Aditya P. Karmarkar

726 total citations
24 papers, 607 citations indexed

About

Aditya P. Karmarkar is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Aditya P. Karmarkar has authored 24 papers receiving a total of 607 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 10 papers in Biomedical Engineering and 5 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Aditya P. Karmarkar's work include 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (12 papers) and Advanced Surface Polishing Techniques (10 papers). Aditya P. Karmarkar is often cited by papers focused on 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (12 papers) and Advanced Surface Polishing Techniques (10 papers). Aditya P. Karmarkar collaborates with scholars based in United States, Switzerland and Belgium. Aditya P. Karmarkar's co-authors include Xiaopeng Xu, Daniel M. Fleetwood, Ronald D. Schrimpf, Victor Moroz, B. D. White, L. J. Brillson, Umesh K. Mishra, Robert A. Weller, Bongim Jun and M. Bataiev and has published in prestigious journals such as IEEE Transactions on Nuclear Science, IEEE Transactions on Device and Materials Reliability and Applied Mathematics and Mechanics.

In The Last Decade

Aditya P. Karmarkar

23 papers receiving 594 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Aditya P. Karmarkar United States 12 469 305 241 105 95 24 607
Don Disney United States 12 827 1.8× 531 1.7× 244 1.0× 40 0.4× 91 1.0× 35 943
Tobias Erlbacher Germany 18 954 2.0× 215 0.7× 149 0.6× 67 0.6× 157 1.7× 132 1.1k
D.E. Grider United States 24 1.1k 2.3× 318 1.0× 140 0.6× 32 0.3× 95 1.0× 50 1.2k
Bruno Douine France 14 253 0.5× 503 1.6× 204 0.8× 323 3.1× 51 0.5× 69 641
R. Dettmer United States 11 445 0.9× 320 1.0× 179 0.7× 101 1.0× 142 1.5× 41 567
Hassan Maher France 13 498 1.1× 397 1.3× 152 0.6× 43 0.4× 136 1.4× 71 632
Young-Kil Kwon South Korea 13 172 0.4× 245 0.8× 92 0.4× 142 1.4× 84 0.9× 35 365
Tatsuo Morita Japan 13 819 1.7× 686 2.2× 208 0.9× 26 0.2× 109 1.1× 37 919
Kohei Higashikawa Japan 14 312 0.7× 707 2.3× 238 1.0× 346 3.3× 96 1.0× 78 848
Keisuke Yamane Japan 12 254 0.5× 332 1.1× 115 0.5× 98 0.9× 186 2.0× 62 506

Countries citing papers authored by Aditya P. Karmarkar

Since Specialization
Citations

This map shows the geographic impact of Aditya P. Karmarkar's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Aditya P. Karmarkar with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Aditya P. Karmarkar more than expected).

Fields of papers citing papers by Aditya P. Karmarkar

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Aditya P. Karmarkar. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Aditya P. Karmarkar. The network helps show where Aditya P. Karmarkar may publish in the future.

