Ritwik Chatterjee

1.2k total citations
31 papers, 952 citations indexed

About

Ritwik Chatterjee is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Automotive Engineering. According to data from OpenAlex, Ritwik Chatterjee has authored 31 papers receiving a total of 952 indexed citations (citations by other indexed papers that have themselves been cited), including 28 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 6 papers in Automotive Engineering. Recurrent topics in Ritwik Chatterjee's work include 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (13 papers) and Semiconductor materials and devices (8 papers). Ritwik Chatterjee is often cited by papers focused on 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (13 papers) and Semiconductor materials and devices (8 papers). Ritwik Chatterjee collaborates with scholars based in United States, Austria and Czechia. Ritwik Chatterjee's co-authors include Rao Tummala, Scott Pozder, Ankur Jain, Robert E. Jones, Tapobrata Bandyopadhyay, Daehyun Chung, Madhavan Swaminathan, Robert E. Jones, Pradeep Dixit and Qiao Chen and has published in prestigious journals such as Journal of The Electrochemical Society, Japanese Journal of Applied Physics and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.

In The Last Decade

Ritwik Chatterjee

29 papers receiving 909 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ritwik Chatterjee United States 16 909 145 108 85 60 31 952
N. Sillon France 19 895 1.0× 179 1.2× 234 2.2× 52 0.6× 38 0.6× 71 968
Armin Klumpp Germany 17 714 0.8× 114 0.8× 162 1.5× 44 0.5× 88 1.5× 44 781
A. Farcy France 17 834 0.9× 54 0.4× 109 1.0× 199 2.3× 115 1.9× 102 936
G. Singco United States 5 463 0.5× 48 0.3× 61 0.6× 48 0.6× 65 1.1× 9 535
Victor Moroz United States 23 1.4k 1.6× 31 0.2× 276 2.6× 73 0.9× 82 1.4× 117 1.5k
Stefaan Van Huylenbroeck Belgium 14 645 0.7× 52 0.4× 81 0.8× 56 0.7× 39 0.7× 83 660
M. Kobrinsky United States 12 448 0.5× 26 0.2× 83 0.8× 156 1.8× 101 1.7× 23 581
Soon-Wook Kim South Korea 14 419 0.5× 54 0.4× 115 1.1× 109 1.3× 82 1.4× 47 627
O. Vendier France 15 676 0.7× 21 0.1× 253 2.3× 37 0.4× 58 1.0× 80 772
Jinhyung Lee South Korea 15 547 0.6× 22 0.2× 138 1.3× 48 0.6× 196 3.3× 41 686

Countries citing papers authored by Ritwik Chatterjee

Since Specialization
Citations

This map shows the geographic impact of Ritwik Chatterjee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ritwik Chatterjee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ritwik Chatterjee more than expected).

Fields of papers citing papers by Ritwik Chatterjee

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ritwik Chatterjee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ritwik Chatterjee. The network helps show where Ritwik Chatterjee may publish in the future.

Co-authorship network of co-authors of Ritwik Chatterjee

This figure shows the co-authorship network connecting the top 25 collaborators of Ritwik Chatterjee. A scholar is included among the top collaborators of Ritwik Chatterjee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ritwik Chatterjee. Ritwik Chatterjee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chatterjee, Ritwik, et al.. (2024). Investigating Organizational Transformations on the Path to Sustainable Supply Chain 4.0 Implementation. Circular Economy and Sustainability. 5(1). 277–320. 2 indexed citations
2.
Bandyopadhyay, Tapobrata, Ki Jin Han, Daehyun Chung, et al.. (2011). Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(6). 893–903. 83 indexed citations
3.
Pozder, Scott, Ankur Jain, Robert Jones, et al.. (2009). Reliability Considerations in 3D Stacked Strata Systems. AIP conference proceedings. 213–223. 1 indexed citations
4.
Alam, Syed M., Robert E. Jones, Scott Pozder, et al.. (2009). Interstratum Connection Design Considerations for Cost-Effective 3-D System Integration. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 18(3). 450–460. 17 indexed citations
5.
Savidis, Ioannis, Syed M. Alam, Ankur Jain, et al.. (2009). Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits. Microelectronics Journal. 41(1). 9–16. 65 indexed citations
6.
Liu, Xi, Qiao Chen, Pradeep Dixit, et al.. (2009). Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV). 624–629. 142 indexed citations
7.
Bandyopadhyay, Tapobrata, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, & Rao Tummala. (2009). Electrical modeling of annular and co-axial TSVs considering MOS capacitance effects. 117–120. 21 indexed citations
8.
Chatterjee, Ritwik, et al.. (2009). Through-Silicon Via Fill for 3D Interconnect Applications. ECS Transactions. 16(22). 33–40. 4 indexed citations
9.
Bandyopadhyay, Tapobrata, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, & Rao Tummala. (2009). Electrical modeling of Through Silicon and Package Vias. 1–8. 93 indexed citations
10.
11.
Chatterjee, Ritwik, et al.. (2007). Selective Formation of Micropads for 3D Interconnect Applications. ECS Transactions. 11(6). 305–312. 1 indexed citations
12.
Pozder, Scott, et al.. (2007). Progress of 3D Integration Technologies and 3D Interconnects. 213–215. 48 indexed citations
13.
Gosset, L.G., V. Arnal, C. Prindle, et al.. (2004). General review of issues and perspectives for advanced copper interconnections using air gap as ultra-low K material. 473. 65–67. 6 indexed citations
14.
Chatterjee, Ritwik, et al.. (2001). The Evaluation of Hexafluorobenzene as an Environmentally Benign Dielectric Etch Chemistry. Journal of The Electrochemical Society. 148(12). G721–G721. 11 indexed citations
15.
Chatterjee, Ritwik, et al.. (2001). Characterization of iodoheptafluoropropane as a dielectric etchant. II. Wafer surface analysis. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 19(4). 1293–1305. 1 indexed citations
16.
Chatterjee, Ritwik, et al.. (2001). Characterization of iodoheptafluoropropane as a dielectric etchant. I. Process performance evaluation. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 19(4). 1269–1292. 3 indexed citations
17.
Chatterjee, Ritwik, et al.. (2001). Evaluation of Oxalyl Fluoride for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool. Journal of The Electrochemical Society. 148(3). G141–G141. 15 indexed citations
18.
Chatterjee, Ritwik, et al.. (2001). Characterization of iodoheptafluoropropane as a dielectric etchant. III. Effluent analysis. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 19(4). 1306–1318. 5 indexed citations
19.
Chatterjee, Ritwik, et al.. (2000). High density plasma oxide etching using nitrogen trifluoride and acetylene. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 18(6). 2749–2758. 8 indexed citations
20.
Yan, Pei-yang, et al.. (1995). Mask Defect Printability and Wafer Process Critical Dimension Control at 0.25 µm Design Rules. Japanese Journal of Applied Physics. 34(12S). 6605–6605. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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