Jun Wei

21.8k total citations · 8 hit papers
356 papers, 18.4k citations indexed

About

Jun Wei is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Jun Wei has authored 356 papers receiving a total of 18.4k indexed citations (citations by other indexed papers that have themselves been cited), including 168 papers in Electrical and Electronic Engineering, 136 papers in Mechanical Engineering and 117 papers in Materials Chemistry. Recurrent topics in Jun Wei's work include Electronic Packaging and Soldering Technologies (81 papers), Additive Manufacturing and 3D Printing Technologies (64 papers) and 3D IC and TSV technologies (60 papers). Jun Wei is often cited by papers focused on Electronic Packaging and Soldering Technologies (81 papers), Additive Manufacturing and 3D Printing Technologies (64 papers) and 3D IC and TSV technologies (60 papers). Jun Wei collaborates with scholars based in Singapore, China and United Kingdom. Jun Wei's co-authors include Mui Ling Sharon Nai, Kun Zhou, Yuan Chen, Shaobin Liu, Renbing Wu, Rongrong Jiang, Tingying Helen Zeng, Jing Kong, Manoj Gupta and Mario Hofmann and has published in prestigious journals such as Journal of the American Chemical Society, Advanced Materials and SHILAP Revista de lepidopterología.

In The Last Decade

Jun Wei

340 papers receiving 18.0k citations

Hit Papers

Antibacterial Activity of... 2011 2026 2016 2021 2011 2012 2015 2018 2012 500 1000 1.5k 2.0k

Author Peers

Peers are selected by citation overlap in the author's most active subfields. citations · hero ref

Author Last Decade Papers Cites
Jun Wei 7.7k 6.8k 5.6k 5.3k 3.4k 356 18.4k
Kechao Zhou 6.9k 0.9× 7.5k 1.1× 2.9k 0.5× 5.2k 1.0× 1.6k 0.5× 562 16.7k
Paolo Colombo 4.6k 0.6× 6.9k 1.0× 2.0k 0.4× 4.0k 0.8× 4.0k 1.2× 455 18.2k
Kyu Hwan Oh 4.9k 0.6× 4.2k 0.6× 5.0k 0.9× 5.1k 1.0× 1.3k 0.4× 321 15.3k
Dechang Jia 5.7k 0.7× 10.4k 1.5× 3.6k 0.6× 3.6k 0.7× 845 0.2× 718 20.7k
Eric B. Duoss 3.4k 0.4× 2.6k 0.4× 4.2k 0.8× 5.7k 1.1× 2.9k 0.9× 127 13.3k
Yonggang Yao 4.5k 0.6× 6.9k 1.0× 11.4k 2.0× 4.8k 0.9× 4.3k 1.3× 228 25.3k
Li Lü 6.0k 0.8× 8.5k 1.3× 17.5k 3.1× 2.7k 0.5× 5.1k 1.5× 616 26.7k
Abdolreza Simchi 6.2k 0.8× 5.3k 0.8× 2.0k 0.4× 3.9k 0.7× 1.6k 0.5× 330 14.8k
Christopher M. Spadaccini 3.8k 0.5× 2.0k 0.3× 2.2k 0.4× 4.8k 0.9× 2.8k 0.8× 87 10.9k
Nikhil Koratkar 4.8k 0.6× 15.9k 2.3× 11.1k 2.0× 7.1k 1.3× 1.8k 0.5× 289 29.0k

Countries citing papers authored by Jun Wei

Since Specialization
Citations

This map shows the geographic impact of Jun Wei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jun Wei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jun Wei more than expected).

Fields of papers citing papers by Jun Wei

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jun Wei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jun Wei. The network helps show where Jun Wei may publish in the future.

