Robert Wieland
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor Lasers and Optical Devices
Papers in
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- Additive Manufacturing and 3D Printing Technologies 5
-
- 3D IC and TSV technologies 15
- Electronic Packaging and Soldering Technologies 8
- Semiconductor materials and devices 6
- Silicon and Solar Cell Technologies 4
- Semiconductor Lasers and Optical Devices 3
Robert Wieland
29 papers receiving 452 citations
Peers
Comparison fields: 5 of 48
- Automotive Engineering 92
- Electrical and Electronic Engineering 440
- Biomedical Engineering 90
- Hardware and Architecture 12
- Radiation 13
Countries citing papers authored by Robert Wieland
This map shows the geographic impact of Robert Wieland's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Robert Wieland with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Robert Wieland more than expected).
Fields of papers citing papers by Robert Wieland
This network shows the impact of papers produced by Robert Wieland. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Robert Wieland. The network helps show where Robert Wieland may publish in the future.
Co-authors
The 25 scholars most cited alongside Robert Wieland, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 1 | |
| 2 | 2022 | 0 | |
| 3 | 2019 | 5 | |
| 4 | 2016 | 4 | |
| 5 | 2016 | 1 | |
| 6 | 2016 | 7 | |
| 7 | 2013 | 1 | |
| 8 | 2011 | 52 | |
| 9 | Electrostatic wafer handling for thin wafer processing | 2009 | 5 |
| 10 | 2009 | 18 | |
| 11 | 2008 | 90 | |
| 12 | Thin substrate handling by electrostatic force | 2008 | 3 |
| 13 | 2008 | 2 | |
| 14 | 2007 | 13 | |
| 15 | 2005 | 3 | |
| 16 | 2004 | 60 | |
| 17 | 2003 | 39 | |
| 18 | 2003 | 35 | |
| 19 | 2001 | 51 | |
| 20 | Economic analysis of irrigation rehabilitation projects | 1987 | 2 |
About Robert Wieland
Robert Wieland is a scholar working on Automotive Engineering, Electrical and Electronic Engineering, Metals and Alloys, General Materials Science and Sensory Systems, having authored 32 papers that have together received 483 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (8 papers), Semiconductor materials and devices (6 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Silicon and Solar Cell Technologies (4 papers), Semiconductor Lasers and Optical Devices (3 papers), Modular Robots and Swarm Intelligence (2 papers) and Heat Transfer and Optimization (2 papers). The work is most often cited by research in Automotive Engineering (92 citations), Electrical and Electronic Engineering (440 citations), Biomedical Engineering (90 citations), Hardware and Architecture (12 citations) and Radiation (13 citations). Robert Wieland has collaborated with scholars based in Germany, United States and Switzerland. Frequent co-authors include Armin Klumpp, Peter Ramm, R. Merkel, Josef Weber, H. Reichl, M. J. Wolf, B. Michel, Bernhard Wunderle, Kai Zoschke and Andreas Ostmann. Their work appears in journals such as Microelectronic Engineering, Japanese Journal of Applied Physics, Metabolomics, Applied Sciences and Agricultural and Resource Economics Review.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.