Vivek Chidambaram

855 total citations
36 papers, 661 citations indexed

About

Vivek Chidambaram is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science. According to data from OpenAlex, Vivek Chidambaram has authored 36 papers receiving a total of 661 indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 6 papers in General Materials Science. Recurrent topics in Vivek Chidambaram's work include Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (21 papers) and Copper Interconnects and Reliability (6 papers). Vivek Chidambaram is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (21 papers) and Copper Interconnects and Reliability (6 papers). Vivek Chidambaram collaborates with scholars based in Singapore, Denmark and India. Vivek Chidambaram's co-authors include Jesper Henri Hattel, John Hald, Shan Gao, Bangtao Chen, Ling Xie, Masaya Kawano, Xiangyu Wang, Chee Lip Gan, Ser Choong Chong and Rajan Ambat and has published in prestigious journals such as Journal of Alloys and Compounds, JOM and Journal of Electronic Materials.

In The Last Decade

Vivek Chidambaram

34 papers receiving 639 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Vivek Chidambaram Singapore 13 569 361 74 66 64 36 661
K. Sakamoto Japan 10 428 0.8× 475 1.3× 82 1.1× 25 0.4× 89 1.4× 12 606
G. Humpston United Kingdom 12 303 0.5× 287 0.8× 62 0.8× 40 0.6× 36 0.6× 29 458
Won Kyoung Choi South Korea 16 977 1.7× 628 1.7× 60 0.8× 51 0.8× 45 0.7× 32 1.0k
Y. C. Chan Hong Kong 18 1.1k 1.9× 692 1.9× 60 0.8× 74 1.1× 56 0.9× 57 1.1k
Ryszard Kisiel Poland 11 404 0.7× 221 0.6× 49 0.7× 21 0.3× 40 0.6× 67 456
Barbara Horváth Hungary 14 355 0.6× 191 0.5× 22 0.3× 57 0.9× 23 0.4× 31 445
Rong An China 16 506 0.9× 364 1.0× 21 0.3× 54 0.8× 30 0.5× 55 654
G. Matijasevic United States 10 465 0.8× 198 0.5× 37 0.5× 64 1.0× 73 1.1× 27 539
Yi-Wun Wang Taiwan 14 684 1.2× 535 1.5× 55 0.7× 22 0.3× 26 0.4× 35 750
Y. Takaku Japan 14 494 0.9× 498 1.4× 140 1.9× 20 0.3× 54 0.8× 21 724

Countries citing papers authored by Vivek Chidambaram

Since Specialization
Citations

This map shows the geographic impact of Vivek Chidambaram's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Vivek Chidambaram with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Vivek Chidambaram more than expected).

Fields of papers citing papers by Vivek Chidambaram

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Vivek Chidambaram. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Vivek Chidambaram. The network helps show where Vivek Chidambaram may publish in the future.

Co-authorship network of co-authors of Vivek Chidambaram

This figure shows the co-authorship network connecting the top 25 collaborators of Vivek Chidambaram. A scholar is included among the top collaborators of Vivek Chidambaram based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Vivek Chidambaram. Vivek Chidambaram is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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2.
Elangovan, M., et al.. (2025). Influence of silane coupling treatment on friction and wear properties of polymeric composites reinforced with nano-ZnO particles. AIP conference proceedings. 3270. 20255–20255. 1 indexed citations
3.
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Ramkumar, G., et al.. (2024). Total losses and dispersion effects management and upgrading fiber reach in ultra-high optical transmission system based on hybrid amplification system. Journal of Optical Communications. 46(2). 289–298. 13 indexed citations
5.
Chidambaram, Vivek, et al.. (2021). Dielectric Materials Characterization for Hybrid Bonding. 426–431. 45 indexed citations
6.
Gourikutty, Sajay Bhuvanendran Nair, et al.. (2020). Non-destructive fault isolation in through-silicon interposer based system in package. 281–285. 4 indexed citations
7.
Chidambaram, Vivek, Qin Ren, & Masaya Kawano. (2019). Wafer Level Fusion and Hybrid Bonding: Impact of Critical Process Parameters on Bond Quality. 663–666. 3 indexed citations
8.
Chidambaram, Vivek, et al.. (2019). Hermetic Sealant Material Possibilities for IR Sensor Packaging. Journal of Electronic Materials. 48(10). 6470–6479. 1 indexed citations
9.
Chidambaram, Vivek, et al.. (2019). Development of 2.5D high density device on large ultra-thin active interposer. 247–252. 2 indexed citations
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11.
Hwang, How Yuan, et al.. (2013). Extreme high pressure and high temperature package development. 379–383. 4 indexed citations
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Chidambaram, Vivek, et al.. (2012). Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics. Journal of Electronic Materials. 41(8). 2107–2117. 47 indexed citations
14.
Chidambaram, Vivek, et al.. (2012). Development of CMOS Compatible Bonding Material and Process for Wafer Level MEMS Packaging Application under Harsh Environment. 2 indexed citations
15.
Chidambaram, Vivek, et al.. (2012). Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications. Journal of Electronic Materials. 41(8). 2256–2266. 8 indexed citations
16.
Chidambaram, Vivek, Ling Xie, & Bangtao Chen. (2012). Titanium-Based Getter Solution for Wafer-Level MEMS Vacuum Packaging. Journal of Electronic Materials. 42(3). 485–491. 33 indexed citations
17.
Chidambaram, Vivek, et al.. (2012). High-temperature endurable encapsulation material. 61–66. 7 indexed citations
18.
Chidambaram, Vivek, Jesper Henri Hattel, & John Hald. (2010). High-temperature lead-free solder alternatives. Microelectronic Engineering. 88(6). 981–989. 152 indexed citations
19.
Chidambaram, Vivek. (2010). Development of lead-free solders for high-temperature applications. 1 indexed citations
20.
Chidambaram, Vivek, John Hald, & Jesper Henri Hattel. (2008). Development of high melting point, environmentally friendly solders, using the calphad approach. Archives of Metallurgy and Materials. 53(4). 1111–1118. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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