Seung Wook Yoon
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 5%
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Automotive Engineering top 5%
- Co-authors
- Hyuck Mo LeeV. KripeshByeong‐Joo LeeYaojian LinPandi C. MarimuthuJohn H. LauWon Kyoung ChoiSoon Wee Ho
- Topics
- 3D IC and TSV technologies (84 papers)Electronic Packaging and Soldering Technologies (83 papers)Electromagnetic Compatibility and Noise Suppression (20 papers)
- Partner nations
- SingaporeSouth KoreaUnited States
In The Last Decade
Seung Wook Yoon
94 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 52
- Electrical and Electronic Engineering 1.4k
- Mechanical Engineering 405
- Biomedical Engineering 176
- Electronic, Optical and Magnetic Materials 172
- Automotive Engineering 137
Countries citing papers authored by Seung Wook Yoon
This map shows the geographic impact of Seung Wook Yoon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Seung Wook Yoon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Seung Wook Yoon more than expected).
Fields of papers citing papers by Seung Wook Yoon
This network shows the impact of papers produced by Seung Wook Yoon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Seung Wook Yoon. The network helps show where Seung Wook Yoon may publish in the future.
Co-authorship network of co-authors of Seung Wook Yoon
This figure shows the co-authorship network connecting the top 25 collaborators of Seung Wook Yoon. A scholar is included among the top collaborators of Seung Wook Yoon based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Seung Wook Yoon. Seung Wook Yoon is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 1 | |
| 3 | 2 | |
| 4 | 1 | |
| 5 | 6 | |
| 6 | 22 | |
| 7 | 8 | |
| 8 | 42 | |
| 9 | 3D TSV mid-end processes and assembly/packaging technology | 6 |
| 10 | Development and characterization of 300mm large panel eWLB (embedded wafer level BGA) | 3 |
| 11 | 4 | |
| 12 | 35 | |
| 13 | 22 | |
| 14 | 20 | |
| 15 | 1 | |
| 16 | 21 | |
| 17 | 8 | |
| 18 | 2 | |
| 19 | 28 | |
| 20 | 37 |
About Seung Wook Yoon
Seung Wook Yoon is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and General Materials Science, having authored 100 papers that have together received 1.5k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (84 papers), Electronic Packaging and Soldering Technologies (83 papers) and Electromagnetic Compatibility and Noise Suppression (20 papers). The work is most often cited by research in General Materials Science (77 citations), Electrical and Electronic Engineering (1.4k citations) and Automotive Engineering (137 citations). Seung Wook Yoon has collaborated with scholars based in Singapore, South Korea and United States. Frequent co-authors include Hyuck Mo Lee, V. Kripesh, Byeong‐Joo Lee, Yaojian Lin, Pandi C. Marimuthu, John H. Lau, Won Kyoung Choi, Soon Wee Ho, Navas Khan and Xavier Baraton. Their work appears in journals such as Journal of Applied Physics, Acta Materialia and Scripta Materialia.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.