Karl J. Puttlitz

1.7k total citations
21 papers, 1.3k citations indexed

About

Karl J. Puttlitz is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, Karl J. Puttlitz has authored 21 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 4 papers in Aerospace Engineering. Recurrent topics in Karl J. Puttlitz's work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (12 papers) and Advanced Welding Techniques Analysis (5 papers). Karl J. Puttlitz is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (12 papers) and Advanced Welding Techniques Analysis (5 papers). Karl J. Puttlitz collaborates with scholars based in United States and South Korea. Karl J. Puttlitz's co-authors include Da‐Yuan Shih, G.T. Galyon, Timothy Gosselin, Sung K. Kang, Paul Lauro, C. C. Goldsmith, Amit Sarkhel, Donald W. Henderson, D. W. Henderson and S. K. Kang and has published in prestigious journals such as Journal of materials research/Pratt's guide to venture capital sources, IBM Journal of Research and Development and JOM.

In The Last Decade

Karl J. Puttlitz

21 papers receiving 1.2k citations

Peers

Karl J. Puttlitz

EEE

Yoshiharu Kariya Japan

W. Jillek Germany

Yiyu Qian China

Nan Jiang China

Z. Mei United States

Agata Skwarek Poland

E. Ristolainen Finland

Sun-Kyoung Seo South Korea

Guang Chen China

Bismarck Luiz Silva Brazil

Yoshiharu Kariya Japan

Karl J. Puttlitz

1.0k ×0.8

EEE

885 ×1.1

230 ×0.9

99 ×0.7

211 ×1.7

Citations per year, relative to Karl J. Puttlitz Karl J. Puttlitz (= 1×) peers Yoshiharu Kariya

Countries citing papers authored by Karl J. Puttlitz

Since Specialization

Citations

This map shows the geographic impact of Karl J. Puttlitz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Karl J. Puttlitz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Karl J. Puttlitz more than expected).

Fields of papers citing papers by Karl J. Puttlitz

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Karl J. Puttlitz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Karl J. Puttlitz. The network helps show where Karl J. Puttlitz may publish in the future.

Co-authorship network of co-authors of Karl J. Puttlitz

This figure shows the co-authorship network connecting the top 25 collaborators of Karl J. Puttlitz. A scholar is included among the top collaborators of Karl J. Puttlitz based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Karl J. Puttlitz. Karl J. Puttlitz is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Puttlitz, Karl J. & G.T. Galyon. (2006). Impact of the ROHS directive on high-performance electronic systems. Part I need for lead utilization in exempt systems. ANU Open Research (Australian National University). 18. 331–346. 17 indexed citations

Puttlitz, Karl J. & G.T. Galyon. (2006). Impact of the ROHS Directive on high-performance electronic systems. Part II key reliability issues preventing the implementation of lead-free solders. Journal of Materials Science Materials in Electronics. 18. 347–365. 44 indexed citations

Puttlitz, Karl J. & G.T. Galyon. (2006). Impact of the ROHS Directive on high-performance electronic systems. Journal of Materials Science Materials in Electronics. 18(1-3). 347–365. 79 indexed citations

Puttlitz, Karl J. & G.T. Galyon. (2006). Impact of the ROHS directive on high-performance electronic systems. Journal of Materials Science Materials in Electronics. 18(1-3). 331–346. 16 indexed citations

Kang, S. K., Paul Lauro, Da‐Yuan Shih, D. W. Henderson, & Karl J. Puttlitz. (2005). Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications. IBM Journal of Research and Development. 49(4.5). 607–620. 113 indexed citations

Kang, Sung K., Paul Lauro, Da‐Yuan Shih, et al.. (2004). The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints. MATERIALS TRANSACTIONS. 45(3). 695–702. 36 indexed citations

Henderson, Donald W., Timothy Gosselin, David E. King, et al.. (2004). The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue. Journal of materials research/Pratt's guide to venture capital sources. 19(6). 1608–1612. 169 indexed citations

Puttlitz, Karl J., et al.. (2004). Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. 301 indexed citations

Korhonen, Tia‐Marje, et al.. (2004). Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates. Journal of Electronic Materials. 33(12). 1581–1588. 20 indexed citations

10.

Kang, S. K., Paul Lauro, Da‐Yuan Shih, et al.. (2004). Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents. 661–667. 36 indexed citations

11.

Kang, Sung K., Da‐Yuan Shih, Wesley A. Henderson, et al.. (2003). Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu. JOM. 55(6). 61–65. 143 indexed citations

12.

Puttlitz, Karl J., et al.. (2002). Effect of material properties on the fatigue life of dual solder (DS) ceramic ball grid array (CBGA) solder joints. 40. 1005–1010. 2 indexed citations

13.

Puttlitz, Karl J., et al.. (2002). C-4/BGA comparison with other MLC single chip package alternatives. 21. 16–21. 3 indexed citations

14.

Kang, S. K., Da‐Yuan Shih, Keith Fogel, et al.. (2002). Interfacial reaction studies on lead (Pb)-free solder alloys. IEEE Transactions on Electronics Packaging Manufacturing. 25(3). 155–161. 69 indexed citations

15.

Henderson, Donald W., Timothy Gosselin, Amit Sarkhel, et al.. (2002). Ag₃Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys. Journal of materials research/Pratt's guide to venture capital sources. 17(11). 2775–2778. 170 indexed citations

16.

Puttlitz, Karl J. & P. A. Totta. (2001). Area Array Interconnection Handbook. 46 indexed citations

17.

Puttlitz, Karl J., et al.. (1998). Solder transfer technique for flip-chip and electronic assembly applications. 21(3). 182–188. 5 indexed citations

18.

Puttlitz, Karl J., et al.. (1995). C-4/CBGA comparison with other MLC single chip package alternatives. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 18(2). 250–256. 5 indexed citations

19.

Puttlitz, Karl J.. (1990). Corrosion of Pb-50In flip-chip interconnections exposed to harsh environment. IEEE Transactions on Components Hybrids and Manufacturing Technology. 13(1). 188–193. 10 indexed citations

20.

Puttlitz, Karl J.. (1990). Preparation, structure, and fracture modes of Pb-Sn and Pb-In terminated flip-chips attached to gold capped microsockets. IEEE Transactions on Components Hybrids and Manufacturing Technology. 13(4). 647–655. 25 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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