Rong An

827 total citations
55 papers, 654 citations indexed

About

Rong An is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Rong An has authored 55 papers receiving a total of 654 indexed citations (citations by other indexed papers that have themselves been cited), including 45 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 13 papers in Materials Chemistry. Recurrent topics in Rong An's work include Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (20 papers) and Semiconductor materials and interfaces (8 papers). Rong An is often cited by papers focused on Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (20 papers) and Semiconductor materials and interfaces (8 papers). Rong An collaborates with scholars based in China, United Kingdom and United States. Rong An's co-authors include Chunqing Wang, Yanhong Tian, Baolei Liu, Chenxi Wang, Ying Zhong, Zhen Zheng, Zhi Jiang, Yang Liu, Rui Zhang and Wei Liu and has published in prestigious journals such as Acta Materialia, ACS Applied Materials & Interfaces and Small.

In The Last Decade

Rong An

48 papers receiving 636 citations

Peers

Rong An

EEE

EOMM

Barbara Horváth Hungary

Keisuke Uenishi Japan

Ja‐Myeong Koo South Korea

Yoonchul Sohn South Korea

Vivek Chidambaram Singapore

Hsiang‐Yao Hsiao Taiwan

Han-wen Lin Taiwan

K.-J. Wolter Germany

Chia-Ling Lu Taiwan

Dong Qu China

Barbara Horváth Hungary

Rong An

355 ×0.7

EEE

191 ×0.5

82 ×0.6

57 ×0.8

EOMM

43 ×0.7

Citations per year, relative to Rong An Rong An (= 1×) peers Barbara Horváth

Countries citing papers authored by Rong An

Since Specialization

Citations

This map shows the geographic impact of Rong An's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Rong An with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Rong An more than expected).

Fields of papers citing papers by Rong An

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Rong An. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Rong An. The network helps show where Rong An may publish in the future.

Co-authorship network of co-authors of Rong An

This figure shows the co-authorship network connecting the top 25 collaborators of Rong An. A scholar is included among the top collaborators of Rong An based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Rong An. Rong An is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Wang, Pengbo, et al.. (2025). Study on the electrochemical migration inhibition mechanism of micron-scale Cu@In-In and nano-Ag sandwich structure. Applied Surface Science. 720. 165259–165259.

Li, Xinghao, et al.. (2024). Comprehensive phylogenomic analyses revealed higher‐level phylogenetic relationships within the Cucujiformia. Journal of Systematics and Evolution. 62(6). 1137–1149. 3 indexed citations

Liu, Wei, et al.. (2024). Atomic insights into the sintering behaviour of Ag–Cu solid solution nanoparticles on Ag substrate. Journal of Materials Research and Technology. 33. 9123–9134. 2 indexed citations

Zhang, Ge, Guoqing Chen, Chinnapat Panwisawas, et al.. (2024). Uncovering the fracture mechanism of Laves (1 1 1)/ Ni6Nb7 (0 0 0 1) interfaces by first-principles calculations. Acta Materialia. 281. 120426–120426. 3 indexed citations

Zhang, Ge, Guoqing Chen, Chinnapat Panwisawas, et al.. (2023). First-principles study of oxygen segregation and its effect on the embrittlement of molybdenum symmetrical tilt grain boundaries. Acta Materialia. 261. 119387–119387. 20 indexed citations

Liu, Wei, et al.. (2023). Effect of Nano-Cu6Sn5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints. Materials Characterization. 207. 113553–113553. 4 indexed citations

An, Rong, et al.. (2023). Anisotropy of hardness and impression morphology in body-centered tetragonal tin (Sn) at cryogenic temperature and room temperature. Journal of Materials Science Materials in Electronics. 34(4). 3 indexed citations

Liu, Wei, et al.. (2023). Thermal cycle reliability and creep behavior of nano-IMC mixed solder joints. Journal of Materials Science Materials in Electronics. 34(28). 5 indexed citations

Zhang, He, et al.. (2021). Growth kinetics of (Cu_xNi_1-x)₆Sn₅ intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test. Materials Research Express. 8(10). 106301–106301. 3 indexed citations

10.

Liu, Wei, Kai Zhu, Chunqing Wang, et al.. (2020). Laser induced forward transfer of brittle Cu3Sn thin film. Journal of Manufacturing Processes. 60. 48–53. 5 indexed citations

11.

Wang, Te, et al.. (2019). Pressureless Low-Temperature Sintering of Silver Nano-Solder Paste Based on Surface Activation. 1–3.

12.

An, Rong, et al.. (2018). Solid-State Spalling of Ag3Sn in an Eutectic SnPb Solder Joint with an Ag Thin Film/Ge Cell. Journal of Electronic Materials. 47(9). 5625–5631. 4 indexed citations

13.

Zhou, Wei, et al.. (2017). One-Step Fabrication of 3D Nanohierarchical Nickel Nanomace Array To Sinter with Silver NPs and the Interfacial Analysis. ACS Applied Materials & Interfaces. 9(5). 4798–4807. 18 indexed citations

14.

Liu, Wei, Rong An, Ying Ding, et al.. (2015). Microstructure and properties of AgCu/2 wt% Ag‐added Sn–Pb solder/CuBe joints fabricated by vapor phase soldering. Rare Metals. 41(6). 1983–1988. 14 indexed citations

15.

An, Rong, et al.. (2015). Synthesis of CrO single crystal slices by firing under water vapor atmosphere. Materials Letters. 152. 13–16. 3 indexed citations

16.

An, Rong, et al.. (2015). Characterization of the Microstructure of an AlN-Mullite-Al2O3 Ceramic Layer on WCu Composite Alloy for Microelectronic Application. Journal of Electronic Materials. 44(11). 4154–4160. 6 indexed citations

17.

An, Rong, et al.. (2015). Fabrication of Al₂O₃–Mullite–AlN Multiphase Ceramic Layer on W–Cu Substrates for Power Semiconductor Packaging. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(2). 182–187. 9 indexed citations

18.

An, Rong, et al.. (2014). Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics. 340–342. 1 indexed citations

19.

An, Rong, Wei Liu, Chunqing Wang, & Yanhong Tian. (2013). Analytical bond-order potential for Sn. Acta Physica Sinica. 62(12). 128101–128101.

20.

An, Rong, Mingyu Li, & Chunqing Wang. (2006). A new solder bumping technology with local induction heating. 394–397.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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