Amit Sarkhel

944 total citations
12 papers, 811 citations indexed

About

Amit Sarkhel is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and General Materials Science. According to data from OpenAlex, Amit Sarkhel has authored 12 papers receiving a total of 811 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Mechanical Engineering, 7 papers in Electrical and Electronic Engineering and 3 papers in General Materials Science. Recurrent topics in Amit Sarkhel's work include Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (5 papers) and Intermetallics and Advanced Alloy Properties (5 papers). Amit Sarkhel is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (5 papers) and Intermetallics and Advanced Alloy Properties (5 papers). Amit Sarkhel collaborates with scholars based in United States and South Korea. Amit Sarkhel's co-authors include Sung K. Kang, L. Seigle, Timothy Gosselin, Da‐Yuan Shih, Karl J. Puttlitz, C. C. Goldsmith, Babita Gupta, Donald W. Henderson, Wesley A. Henderson and Won Kyoung Choi and has published in prestigious journals such as Thin Solid Films, Journal of materials research/Pratt's guide to venture capital sources and Metallurgical Transactions A.

In The Last Decade

Amit Sarkhel

12 papers receiving 765 citations

Peers

Amit Sarkhel
Bismarck Luiz Silva Brazil
C. Liu United Kingdom
V. Bojarevičs United Kingdom
W. J. Huppmann Germany
Minsu Jung South Korea
Hisao Esaka Japan
M.F.X. Gigliotti United States
O. A. Troitskiǐ Russia
A. Brotzu Italy
Zhao Yuan China
Bismarck Luiz Silva Brazil
Amit Sarkhel
Citations per year, relative to Amit Sarkhel Amit Sarkhel (= 1×) peers Bismarck Luiz Silva

Countries citing papers authored by Amit Sarkhel

Since Specialization
Citations

This map shows the geographic impact of Amit Sarkhel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Amit Sarkhel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Amit Sarkhel more than expected).

Fields of papers citing papers by Amit Sarkhel

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Amit Sarkhel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Amit Sarkhel. The network helps show where Amit Sarkhel may publish in the future.

Co-authorship network of co-authors of Amit Sarkhel

This figure shows the co-authorship network connecting the top 25 collaborators of Amit Sarkhel. A scholar is included among the top collaborators of Amit Sarkhel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Amit Sarkhel. Amit Sarkhel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

12 of 12 papers shown
1.
Kang, Sung K., Da‐Yuan Shih, Wesley A. Henderson, et al.. (2003). Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu. JOM. 55(6). 61–65. 143 indexed citations
2.
3.
Kang, S. K., Da‐Yuan Shih, Keith Fogel, et al.. (2002). Interfacial reaction studies on lead (Pb)-free solder alloys. IEEE Transactions on Electronics Packaging Manufacturing. 25(3). 155–161. 69 indexed citations
4.
Henderson, Donald W., Timothy Gosselin, Amit Sarkhel, et al.. (2002). Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys. Journal of materials research/Pratt's guide to venture capital sources. 17(11). 2775–2778. 170 indexed citations
5.
Kang, Sung K. & Amit Sarkhel. (1994). Lead (Pb)-free solders for electronic packaging. Journal of Electronic Materials. 23(8). 701–707. 291 indexed citations
6.
Sarkhel, Amit & L. Seigle. (1982). Interdiffusion Coefficients in the Ni2AI3(γ) Phase of the Ni-AI System. Metallurgical Transactions A. 13(7). 1313–1314. 14 indexed citations
7.
Seigle, L., et al.. (1978). NASA Contractor Report 2939. NASA Technical Reports Server (NASA). 53 indexed citations
8.
Seigle, L., et al.. (1978). Kinetics of pack aluminization of nickel. NASA Technical Reports Server (NASA). 2 indexed citations
9.
Sarkhel, Amit & L. Seigle. (1976). Solution of binary multiphase diffusion problems allowing for variable diffusivity, with application to the aluminization of nickel. Metallurgical Transactions A. 7(6). 899–902. 19 indexed citations
10.
Gupta, Babita, Amit Sarkhel, & L. Seigle. (1976). On the kinetics of pack aluminization. Thin Solid Films. 39. 313–320. 42 indexed citations
11.
Sarkhel, Amit, et al.. (1974). Comment on: “Interface motion resulting from atomic diffusion in a finite two-phase system — Part II”. Scripta Metallurgica. 8(12). 1415–1418. 1 indexed citations
12.
Sarkhel, Amit, et al.. (1974). Comment on: “Non-parabolic interface motion resulting from diffusion in a finite two-phase system”. Scripta Metallurgica. 8(7). 799–799. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026