Co-authorship network of co-authors of Aditya P. Karmarkar

This figure shows the co-authorship network connecting the top 25 collaborators of Aditya P. Karmarkar. A scholar is included among the top collaborators of Aditya P. Karmarkar based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Aditya P. Karmarkar. Aditya P. Karmarkar is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Fuhg, Jan N., Aditya P. Karmarkar, Teeratorn Kadeethum, Hongkyu Yoon, & Nikolaos Bouklas. (2023). Deep convolutional Ritz method: parametric PDE surrogates without labeled data. Applied Mathematics and Mechanics. 44(7). 1151–1174. 14 indexed citations
2.
Karmarkar, Aditya P., Xiaopeng Xu, Wei Guo, et al.. (2019). Modeling Copper Plastic Deformation and Liner Viscoelastic Flow Effects on Performance and Reliability in Through Silicon Via (TSV) Fabrication Processes. IEEE Transactions on Device and Materials Reliability. 19(4). 642–653. 13 indexed citations
3.
4.
Karmarkar, Aditya P., Wei Guo, Xiaopeng Xu, et al.. (2016). Performance and Reliability Impact of Copper Plasticity in Backside TSV-Last Fabrication Process. IEEE Transactions on Device and Materials Reliability. 16(3). 402–412. 6 indexed citations
5.
Guo, Wei, Aditya P. Karmarkar, Xiaopeng Xu, et al.. (2015). Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes. 1038–1044. 4 indexed citations
6.
Xu, Xiaopeng & Aditya P. Karmarkar. (2014). TCAD modeling of stress impact on performance and reliability in 3D IC structures. AIP conference proceedings. 128–137. 1 indexed citations
7.
Karmarkar, Aditya P., et al.. (2014). Reliability analysis of bumping schemes under chip package interaction. 151–154. 3 indexed citations
8.
Karmarkar, Aditya P., et al.. (2013). Modeling of interconnect stress evolution during BEOL process and packaging. 1–3. 10 indexed citations
9.
Karmarkar, Aditya P., et al.. (2012). Copper Anisotropy Effects in Three-Dimensional Integrated Circuits Using Through-Silicon Vias. IEEE Transactions on Device and Materials Reliability. 12(2). 225–232. 15 indexed citations
10.
Karmarkar, Aditya P., et al.. (2012). Corrections to “Copper Anisotropy Effects in Three-Dimensional Integrated Circuits Using Through-Silicon Vias” [Jun 12 225-232]. IEEE Transactions on Device and Materials Reliability. 12(3). 582–582. 1 indexed citations
11.
Xu, Xiaopeng & Aditya P. Karmarkar. (2011). 3D TCAD Modeling For Stress Management In Through Silicon Via (TSV) Stacks. AIP conference proceedings. 53–66. 14 indexed citations
12.
Radojcic, Riko, et al.. (2010). Simulation methodology and flow integration for 3D IC stress management. 1–4. 9 indexed citations
13.
Karmarkar, Aditya P., et al.. (2009). Viscoelastic Modeling and Reliability Assessment of Microelectronics Packages. MRS Proceedings. 1158. 5 indexed citations
14.
Karmarkar, Aditya P., Xiaopeng Xu, & Victor Moroz. (2009). Performanace and reliability analysis of 3D-integration structures employing Through Silicon Via (TSV). 682–687. 106 indexed citations
15.
Karmarkar, Aditya P., et al.. (2009). Analysis of performance and reliability trade-off in dummy pattern design for 32-nm technology. 185–189. 7 indexed citations
16.
17.
Karmarkar, Aditya P., Bongim Jun, Daniel M. Fleetwood, et al.. (2004). Proton irradiation effects on GaN-based high electron-mobility transistors with Si-doped Al/sub x/Ga/sub 1-x/N and thick GaN cap Layers. IEEE Transactions on Nuclear Science. 51(6). 3801–3806. 102 indexed citations
18.
Karmarkar, Aditya P., Bongim Jun, Daniel M. Fleetwood, et al.. (2003). Proton-irradiation effects on AlGaN/AlN/GaN high electron mobility transistors. IEEE Transactions on Nuclear Science. 50(6). 1791–1796. 133 indexed citations
19.
Karmarkar, Aditya P., B.K. Choï, Ronald D. Schrimpf, & Daniel M. Fleetwood. (2001). Aging and baking effects on the radiation hardness of MOS capacitors. IEEE Transactions on Nuclear Science. 48(6). 2158–2163. 17 indexed citations
20.
Márka, Z., Sankalp Kumar Singh, J. J. Kavich, et al.. (2000). Characterization of X-ray radiation damage in Si/SiO/sub 2/ structures using second-harmonic generation. IEEE Transactions on Nuclear Science. 47(6). 2256–2261. 17 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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