Timothy Gosselin

917 total citations
8 papers, 778 citations indexed

About

Timothy Gosselin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, Timothy Gosselin has authored 8 papers receiving a total of 778 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Aerospace Engineering. Recurrent topics in Timothy Gosselin's work include Electronic Packaging and Soldering Technologies (8 papers), Advanced Welding Techniques Analysis (6 papers) and 3D IC and TSV technologies (6 papers). Timothy Gosselin is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Advanced Welding Techniques Analysis (6 papers) and 3D IC and TSV technologies (6 papers). Timothy Gosselin collaborates with scholars based in United States and South Korea. Timothy Gosselin's co-authors include Da‐Yuan Shih, Sung K. Kang, Karl J. Puttlitz, Donald W. Henderson, C. C. Goldsmith, Amit Sarkhel, Won Kyoung Choi, Paul Lauro, Donovan N. Leonard and Sung‐Il Cho and has published in prestigious journals such as Journal of materials research/Pratt's guide to venture capital sources, JOM and MATERIALS TRANSACTIONS.

In The Last Decade

Timothy Gosselin

8 papers receiving 747 citations

Peers

Countries citing papers authored by Timothy Gosselin

Since Specialization

Citations

This map shows the geographic impact of Timothy Gosselin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Timothy Gosselin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Timothy Gosselin more than expected).

Fields of papers citing papers by Timothy Gosselin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Timothy Gosselin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Timothy Gosselin. The network helps show where Timothy Gosselin may publish in the future.

Co-authorship network of co-authors of Timothy Gosselin

This figure shows the co-authorship network connecting the top 25 collaborators of Timothy Gosselin. A scholar is included among the top collaborators of Timothy Gosselin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Timothy Gosselin. Timothy Gosselin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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8 of 8 papers shown

#	Work	Indexed citations
1	The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints 2004 ·MATERIALS TRANSACTIONS ·Sung K. Kang, Paul Lauro, Da‐Yuan Shih, Donald W. Henderson, (unknown), Timothy Gosselin, (unknown), C. C. Goldsmith, Karl J. Puttlitz, (unknown), Won Kyoung Choi	36
2	The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue 2004 ·Journal of materials research/Pratt's guide to venture capital sources ·Donald W. Henderson, (unknown), Timothy Gosselin, (unknown), David E. King, Tia‐Marje Korhonen, M. A. Korhonen, L.P. Lehman, E. J. Cotts, Sung K. Kang, Paul Lauro, Da‐Yuan Shih, C. C. Goldsmith, Karl J. Puttlitz	169
3	Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying 2004 ·JOM ·Sung K. Kang, Da‐Yuan Shih, Donovan N. Leonard, Donald W. Henderson, Timothy Gosselin, Sung‐Il Cho, Jin Yu, Won Kyoung Choi	138
4	Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents 2004 ·S. K. Kang, Paul Lauro, Da‐Yuan Shih, D. W. Henderson, Timothy Gosselin, (unknown), (unknown), C. C. Goldsmith, Karl J. Puttlitz, (unknown)	36
5	Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu 2003 ·JOM ·Sung K. Kang, Da‐Yuan Shih, (unknown), Wesley A. Henderson, Timothy Gosselin, Amit Sarkhel, (unknown), Karl J. Puttlitz, Won Kyoung Choi	143
6	Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates 2003 ·S. K. Kang, Wooseok Choi, Da‐Yuan Shih, Paul Lauro, D. W. Henderson, Timothy Gosselin, Donovan N. Leonard	17
7	Interfacial reaction studies on lead (Pb)-free solder alloys 2002 ·IEEE Transactions on Electronics Packaging Manufacturing ·S. K. Kang, Da‐Yuan Shih, Keith Fogel, Paul Lauro, Myung-Jin Yim, (unknown), (unknown), C. C. Goldsmith, D. W. Henderson, Timothy Gosselin, (unknown), Joachim Konrad, Amit Sarkhel, Karl J. Puttlitz	69
8	Ag₃Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys 2002 ·Journal of materials research/Pratt's guide to venture capital sources ·Donald W. Henderson, Timothy Gosselin, Amit Sarkhel, Sung K. Kang, (unknown), Da‐Yuan Shih, C. C. Goldsmith, Karl J. Puttlitz	170

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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