Amit Sarkhel
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 5%
- Aerospace Engineering top 5%
- Materials Chemistry
- Mechanics of Materials
- Co-authors
- Sung K. KangL. SeigleTimothy GosselinDa‐Yuan ShihKarl J. PuttlitzC. C. GoldsmithBabita GuptaDonald W. Henderson
- Topics
- Electronic Packaging and Soldering Technologies (7 papers)3D IC and TSV technologies (5 papers)Intermetallics and Advanced Alloy Properties (5 papers)
- Journals
- Thin Solid FilmsJournal of materials research/Pratt's guide to venture capital sourcesMetallurgical Transactions A
- Partner nations
- United StatesSouth Korea
In The Last Decade
Amit Sarkhel
12 papers receiving 765 citations
Peers
Comparison fields: 5 of 37
- Electrical and Electronic Engineering 674
- Mechanical Engineering 562
- Aerospace Engineering 222
- Materials Chemistry 78
- Mechanics of Materials 65
Countries citing papers authored by Amit Sarkhel
This map shows the geographic impact of Amit Sarkhel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Amit Sarkhel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Amit Sarkhel more than expected).
Fields of papers citing papers by Amit Sarkhel
This network shows the impact of papers produced by Amit Sarkhel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Amit Sarkhel. The network helps show where Amit Sarkhel may publish in the future.
Co-authorship network of co-authors of Amit Sarkhel
This figure shows the co-authorship network connecting the top 25 collaborators of Amit Sarkhel. A scholar is included among the top collaborators of Amit Sarkhel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Amit Sarkhel. Amit Sarkhel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 143 | |
| 2 | 6 | |
| 3 | 69 | |
| 4 | 170 | |
| 5 | 291 | |
| 6 | 14 | |
| 7 | NASA Contractor Report 2939 | 53 |
| 8 | Kinetics of pack aluminization of nickel | 2 |
| 9 | 19 | |
| 10 | 42 | |
| 11 | 1 | |
| 12 | 1 |
About Amit Sarkhel
Amit Sarkhel is a scholar working on General Materials Science, Mechanical Engineering and Electrical and Electronic Engineering, having authored 12 papers that have together received 811 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (5 papers) and Intermetallics and Advanced Alloy Properties (5 papers). The work is most often cited by research in General Materials Science (60 citations), Mechanical Engineering (562 citations) and Electrical and Electronic Engineering (674 citations). Amit Sarkhel has collaborated with scholars based in United States and South Korea. Frequent co-authors include Sung K. Kang, L. Seigle, Timothy Gosselin, Da‐Yuan Shih, Karl J. Puttlitz, C. C. Goldsmith, Babita Gupta, Donald W. Henderson, Wesley A. Henderson and Won Kyoung Choi. Their work appears in journals such as Thin Solid Films, Journal of materials research/Pratt's guide to venture capital sources and Metallurgical Transactions A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.