Sung K. Kang

2.3k total citations
55 papers, 2.0k citations indexed

About

Sung K. Kang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Sung K. Kang has authored 55 papers receiving a total of 2.0k indexed citations (citations by other indexed papers that have themselves been cited), including 43 papers in Electrical and Electronic Engineering, 22 papers in Mechanical Engineering and 6 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Sung K. Kang's work include Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (29 papers) and Advanced Welding Techniques Analysis (17 papers). Sung K. Kang is often cited by papers focused on Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (29 papers) and Advanced Welding Techniques Analysis (17 papers). Sung K. Kang collaborates with scholars based in United States, South Korea and Taiwan. Sung K. Kang's co-authors include Da‐Yuan Shih, Amit Sarkhel, Hyuck Mo Lee, Moon Gi Cho, Timothy Gosselin, Sun-Kyoung Seo, Donald W. Henderson, Jin Yu, Karl J. Puttlitz and Won Kyoung Choi and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Sung K. Kang

53 papers receiving 1.9k citations

Peers

Sung K. Kang

EEE

Y.C. Chan Hong Kong

Andreas Ostmann Germany

R. Aschenbrenner Germany

Tae-Kyu Lee United States

Daquan Yu China

M.O. Alam Hong Kong

Jong-ook Suh United States

J. Miettinen Finland

Seung Wook Yoon Singapore

Y.C. Chan Hong Kong

Sung K. Kang

2.2k ×1.2

EEE

1.2k ×0.9

184 ×0.4

271 ×1.5

301 ×2.2

Citations per year, relative to Sung K. Kang Sung K. Kang (= 1×) peers Y.C. Chan

Countries citing papers authored by Sung K. Kang

Since Specialization

Citations

This map shows the geographic impact of Sung K. Kang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sung K. Kang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sung K. Kang more than expected).

Fields of papers citing papers by Sung K. Kang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Sung K. Kang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sung K. Kang. The network helps show where Sung K. Kang may publish in the future.

Co-authorship network of co-authors of Sung K. Kang

This figure shows the co-authorship network connecting the top 25 collaborators of Sung K. Kang. A scholar is included among the top collaborators of Sung K. Kang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sung K. Kang. Sung K. Kang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Kang, Sung K., et al.. (2015). The Effect of the Types of Learning Material and Epistemological Beliefs in an Ill-structured Problem Solving. 16(2). 183–200. 1 indexed citations

Chang, Jae‐Won, et al.. (2013). Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions. Journal of Electronic Materials. 43(1). 259–269. 8 indexed citations

Cho, Moon Gi, Sung K. Kang, Sun-Kyoung Seo, Da‐Yuan Shih, & Hyuck Mo Lee. (2009). Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging. Journal of Electronic Materials. 38(11). 2242–2250. 18 indexed citations

Lu, Minhua, Da‐Yuan Shih, Paul Lauro, et al.. (2009). The effects of Ag, Cu compositions and Zn doping on the electromigration performance of Pb-free solders. 18. 922–929. 7 indexed citations

Cho, Moon Gi, Sung K. Kang, Sun-Kyoung Seo, Da‐Yuan Shih, & Hyuck Mo Lee. (2009). Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders. Journal of materials research/Pratt's guide to venture capital sources. 24(2). 534–543. 15 indexed citations

Seo, Sun-Kyoung, Sung K. Kang, Moon Gi Cho, Da‐Yuan Shih, & Hyuck Mo Lee. (2009). The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy. Journal of Electronic Materials. 38(12). 2461–2469. 55 indexed citations

Kang, Sung K., et al.. (2008). Color Based Hand and Finger Detection Technology for User Interaction. 229–236. 62 indexed citations

Kang, Sung K., et al.. (2008). An overview of Pb-free, flip-chip wafer-bumping technologies. JOM. 60(6). 66–70. 17 indexed citations

Cho, Moon Gi, Sung K. Kang, Da‐Yuan Shih, & Hyuck Mo Lee. (2007). Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging. Journal of Electronic Materials. 36(11). 1501–1509. 121 indexed citations

10.

Kang, Sung K., et al.. (2007). Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process. Journal of materials research/Pratt's guide to venture capital sources. 22(3). 557–560. 32 indexed citations

11.

Chawla, Nikhilesh, et al.. (2006). Foreword. Journal of Electronic Materials. 35(12). 2073–2073. 1 indexed citations

12.

Choi, Won Kyoung, et al.. (2004). Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints. 1190–1196. 6 indexed citations

13.

Kang, Sung K., Paul Lauro, Da‐Yuan Shih, et al.. (2004). The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints. MATERIALS TRANSACTIONS. 45(3). 695–702. 36 indexed citations

14.

Henderson, Donald W., Timothy Gosselin, David E. King, et al.. (2004). The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue. Journal of materials research/Pratt's guide to venture capital sources. 19(6). 1608–1612. 169 indexed citations

15.

Lauro, Paul, Sung K. Kang, Won Kyoung Choi, & Da‐Yuan Shih. (2003). Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders. Journal of Electronic Materials. 32(12). 1432–1440. 39 indexed citations

16.

Kang, Sung K., Da‐Yuan Shih, Wesley A. Henderson, et al.. (2003). Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu. JOM. 55(6). 61–65. 143 indexed citations

17.

Kang, Sung K., et al.. (2003). Effect of deposition conditions of poly Si1−xGex films and Ge atoms on the electrical properties of poly Si1−xGex (x=0,0.6)/HfO2 gate stack. Journal of Applied Physics. 94(7). 4608–4613. 3 indexed citations

18.

Frear, D. R., et al.. (2002). Foreword. Journal of Electronic Materials. 31(11). 1129–1129. 4 indexed citations

19.

Kang, Sung K. & S. Purushothaman. (1999). Development of conducting adhesive materials for microelectronic applications. Journal of Electronic Materials. 28(11). 1314–1318. 50 indexed citations

20.

Kang, Sung K., N. Zommer, D.L. Feucht, & R. W. Heckel. (1977). Thermal Fatigue Failure of Soft-Soldered Contacts to Silicon Power Transistors. IEEE Transactions on Parts Hybrids and Packaging. 13(3). 318–321. 23 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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