Soon Wee Ho

1.0k total citations
55 papers, 736 citations indexed

About

Soon Wee Ho is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, Soon Wee Ho has authored 55 papers receiving a total of 736 indexed citations (citations by other indexed papers that have themselves been cited), including 53 papers in Electrical and Electronic Engineering, 11 papers in Electronic, Optical and Magnetic Materials and 10 papers in Biomedical Engineering. Recurrent topics in Soon Wee Ho's work include 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (36 papers) and Copper Interconnects and Reliability (11 papers). Soon Wee Ho is often cited by papers focused on 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (36 papers) and Copper Interconnects and Reliability (11 papers). Soon Wee Ho collaborates with scholars based in Singapore, United States and Taiwan. Soon Wee Ho's co-authors include V. Kripesh, John H. Lau, Seung Wook Yoon, D. Pinjala, Teck Guan Lim, Aibin Yu, Gaurav Sharma, Ka Fai Chang, Aditya Kumar and Aditya Kumar and has published in prestigious journals such as IEEE Transactions on Electron Devices, Microelectronics Reliability and IEEE Transactions on Components Packaging and Manufacturing Technology.

In The Last Decade

Soon Wee Ho

50 papers receiving 697 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Soon Wee Ho Singapore 15 674 115 74 72 66 55 736
David Ho Singapore 12 583 0.9× 113 1.0× 32 0.4× 70 1.0× 27 0.4× 47 632
Sri M. Sri-Jayantha United States 8 672 1.0× 109 0.9× 85 1.1× 104 1.4× 71 1.1× 14 776
Yu-Min Lin Taiwan 15 621 0.9× 55 0.5× 73 1.0× 53 0.7× 61 0.9× 68 649
Cheryl Selvanayagam Singapore 14 733 1.1× 135 1.2× 114 1.5× 99 1.4× 39 0.6× 39 790
Guruprasad Katti Belgium 13 1.0k 1.5× 140 1.2× 90 1.2× 39 0.5× 105 1.6× 27 1.1k
Douglas Yu Taiwan 19 1.1k 1.6× 138 1.2× 93 1.3× 59 0.8× 17 0.3× 58 1.2k
Maaike M. Visser Taklo Norway 14 526 0.8× 150 1.3× 45 0.6× 101 1.4× 55 0.8× 54 603
A. Farcy France 17 834 1.2× 109 0.9× 54 0.7× 38 0.5× 59 0.9× 102 936
Navas Khan Singapore 15 545 0.8× 132 1.1× 137 1.9× 157 2.2× 29 0.4× 46 666
Joeri De Vos Belgium 17 797 1.2× 176 1.5× 107 1.4× 75 1.0× 34 0.5× 98 861

Countries citing papers authored by Soon Wee Ho

Since Specialization
Citations

This map shows the geographic impact of Soon Wee Ho's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Soon Wee Ho with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Soon Wee Ho more than expected).

Fields of papers citing papers by Soon Wee Ho

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Soon Wee Ho. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Soon Wee Ho. The network helps show where Soon Wee Ho may publish in the future.

Co-authorship network of co-authors of Soon Wee Ho

This figure shows the co-authorship network connecting the top 25 collaborators of Soon Wee Ho. A scholar is included among the top collaborators of Soon Wee Ho based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Soon Wee Ho. Soon Wee Ho is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Ho, Soon Wee, et al.. (2019). Ultra-Thin FO Package-on-Package for Mobile Application. 21–27. 11 indexed citations
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Ho, Soon Wee, et al.. (2016). Laser de-bonding process development of glass substrate for Fan-out wafer level packaging. 43–46. 8 indexed citations
7.
Chui, King Jien, et al.. (2016). Evaluation on multiple layer PBO-based Cu RDL process for Fan-Out Wafer Level Packaging (FOWLP). 662–665. 2 indexed citations
8.
Ho, Soon Wee, et al.. (2014). 2.5D through silicon interposer package fabrication by chip-on-wafer (CoW) approach. 679–683. 4 indexed citations
9.
Khan, Navas, Li Yu, Soon Wee Ho, et al.. (2013). 3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections. IEEE Transactions on Components Packaging and Manufacturing Technology. 3(2). 221–228. 40 indexed citations
10.
Yu, Aibin, Aditya Kumar, Soon Wee Ho, et al.. (2012). Development of 25-$\mu{\rm m}$-Pitch Microbumps for 3-D Chip Stacking. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(11). 1777–1785. 10 indexed citations
11.
Ho, Soon Wee, et al.. (2011). Development of Via in Mold (ViM) for embedded wafer level package (EWMLP). 417–422. 7 indexed citations
12.
Zhang, Xiaowu, R. Rajoo, Cheryl Selvanayagam, et al.. (2010). A low stress bond pad design for low temperature solder interconnections on through silicon vias (TSVs). 1657–1663. 1 indexed citations
13.
Rajoo, R., et al.. (2010). Embedding of 15um thin chip and passives in thin flexible substrate. 77. 489–496. 6 indexed citations
14.
Li, Rui, et al.. (2010). Wideband bandpass filter design for D-band application. 2. 1–4. 1 indexed citations
15.
Ho, Soon Wee, et al.. (2009). Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. Microelectronics Reliability. 49(2). 150–162. 15 indexed citations
16.
Yu, Aibin, John H. Lau, Soon Wee Ho, et al.. (2009). Study of 15µm pitch solder microbumps for 3D IC integration. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 6–10. 52 indexed citations
17.
Vaidyanathan, Kripesh, Soon Wee Ho, Vasarla Nagendra Sekhar, et al.. (2008). Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package. 613–619. 1 indexed citations
18.
Ho, Soon Wee, et al.. (2006). Development of coaxial shield via in silicon carrier for high frequency application. 825–830. 21 indexed citations
19.
Ho, Soon Wee, et al.. (2004). Shear Strength Prediction by Modified Plasticity Theory for High-Strength Concrete Deep Beams. 494–497. 1 indexed citations
20.
Choy, Jin‐Ho, et al.. (1997). Structural Phase Transformation of Layered Hydroxy Double Salts, $Ni_{1-x}Zn_{2x}(OH)_2(CH_3COO){2x}$·$nH_2O$, Depending on Hydration Degree. Bulletin of the Korean Chemical Society. 18(4). 450–453. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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