Sun-Kyoung Seo

1.4k total citations
46 papers, 1.1k citations indexed

About

Sun-Kyoung Seo is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Aerospace Engineering. According to data from OpenAlex, Sun-Kyoung Seo has authored 46 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 33 papers in Mechanical Engineering, 28 papers in Electrical and Electronic Engineering and 16 papers in Aerospace Engineering. Recurrent topics in Sun-Kyoung Seo's work include Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (23 papers) and High Temperature Alloys and Creep (15 papers). Sun-Kyoung Seo is often cited by papers focused on Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (23 papers) and High Temperature Alloys and Creep (15 papers). Sun-Kyoung Seo collaborates with scholars based in South Korea, United States and China. Sun-Kyoung Seo's co-authors include Hyuck Mo Lee, Moon Gi Cho, Chang Yong Jo, Young-Soo Yoo, Sung K. Kang, Da‐Yuan Shih, Hi-Won Jeong, Dae Won Yun, Hirofumi Miyahara and Keiji Ogi and has published in prestigious journals such as Applied Physics Letters, Materials Science and Engineering A and Corrosion Science.

In The Last Decade

Sun-Kyoung Seo

44 papers receiving 1.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Sun-Kyoung Seo South Korea 19 904 518 445 237 130 46 1.1k
Kil-Won Moon United States 14 851 0.9× 868 1.7× 325 0.7× 224 0.9× 129 1.0× 32 1.3k
Won Kyoung Choi South Korea 16 628 0.7× 977 1.9× 179 0.4× 73 0.3× 51 0.4× 32 1.0k
Mohammad Motalab Bangladesh 18 492 0.5× 690 1.3× 226 0.5× 410 1.7× 63 0.5× 71 1.1k
Yoshiharu Kariya Japan 18 885 1.0× 1.0k 2.0× 230 0.5× 99 0.4× 34 0.3× 79 1.2k
J. P. Lucas United States 26 1.4k 1.5× 1.3k 2.5× 290 0.7× 254 1.1× 36 0.3× 39 1.7k
Keisuke Uenishi Japan 14 459 0.5× 281 0.5× 78 0.2× 165 0.7× 56 0.4× 58 629
Jingwei Xian United Kingdom 18 686 0.8× 668 1.3× 333 0.7× 198 0.8× 11 0.1× 39 942
Z. Mei United States 14 830 0.9× 859 1.7× 180 0.4× 152 0.6× 21 0.2× 25 1.1k
Wanshun Xia China 14 695 0.8× 89 0.2× 305 0.7× 337 1.4× 187 1.4× 38 908
K. Sakamoto Japan 10 475 0.5× 428 0.8× 150 0.3× 68 0.3× 25 0.2× 12 606

Countries citing papers authored by Sun-Kyoung Seo

Since Specialization
Citations

This map shows the geographic impact of Sun-Kyoung Seo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sun-Kyoung Seo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sun-Kyoung Seo more than expected).

Fields of papers citing papers by Sun-Kyoung Seo

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Sun-Kyoung Seo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sun-Kyoung Seo. The network helps show where Sun-Kyoung Seo may publish in the future.

