O. Ehrmann
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- 3D IC and TSV technologies 42
- Electronic Packaging and Soldering Technologies 34
- Advanced MEMS and NEMS Technologies 16
- Electrodeposition and Electroless Coatings 6
- CCD and CMOS Imaging Sensors 5
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies 5
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- Particle Detector Development and Performance 9
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- Synthesis and properties of polymers 5
- Co-authors
- H. ReichlMichael J. TopperJ.K. WolfKai ZoschkeT. FritzschM. J. WolfHermann OppermannNils Jürgensen
- Journals
- Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment (3 papers)Review of Scientific Instruments (3 papers)IEEE Transactions on Advanced Packaging (3 papers)
- Partner nations
- GermanyUnited StatesSouth Korea
In The Last Decade
O. Ehrmann
81 papers receiving 856 citations
Peers
Comparison fields: 5 of 59
- Electrical and Electronic Engineering 806
- Automotive Engineering 76
- Biomedical Engineering 249
- Nuclear and High Energy Physics 43
- Mechanical Engineering 100
Countries citing papers authored by O. Ehrmann
This map shows the geographic impact of O. Ehrmann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by O. Ehrmann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites O. Ehrmann more than expected).
Fields of papers citing papers by O. Ehrmann
This network shows the impact of papers produced by O. Ehrmann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by O. Ehrmann. The network helps show where O. Ehrmann may publish in the future.
Co-authorship network
The 25 scholars most cited alongside O. Ehrmann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 9 | |
| 2 | 2016 | 5 | |
| 3 | 2016 | 2 | |
| 4 | 2016 | 3 | |
| 5 | 2012 | 10 | |
| 6 | 2011 | 3 | |
| 7 | 2010 | 1 | |
| 8 | 2007 | 0 | |
| 9 | 2006 | 7 | |
| 10 | 2005 | 8 | |
| 11 | 2004 | 33 | |
| 12 | 2002 | 16 | |
| 13 | 2002 | 13 | |
| 14 | 2001 | 2 | |
| 15 | Thin chip integration (TCI-modules) - a novel technique for manufacturing three dimensional IC-packages | 2000 | 6 |
| 16 | High density pixel detector module using flip chip and thin film technology | 2000 | 0 |
| 17 | 2000 | 15 | |
| 18 | 2000 | 5 | |
| 19 | Chip size package - the option of choice for miniaturized medical devices | 1998 | 5 |
| 20 | 1992 | 46 |
About O. Ehrmann
O. Ehrmann is a scholar working on Electrical and Electronic Engineering, Nuclear and High Energy Physics and Automotive Engineering, having authored 83 papers that have together received 911 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (42 papers), Electronic Packaging and Soldering Technologies (34 papers), Advanced MEMS and NEMS Technologies (16 papers), Particle Detector Development and Performance (9 papers), Electrodeposition and Electroless Coatings (6 papers), Synthesis and properties of polymers (5 papers), CCD and CMOS Imaging Sensors (5 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (806 citations), Automotive Engineering (76 citations) and Biomedical Engineering (249 citations). O. Ehrmann has collaborated with scholars based in Germany, United States and South Korea. Frequent co-authors include H. Reichl, Michael J. Topper, J.K. Wolf, Kai Zoschke, T. Fritzsch, M. J. Wolf, Hermann Oppermann, Nils Jürgensen, Klaus‐Dieter Lang and Ha-Duong Ngo. Their work appears in journals such as Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment, Review of Scientific Instruments, IEEE Transactions on Advanced Packaging, Journal of Instrumentation and IEEE Transactions on Nuclear Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.