Carl V. Thompson

24.1k citations

387 papers · 20.3k indexed · 7 hit papers · h-index 76

Electrical and Electronic Engineering top 0.1%
Materials Chemistry top 0.2%
Electronic, Optical and Magnetic Materials top 0.2%
Mechanics of Materials top 0.1%
Mechanical Engineering top 0.5%

Co-authors: Yang Shao‐Horn R. Carel H.J. Frost F. Spaepen Robert Mitchell Betar M. Gallant Henry I. Smith L. A. Clevenger
Topics: Copper Interconnects and Reliability (131 papers)Semiconductor materials and devices (121 papers)Electronic Packaging and Soldering Technologies (75 papers)
Cited by: Electronic, Optical and Magnetic Materials Materials Chemistry Electrical and Electronic Engineering
Journals: Nature Science Physical Review Letters
Partner nations: United States Singapore Germany

In The Last Decade

Carl V. Thompson

384 papers receiving 19.8k citations

Hit Papers

5 papers align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Solid-State Dewetting of Thin Films

2012 925 citations Carl V. Thompson profile →
Structure Evolution During Processing of Polycrystalline Films

2000 708 citations Carl V. Thompson profile →
Grain Growth in Thin Films

1990 552 citations Carl V. Thompson profile →
All-carbon-nanofiber electrodes for high-energy rechargeable Li–O2 batteries

2011 495 citations Carl V. Thompson et al. profile →
Stress and grain growth in thin films

1996 424 citations Carl V. Thompson et al. profile →
Influence of Li2O2 morphology on oxygen reduction and evolution kinetics in Li–O2 batteries

2013 399 citations Carl V. Thompson et al. profile →
On the approximation of the free energy change on crystallization

1979 375 citations Carl V. Thompson et al. profile →

Peers

Countries citing papers authored by Carl V. Thompson

Since Specialization

Citations

This map shows the geographic impact of Carl V. Thompson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Carl V. Thompson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Carl V. Thompson more than expected).

Fields of papers citing papers by Carl V. Thompson

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Carl V. Thompson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Carl V. Thompson. The network helps show where Carl V. Thompson may publish in the future.

Co-authorship network of co-authors of Carl V. Thompson

This figure shows the co-authorship network connecting the top 25 collaborators of Carl V. Thompson. A scholar is included among the top collaborators of Carl V. Thompson based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Carl V. Thompson. Carl V. Thompson is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	A level-set method for simulating solid-state dewetting in systems with strong crystalline anisotropy 2024 ·Acta Materialia ·(unknown),Carl V. Thompson,(unknown)	3
2	Bound-Constrained Expectation Maximization for Weibull Competing-Risks Device Reliability 2024 ·IEEE Transactions on Device and Materials Reliability ·(unknown),Duane S. Boning,Carl V. Thompson	0
3	Silicate-Based Packaging Materials for Heterogeneous Integration of Microsystems 2024 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·(unknown),(unknown),(unknown),(unknown),(unknown),Carl V. Thompson,Bradley Duncan	0
4	Time‐Temperature‐Transformation (TTT) Diagram of Battery‐Grade Li‐Garnet Electrolytes for Low‐Temperature Sustainable Synthesis 2023 ·Angewandte Chemie International Edition ·Yuntong Zhu,Michael J. Chon,Carl V. Thompson,Jennifer L. M. Rupp	16
5	Identification of Multiple Failure Mechanisms for Device Reliability Using Differential Evolution 2023 ·IEEE Transactions on Device and Materials Reliability ·(unknown),(unknown),Duane S. Boning,Carl V. Thompson	2
6	Time‐Temperature‐Transformation (TTT) Diagram of Battery‐Grade Li‐Garnet Electrolytes for Low‐Temperature Sustainable Synthesis 2023 ·Angewandte Chemie ·Yuntong Zhu,Michael J. Chon,Carl V. Thompson,Jennifer L. M. Rupp	7
7	First-order amorphous-to-amorphous phase transitions during lithiation of silicon thin films 2020 ·Physical Review Materials ·(unknown),Baoming Wang,Carl V. Thompson	5
8	Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation 2017 ·Microelectronics Reliability ·Wardhana Aji Sasangka,(unknown),Yu Gao,Riko I Made,Chee Lip Gan,Carl V. Thompson	10
9	Porosimetry and packing morphology of vertically aligned carbon nanotube arrays via impedance spectroscopy 2016 ·Nanotechnology ·(unknown),Yuan Lü,Itai Y. Stein,H. Jeremy Cho,Matthew E. Suss,Tahar Laoui,Carl V. Thompson,Brian L. Wardle,Evelyn N. Wang	19
10	Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits 2011 ·Acta Materialia ·Riko I Made,Chee Lip Gan,(unknown),(unknown),(unknown),K. L. Pey,Carl V. Thompson	20
11	Templated Solid‐State Dewetting to Controllably Produce Complex Patterns 2011 ·Advanced Materials ·Jongpil Ye,Carl V. Thompson	125
12	Parallel fabrication of polymer-protected nanogaps 2010 ·Nanotechnology ·(unknown),Carl V. Thompson,Francesco Stellacci,John T. L. Thong	8
13	Weak temperature dependence of stress relaxation in as-deposited polycrystalline gold films 2010 ·Physical Review B ·J. Leib,Carl V. Thompson	17
14	Direct Evidence for Effects of Grain Structure on Reversible Compressive Deposition Stresses in Polycrystalline Gold Films 2009 ·APS ·Carl V. Thompson,Reiner Mönig,J. Leib	3
15	Direct Evidence for Effects of Grain Structure on Reversible Compressive Deposition Stresses in Polycrystalline Gold Films 2009 ·Physical Review Letters ·J. Leib,Reiner Mönig,Carl V. Thompson	53
16	Dorzolamide and Timolol Saves Retinal Ganglion Cells in Glaucomatous Adult Rats 2005 ·Journal of Ocular Pharmacology and Therapeutics ·(unknown),(unknown),Carl V. Thompson,Kiran Patil,Sansar Sharma	5
17	Anion Adsorption Induced Reversal of Coherency Strain 2005 ·Physical Review Letters ·(unknown),Lei Tang,Natasa Vasiljevic,Nikolay Dimitrov,Mark van Schilfgaarde,Cody Friesen,Carl V. Thompson,Steven C. Seel,J. A. Floro,K. Sieradzki	23
18	Reversible Stress Relaxation during Precoalescence Interruptions of Volmer-Weber Thin Film Growth 2002 ·Physical Review Letters ·Cody Friesen,Carl V. Thompson	109
19	The Effects of the Mechanical Properties of the Confinement Material on Electromigration in Metallic Interconnects 2000 ·MRS Proceedings ·Stefan P. Hau‐Riege,Carl V. Thompson	4
20	Polysilicon films and interfaces 1988 ·OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) ·C. Y. Wong,K. N. Tu,Carl V. Thompson	27

About Carl V. Thompson

Carl V. Thompson is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Materials Chemistry, having authored 387 papers that have together received 20.3k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (131 papers), Semiconductor materials and devices (121 papers) and Electronic Packaging and Soldering Technologies (75 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (5.6k citations), Materials Chemistry (8.7k citations) and Electrical and Electronic Engineering (10.4k citations). Carl V. Thompson has collaborated with scholars based in United States, Singapore and Germany. Frequent co-authors include Yang Shao‐Horn, R. Carel, H.J. Frost, F. Spaepen, Robert Mitchell, Betar M. Gallant, Henry I. Smith, L. A. Clevenger, David G. Kwabi and E. Jiran. Their work appears in journals such as Nature, Science and Physical Review Letters.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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