Armin Klumpp
- Electrical and Electronic Engineering top 5%
- Biomedical Engineering
- Automotive Engineering top 10%
- Materials Chemistry
- Mechanical Engineering
- Co-authors
- Peter RammRobert WielandJosef WeberR. MerkelMaaike M. Visser TakloH. ReichlM. J. WolfB. Michel
- Topics
- 3D IC and TSV technologies (26 papers)Electronic Packaging and Soldering Technologies (13 papers)Additive Manufacturing and 3D Printing Technologies (10 papers)
- Journals
- SHILAP Revista de lepidopterologíaApplied Surface ScienceJapanese Journal of Applied Physics
In The Last Decade
Armin Klumpp
43 papers receiving 736 citations
Peers
Comparison fields: 5 of 54
- Electrical and Electronic Engineering 714
- Biomedical Engineering 162
- Automotive Engineering 114
- Materials Chemistry 88
- Mechanical Engineering 57
Countries citing papers authored by Armin Klumpp
This map shows the geographic impact of Armin Klumpp's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Armin Klumpp with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Armin Klumpp more than expected).
Fields of papers citing papers by Armin Klumpp
This network shows the impact of papers produced by Armin Klumpp. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Armin Klumpp. The network helps show where Armin Klumpp may publish in the future.
Co-authorship network of co-authors of Armin Klumpp
This figure shows the co-authorship network connecting the top 25 collaborators of Armin Klumpp. A scholar is included among the top collaborators of Armin Klumpp based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Armin Klumpp. Armin Klumpp is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 14 | |
| 2 | 9 | |
| 3 | 2 | |
| 4 | 24 | |
| 5 | 3 | |
| 6 | 1 | |
| 7 | 3D integration technologies | 5 |
| 8 | Electrostatic wafer handling for thin wafer processing | 5 |
| 9 | 50 | |
| 10 | 18 | |
| 11 | 33 | |
| 12 | 13 | |
| 13 | 90 | |
| 14 | 13 | |
| 15 | 39 | |
| 16 | 35 | |
| 17 | Vertically integrated circuits. A key technology for future high performance systems | 1 |
| 18 | 7 | |
| 19 | 16 | |
| 20 | 17 |
About Armin Klumpp
Armin Klumpp is a scholar working on Bioengineering, Automotive Engineering and Electrical and Electronic Engineering, having authored 44 papers that have together received 781 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (13 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (714 citations), Automotive Engineering (114 citations) and Bioengineering (27 citations). Armin Klumpp has collaborated with scholars based in Germany, Norway and Belgium. Frequent co-authors include Peter Ramm, Robert Wieland, Josef Weber, R. Merkel, Maaike M. Visser Taklo, H. Reichl, M. J. Wolf, B. Michel, Bernhard Wunderle and W. De Raedt. Their work appears in journals such as SHILAP Revista de lepidopterología, Applied Surface Science and Japanese Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.