Daquan Yu
- Electrical and Electronic Engineering top 1%
- Mechanical Engineering top 1%
- Aerospace Engineering top 5%
- Biomedical Engineering top 10%
- Materials Chemistry
- Topics
- 3D IC and TSV technologies (140 papers)Electronic Packaging and Soldering Technologies (128 papers)Nanofabrication and Lithography Techniques (22 papers)
In The Last Decade
Daquan Yu
181 papers receiving 2.6k citations
Hit Papers
Peers
Comparison fields: 5 of 76
- Electrical and Electronic Engineering 2.5k
- Mechanical Engineering 1.3k
- Aerospace Engineering 313
- Biomedical Engineering 287
- Materials Chemistry 232
Countries citing papers authored by Daquan Yu
This map shows the geographic impact of Daquan Yu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daquan Yu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daquan Yu more than expected).
Fields of papers citing papers by Daquan Yu
This network shows the impact of papers produced by Daquan Yu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daquan Yu. The network helps show where Daquan Yu may publish in the future.
Co-authorship network of co-authors of Daquan Yu
This figure shows the co-authorship network connecting the top 25 collaborators of Daquan Yu. A scholar is included among the top collaborators of Daquan Yu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Daquan Yu. Daquan Yu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 3 | |
| 3 | 0 | |
| 4 | 1 | |
| 5 | 9 | |
| 6 | 4 | |
| 7 | 0 | |
| 8 | 1 | |
| 9 | 0 | |
| 10 | 1 | |
| 11 | 1 | |
| 12 | 12 | |
| 13 | 22 | |
| 14 | 7 | |
| 15 | 13 | |
| 16 | 21 | |
| 17 | 16 | |
| 18 | 21 | |
| 19 | Effect of Cu content on IMC between Sn-Cu solder and Cu and Ni substrates | 4 |
| 20 | Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder | 6 |
About Daquan Yu
Daquan Yu is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Acoustics and Ultrasonics, having authored 205 papers that have together received 2.7k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (140 papers), Electronic Packaging and Soldering Technologies (128 papers) and Nanofabrication and Lithography Techniques (22 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.5k citations), General Materials Science (132 citations) and Mechanical Engineering (1.3k citations). Daquan Yu has collaborated with scholars based in China, Singapore and Hong Kong. Frequent co-authors include Lu Wang, Chi‐Man Lawrence Wu, C. Law, J.K.L. Lai, Hong‐Bin Xie, W. Jillek, Lixi Wan, John H. Lau, Haitao Ma and Fei Qin. Their work appears in journals such as Applied Physics Letters, Advanced Functional Materials and Chemical Engineering Journal.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.