Co-authorship network of co-authors of Sun-Kyoung Seo

This figure shows the co-authorship network connecting the top 25 collaborators of Sun-Kyoung Seo. A scholar is included among the top collaborators of Sun-Kyoung Seo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sun-Kyoung Seo. Sun-Kyoung Seo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kim, Yeongseon, et al.. (2023). Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applications. 1043–1047. 18 indexed citations
2.
Cai, Jian, Junqiang Wang, Qian Wang, et al.. (2015). Low temperature solid-state-diffusion bonding for fine-pitch Cu/Sn/Cu interconnect. 1616–1623. 7 indexed citations
3.
Yun, Dae Won, Sun-Kyoung Seo, Hi-Won Jeong, & Young-Soo Yoo. (2014). The effects of the minor alloying elements Al, Si and Mn on the cyclic oxidation of Ni–Cr–W–Mo alloys. Corrosion Science. 83. 176–188. 60 indexed citations
4.
Choi, Baig-Gyu, et al.. (2011). Effect of pre-strain on microstructural evolution during thermal exposure of single crystal superalloy CMSX-4. Transactions of Nonferrous Metals Society of China. 21(6). 1291–1296. 22 indexed citations
5.
Long, Feifei, Young-Soo Yoo, Sun-Kyoung Seo, et al.. (2011). Effect of Re Addition and Withdrawal Rate on the Solidification Behavior of Directionally Solidified Superalloy AM3. Journal of Material Science and Technology. 27(2). 101–106. 11 indexed citations
6.
Jeong, Hi Won, Sun-Kyoung Seo, Hyun-Uk Hong, & Young-Soo Yoo. (2010). Characterization of the parameters relating adjacent grains using transmission electron microscopy. Journal of Applied Crystallography. 43(6). 1495–1501. 6 indexed citations
7.
Lu, Minhua, Da‐Yuan Shih, Paul Lauro, et al.. (2009). The effects of Ag, Cu compositions and Zn doping on the electromigration performance of Pb-free solders. 18. 922–929. 7 indexed citations
8.
Cho, Moon Gi, Sung K. Kang, Sun-Kyoung Seo, Da‐Yuan Shih, & Hyuck Mo Lee. (2009). Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders. Journal of materials research/Pratt's guide to venture capital sources. 24(2). 534–543. 15 indexed citations
9.
Seo, Sun-Kyoung, Sung K. Kang, Moon Gi Cho, Da‐Yuan Shih, & Hyuck Mo Lee. (2009). The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy. Journal of Electronic Materials. 38(12). 2461–2469. 55 indexed citations
10.
Cho, Moon Gi, Sun-Kyoung Seo, & Hyuck Mo Lee. (2009). Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-<I>x</I>Zn Alloy Under Bump Metallurgies. MATERIALS TRANSACTIONS. 50(9). 2291–2296. 11 indexed citations
11.
Cho, Moon Gi, Hyun You Kim, Sun-Kyoung Seo, & Hyuck Mo Lee. (2009). Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures. Applied Physics Letters. 95(2). 39 indexed citations
12.
Cho, Moon Gi, Sung K. Kang, Sun-Kyoung Seo, Da‐Yuan Shih, & Hyuck Mo Lee. (2009). Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging. Journal of Electronic Materials. 38(11). 2242–2250. 18 indexed citations
13.
Seo, Sun-Kyoung, et al.. (2008). Microstructural evolution in directionally solidified Ni-base superalloy IN792+Hf. Journal of Material Science and Technology. 24(1). 110–114. 6 indexed citations
14.
Kim, Donghoon, Moon Gi Cho, Sun-Kyoung Seo, & Hyuck Mo Lee. (2008). Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM. Journal of Electronic Materials. 38(1). 39–45. 34 indexed citations
15.
Seo, Sun-Kyoung, et al.. (2007). Dendrite Arm Spacing and Carbide Morphology with Thermal Gradient and Solidification Rate in Directionally Solidified Ni-Base Superalloy. Journal of the Korea Foundry Society. 27(2). 77–82. 1 indexed citations
16.
Lee, Joo Won, et al.. (2007). Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging. Journal of Electronic Materials. 37(1). 110–117. 9 indexed citations
17.
18.
Seo, Sun-Kyoung, et al.. (2007). Eta Phase and Boride Formation in Directionally Solidified Ni-Base Superalloy IN792 + Hf. Metallurgical and Materials Transactions A. 38(4). 883–893. 75 indexed citations
19.
20.
Sun, Wenru, et al.. (1999). Relationship between η phase formation and solidification rate in directionally solidified IN792 + Hf alloy. Materials Science and Technology. 15(11). 1221–1224. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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