Co-authorship network of co-authors of Jun Wei

This figure shows the co-authorship network connecting the top 25 collaborators of Jun Wei. A scholar is included among the top collaborators of Jun Wei based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jun Wei. Jun Wei is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Yang, Zhe, Shuo Qu, Boxuan Cao, et al.. (2025). Ultrastrong yet ductile additively manufactured multicomponent alloy-based composite strengthened by triple nanoprecipitates. Materials Research Letters. 14(2). 142–151.
2.
Liang, Cunman, Zhi‐Jun Zhao, Xi Zhang, et al.. (2025). Metallic nanoparticle inks for flexible printed electronics. SHILAP Revista de lepidopterología. 2(2). 225–283. 3 indexed citations
4.
Dai, Ying, Zhenyu Song, Yan Wang, et al.. (2025). Polarized microenvironment-modulated covalent organic frameworks with nickel single atoms for enhanced CO2 photoreduction. Chemical Engineering Journal. 511. 162084–162084. 7 indexed citations
5.
Wang, Rui, et al.. (2025). Creep-fatigue lifetime prediction of GH720Li superalloy considering effect of grain size. Transactions of Nonferrous Metals Society of China. 35(3). 863–871.
6.
Zhang, Qianqian, Weidong Zhu, Xiaqing Zhang, et al.. (2025). Regulated synthesis of a novel quantum dot gas sensitive material EuVO4 and its gas sensitive properties to triethylamine. Journal of Alloys and Compounds. 1035. 181598–181598. 1 indexed citations
7.
Wang, Bo, et al.. (2024). Soft sensor modeling method for Pichia pastoris fermentation process based on substructure domain transfer learning. BMC Biotechnology. 24(1). 104–104. 2 indexed citations
8.
Li, Yida, Xuewei Feng, Maheswari Sivan, et al.. (2020). Aerosol Jet Printed WSe2 Crossbar Architecture Device on Kapton With Dual Functionality as Resistive Memory and Photosensor for Flexible System Integration. IEEE Sensors Journal. 20(9). 4653–4659. 24 indexed citations
9.
Yang, Wenlong, et al.. (2014). The structure and optical properties of lead-free transparent KNLTN-La0.01 ceramics prepared by conventional sintering technique. Materials Science-Poland. 32(4). 597–603. 1 indexed citations
10.
Wei, Jun. (2013). The Influence of Difficulty and Value on Senior One Students' Choice of Stop Study,Massed Study and Spaced Study. Xinli fazhan yu jiaoyu. 1 indexed citations
11.
Wei, Jun. (2012). Flexural stiffness model of corroded reinforced concrete eccentric compression members considering bond slip. Ziran zaihai xuebao. 1 indexed citations
12.
Wei, Jun. (2011). Experimental study of behavior of lap splice of corrosive reinforcing bars in concrete. Engineering Journal of Wuhan University.
13.
Xu, Gang & Jun Wei. (2011). Prediction Model on the Rebar Corrosion Depth in Concrete. Journal of Building Materials. 1 indexed citations
14.
Ding, Xing-zhao, et al.. (2008). Influence of Substrate Hardness on the Properties of PVD Hard Coatings. Synthesis and Reactivity in Inorganic Metal-Organic and Nano-Metal Chemistry. 38(2). 156–161. 9 indexed citations
15.
Wei, Jun. (2005). Experimental study on the pump concrete and plain concrete after freeze-thaw cycles. 1 indexed citations
16.
Wei, Jun. (2005). Sharp degradation point of concrete under freezing-thawing cycles. Concrete. 3 indexed citations
17.
Wei, Jun. (2005). Selecting Model of Set in Low-Lift-Head Pumping Station in Jiangsu's First-stage of South-to-North Water Diversion Project. 1 indexed citations
18.
Wei, Jun. (2002). CO_2 Reforming of CH 4 over Ni Supported on Nano-ZrO_2(I) Comparison with Conventional Oxide Supported Nickel. Chemical Research in Chinese Universities. 2 indexed citations
19.
Wei, Jun, et al.. (2002). Stability and Global Hopf Bifurcation for Neutral Differential Equations. Acta Mathematica Sinica English Series. 25 indexed citations
20.
Wei, Jun & Peter Hing. (2002). Electrical properties of reactively sputtered carbon nitride films. Thin Solid Films. 410(1-2). 21–27. 19 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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