Vivek Chidambaram
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 5%
- General Materials Science top 1%
- Biomedical Engineering
- Atomic and Molecular Physics, and Optics
- Co-authors
- John HaldJesper Henri HattelShan GaoBangtao ChenLing XieMasaya KawanoChee Lip GanXiangyu Wang
- Topics
- Electronic Packaging and Soldering Technologies (24 papers)3D IC and TSV technologies (21 papers)Copper Interconnects and Reliability (6 papers)
In The Last Decade
Vivek Chidambaram
34 papers receiving 639 citations
Peers
Comparison fields: 5 of 37
- Electrical and Electronic Engineering 569
- Mechanical Engineering 361
- General Materials Science 74
- Biomedical Engineering 66
- Atomic and Molecular Physics, and Optics 64
Countries citing papers authored by Vivek Chidambaram
This map shows the geographic impact of Vivek Chidambaram's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Vivek Chidambaram with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Vivek Chidambaram more than expected).
Fields of papers citing papers by Vivek Chidambaram
This network shows the impact of papers produced by Vivek Chidambaram. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Vivek Chidambaram. The network helps show where Vivek Chidambaram may publish in the future.
Co-authorship network of co-authors of Vivek Chidambaram
This figure shows the co-authorship network connecting the top 25 collaborators of Vivek Chidambaram. A scholar is included among the top collaborators of Vivek Chidambaram based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Vivek Chidambaram. Vivek Chidambaram is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 0 | |
| 4 | 13 | |
| 5 | 45 | |
| 6 | 4 | |
| 7 | 2 | |
| 8 | 1 | |
| 9 | 3 | |
| 10 | 4 | |
| 11 | 4 | |
| 12 | 13 | |
| 13 | 9 | |
| 14 | Development of CMOS Compatible Bonding Material and Process for Wafer Level MEMS Packaging Application under Harsh Environment | 2 |
| 15 | 8 | |
| 16 | 47 | |
| 17 | 152 | |
| 18 | Development of lead-free solders for high-temperature applications | 1 |
| 19 | 26 | |
| 20 | Development of high melting point, environmentally friendly solders, using the calphad approach | 4 |
About Vivek Chidambaram
Vivek Chidambaram is a scholar working on General Materials Science, Electrical and Electronic Engineering and Automotive Engineering, having authored 36 papers that have together received 661 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (21 papers) and Copper Interconnects and Reliability (6 papers). The work is most often cited by research in General Materials Science (74 citations), Electrical and Electronic Engineering (569 citations) and Mechanical Engineering (361 citations). Vivek Chidambaram has collaborated with scholars based in Singapore, Denmark and India. Frequent co-authors include John Hald, Jesper Henri Hattel, Shan Gao, Bangtao Chen, Ling Xie, Masaya Kawano, Chee Lip Gan, Xiangyu Wang, Rajan Ambat and Ser Choong Chong. Their work appears in journals such as Journal of Alloys and Compounds, JOM and Journal of Electronic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.