Chee Lip Gan's co-authors include Hua Zhang, Xiao Huang, Yizhong Huang, Shaozhou Li, Zehui Du, Carl V. Thompson, Wardhana Aji Sasangka, Freddy Boey, Shixin Wu and Shuzhou Li and has published in prestigious journals such as Science, Advanced Materials and Angewandte Chemie International Edition.

In The Last Decade

Chee Lip Gan

213 papers receiving 5.8k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Iron-facilitated dynamic active-site generation on spinel CoAl2O4 with self-termination of surface reconstruction for water oxidation

2019 904 citations Tianze Wu, Shengnan Sun et al. Nature Catalysis profile →
Synthesis of hexagonal close-packed gold nanostructures

2011 570 citations Xiao Huang, Shaozhou Li et al. Nature Communications profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Chee Lip Gan Singapore	34	3.0k	2.7k	1.5k	1.4k	891	221	5.9k
Tao Yang China	40	2.3k 0.8×	2.4k 0.9×	1.1k 0.8×	940 0.7×	902 1.0×	214	5.0k
Ungyu Paik South Korea	36	4.1k 1.4×	3.5k 1.3×	2.5k 1.7×	1.0k 0.7×	1.7k 1.9×	151	7.3k
Zhaohui Yang China	34	1.7k 0.6×	1.8k 0.7×	1.0k 0.7×	954 0.7×	943 1.1×	169	4.2k
Jisheng Pan Singapore	45	4.0k 1.3×	3.3k 1.3×	846 0.6×	986 0.7×	961 1.1×	220	6.6k
Chen‐Hao Wang Taiwan	41	4.0k 1.3×	2.1k 0.8×	3.1k 2.1×	1.6k 1.2×	764 0.9×	226	6.6k
Kuibo Yin China	45	4.8k 1.6×	3.8k 1.4×	1.6k 1.1×	2.7k 1.9×	1.8k 2.1×	181	9.0k
Xingbo Liu United States	46	3.5k 1.2×	4.2k 1.6×	884 0.6×	1.4k 1.0×	904 1.0×	211	7.8k
My Alı El Khakani Canada	41	2.9k 1.0×	3.4k 1.3×	1.2k 0.9×	951 0.7×	1.2k 1.4×	219	5.9k
André D. Taylor United States	47	4.0k 1.3×	2.6k 1.0×	1.3k 0.9×	1.2k 0.8×	1.4k 1.6×	120	6.8k
Si‐Young Choi South Korea	46	3.8k 1.3×	4.6k 1.7×	717 0.5×	2.2k 1.5×	1.2k 1.3×	263	7.6k

Countries citing papers authored by Chee Lip Gan

Since Specialization

Citations

This map shows the geographic impact of Chee Lip Gan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chee Lip Gan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chee Lip Gan more than expected).

Fields of papers citing papers by Chee Lip Gan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chee Lip Gan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chee Lip Gan. The network helps show where Chee Lip Gan may publish in the future.

Co-authorship network of co-authors of Chee Lip Gan

This figure shows the co-authorship network connecting the top 25 collaborators of Chee Lip Gan. A scholar is included among the top collaborators of Chee Lip Gan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chee Lip Gan. Chee Lip Gan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Seetoh, Ian P., et al.. (2025). Mechanical properties and failure behavior of silicon nitride based plate and truss lattices fabricated by vat photopolymerization 3D printing. Materials Science and Engineering A. 927. 148030–148030. 2 indexed citations

Xu, Chen, et al.. (2025). Synthesis and Property Characterization of AM/AMPS/C18DMAAC/NVP Tetrameric Temperature-Sensitive Thickening Copolymer. Processes. 13(3). 922–922. 1 indexed citations

Zhu, Minmin, et al.. (2024). Interface engineering in CF/Al matrix composites for enhancement in mechanical strength and anti-corrosion properties. Materials Characterization. 212. 113990–113990. 7 indexed citations

