Seung Wook Yoon

2.0k total citations
100 papers, 1.5k citations indexed

About

Seung Wook Yoon is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Seung Wook Yoon has authored 100 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 95 papers in Electrical and Electronic Engineering, 15 papers in Automotive Engineering and 14 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Seung Wook Yoon's work include 3D IC and TSV technologies (84 papers), Electronic Packaging and Soldering Technologies (83 papers) and Electromagnetic Compatibility and Noise Suppression (20 papers). Seung Wook Yoon is often cited by papers focused on 3D IC and TSV technologies (84 papers), Electronic Packaging and Soldering Technologies (83 papers) and Electromagnetic Compatibility and Noise Suppression (20 papers). Seung Wook Yoon collaborates with scholars based in Singapore, South Korea and United States. Seung Wook Yoon's co-authors include Hyuck Mo Lee, V. Kripesh, Byeong‐Joo Lee, Yaojian Lin, Pandi C. Marimuthu, John H. Lau, Won Kyoung Choi, Soon Wee Ho, Navas Khan and Xavier Baraton and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Scripta Materialia.

In The Last Decade

Seung Wook Yoon

94 papers receiving 1.3k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Seung Wook Yoon Singapore 23 1.4k 405 176 172 137 100 1.5k
V. Kripesh Singapore 23 1.6k 1.1× 388 1.0× 272 1.5× 178 1.0× 234 1.7× 104 1.7k
Riet Labie Belgium 18 1.1k 0.8× 273 0.7× 165 0.9× 189 1.1× 79 0.6× 58 1.2k
Douglas C. Hopkins United States 23 1.5k 1.1× 280 0.7× 48 0.3× 337 2.0× 292 2.1× 116 1.6k
Jae-Woong Nah United States 20 1.0k 0.7× 284 0.7× 128 0.7× 290 1.7× 32 0.2× 58 1.2k
H. Walter Germany 21 970 0.7× 393 1.0× 367 2.1× 171 1.0× 39 0.3× 109 1.5k
Jin Shang China 20 872 0.6× 632 1.6× 30 0.2× 171 1.0× 36 0.3× 76 1.2k
Darvin Edwards United States 15 781 0.6× 424 1.0× 134 0.8× 101 0.6× 15 0.1× 35 991
Jong-ook Suh United States 14 696 0.5× 1.2k 3.0× 69 0.4× 233 1.4× 537 3.9× 28 1.7k
Eugene J. Rymaszewski United States 14 1.3k 1.0× 359 0.9× 213 1.2× 158 0.9× 33 0.2× 32 1.7k
P. Markondeya Raj United States 20 1.4k 1.0× 128 0.3× 343 1.9× 247 1.4× 95 0.7× 193 1.7k

Countries citing papers authored by Seung Wook Yoon

Since Specialization
Citations

This map shows the geographic impact of Seung Wook Yoon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Seung Wook Yoon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Seung Wook Yoon more than expected).

Fields of papers citing papers by Seung Wook Yoon

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Seung Wook Yoon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Seung Wook Yoon. The network helps show where Seung Wook Yoon may publish in the future.

Co-authorship network of co-authors of Seung Wook Yoon

This figure shows the co-authorship network connecting the top 25 collaborators of Seung Wook Yoon. A scholar is included among the top collaborators of Seung Wook Yoon based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Seung Wook Yoon. Seung Wook Yoon is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
3.
Lin, Yaojian, et al.. (2016). Board level reliability improvement in eWLB (embedded wafer level BGA) packages. 139–142. 2 indexed citations
4.
Gaddi, R., et al.. (2016). Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor. IMAPSource Proceedings. 2016(1). 185–189. 1 indexed citations
5.
Yoon, Seung Wook, et al.. (2015). Advanced wafer level technology: Enabling innovations in mobile, IoT and wearable electronics. 1–5. 22 indexed citations
6.
Yoon, Seung Wook, et al.. (2013). Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions. 1855–1860. 42 indexed citations
7.
Yoon, Seung Wook. (2013). Robust Reliability Performance of Large size eWLB (Fan-out WLP). Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2013(DPC). 1438–1457. 8 indexed citations
8.
Yoon, Seung Wook, Yaojian Lin, & Pandi C. Marimuthu. (2011). Development and characterization of 300mm large panel eWLB (embedded wafer level BGA). European Microelectronics and Packaging Conference. 1–5. 3 indexed citations
9.
Yoon, Seung Wook, et al.. (2011). 3D TSV mid-end processes and assembly/packaging technology. European Microelectronics and Packaging Conference. 1–6. 6 indexed citations
10.
11.
Jin, Yonggang, Xavier Baraton, Seung Wook Yoon, et al.. (2010). Next generation eWLB (embedded wafer level BGA) packaging. 520–526. 56 indexed citations
12.
Yu, Aibin, Navas Khan, D. Pinjala, et al.. (2009). Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages. IEEE Transactions on Components and Packaging Technologies. 32(3). 566–571. 35 indexed citations
13.
Choi, Won Kyoung, Daquan Yu, Chengkuo Lee, et al.. (2008). Development of low temperature bonding using in-based solders. National University of Singapore. 970. 1294–1299. 20 indexed citations
14.
Khan, Navas, et al.. (2008). Development of 3-D Stack Package Using Silicon Interposer for High-Power Application. IEEE Transactions on Advanced Packaging. 31(1). 44–50. 22 indexed citations
15.
Made, Riko I, Chee Lip Gan, Chengkuo Lee, et al.. (2008). Study of Ag-In solder as low temperature wafer bonding intermediate layer. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6884. 68840H–68840H. 3 indexed citations
16.
Yoon, Seung Wook, et al.. (2006). Through Wafer Copper Via for Silicon Based SiP Application. 1. 7–12. 8 indexed citations
17.
Nah, Jae-Woong, Jong-ook Suh, K. N. Tu, et al.. (2006). Electromigration in Pb-Free Solder Bumps with Cu Column as Flip-Chip Joints. 657–662. 5 indexed citations
18.
Ho, Soon Wee, et al.. (2006). Development of coaxial shield via in silicon carrier for high frequency application. 825–830. 21 indexed citations
19.
Yoon, Seung Wook, et al.. (2005). 150 μm Pitch Pb-Free Flipchip Packaging with Cu/Low-k Interconnects. 100–106. 2 indexed citations
20.
Yoon, Seung Wook, et al.. (2005). Polymer embedded module for SiP application. 600–604.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by V. Kripesh Breakdown of academic impact, for papers by Riet Labie Breakdown of academic impact, for papers by Douglas C. Hopkins Breakdown of academic impact, for papers by Jae-Woong Nah Breakdown of academic impact, for papers by H. Walter Breakdown of academic impact, for papers by Jin Shang Breakdown of academic impact, for papers by Darvin Edwards Breakdown of academic impact, for papers by Jong-ook Suh Breakdown of academic impact, for papers by Eugene J. Rymaszewski Breakdown of academic impact, for papers by P. Markondeya Raj
Rankless by CCL
2026