Du, Zehui, et al.. (2024). Debinding and sintering optimization of stereolithography based silicon nitride parts for attaining centimetric wall-thickness shapes. Journal of the European Ceramic Society. 45(2). 116911–116911. 6 indexed citations

Xie, Qingyun, Hui Teng Tan, Siyu Liu, et al.. (2024). Multi-channel AlN/GaN Schottky barrier diodes. Applied Physics Express. 18(1). 16502–16502. 1 indexed citations

Liu, Yang, Hai Zhang, Li Zhang, et al.. (2023). Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment. Microelectronics Reliability. 150. 115115–115115. 3 indexed citations

Yan, Guangxu, et al.. (2023). The study of Ni-Sn transient liquid phase bonded joints under high temperatures. Materials Characterization. 203. 113099–113099. 4 indexed citations

Ng, Andrew Yun Ru, et al.. (2023). Realization of vat photopolymerisation of dense SiC ceramics with SiO2/MgSO4 coated sub-micron powders for efficient heat dissipation. Additive manufacturing. 73. 103664–103664. 13 indexed citations

Feng, Jianhang, et al.. (2023). Rapid self-sealing of macro cracks of cementitious composites by in-situ alginate crosslinking. Cement and Concrete Research. 165. 107074–107074. 24 indexed citations

10.

Shi, Yan, et al.. (2023). Realizing reversible phase transformation of shape memory ceramics constrained in aluminum. Nature Communications. 14(1). 7103–7103. 17 indexed citations

11.

Zeng, Xiaomei, et al.. (2023). Security Evaluation of Microcontrollers: A Case Study in Smart Watches. DR-NTU (Nanyang Technological University). 64. 1–6. 1 indexed citations

12.

Zhang, Hao, Teddy Salim, Alfred A. Zinn, et al.. (2022). Copper-Nanoparticle-Coated Fabrics for Rapid and Sustained Antibacterial Activity Applications. ACS Applied Nano Materials. 5(9). 12876–12886. 33 indexed citations

13.

Wu, Tianze, Shengnan Sun, Jiajia Song, et al.. (2019). Iron-facilitated dynamic active-site generation on spinel CoAl2O4 with self-termination of surface reconstruction for water oxidation. Nature Catalysis. 2(9). 763–772. 904 indexed citations breakdown →

14.

Sasangka, Wardhana Aji, et al.. (2017). Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation. Microelectronics Reliability. 76-77. 287–291. 10 indexed citations

15.

Gan, Chee Lip, et al.. (2015). 組合せ蒸着とマイクロカンチレバーを使用したCu-Sn-In薄膜のYoung率,残留応力および破壊強度の評価. Journal of Micromechanics and Microengineering. 25(3). 1–14. 31 indexed citations

16.

Sharif, Ahmed, Chee Lip Gan, & Zhong Chen. (2014). Customized glass sealant for ceramic substrates for high temperature electronic application. Microelectronics Reliability. 54(12). 2905–2910. 11 indexed citations

17.

Sharif, Ahmed, Chee Lip Gan, & Zhong Chen. (2013). Transient liquid phase Ag-based solder technology for high-temperature packaging applications. Journal of Alloys and Compounds. 587. 365–368. 66 indexed citations

18.

Huang, Xiao, Shaozhou Li, Shixin Wu, et al.. (2012). Graphene Oxide‐Templated Synthesis of Ultrathin or Tadpole‐Shaped Au Nanowires with Alternating hcp and fcc Domains. Advanced Materials. 24(7). 979–983. 139 indexed citations

19.

Liu, Hai, Junsheng Wu, Ying Wang, et al.. (2012). Self‐Organization of a Hybrid Nanostructure consisting of a Nanoneedle and Nanodot. Small. 8(18). 2807–2811. 12 indexed citations

20.

Made, Riko I, et al.. (2011). Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits. Acta Materialia. 60(2). 578–587. 20 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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