Peter Ramm

2.5k total citations
84 papers, 1.7k citations indexed

About

Peter Ramm is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering. According to data from OpenAlex, Peter Ramm has authored 84 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 61 papers in Electrical and Electronic Engineering, 13 papers in Automotive Engineering and 10 papers in Biomedical Engineering. Recurrent topics in Peter Ramm's work include 3D IC and TSV technologies (44 papers), Electronic Packaging and Soldering Technologies (18 papers) and Semiconductor materials and devices (16 papers). Peter Ramm is often cited by papers focused on 3D IC and TSV technologies (44 papers), Electronic Packaging and Soldering Technologies (18 papers) and Semiconductor materials and devices (16 papers). Peter Ramm collaborates with scholars based in Germany, Canada and Norway. Peter Ramm's co-authors include Armin Klumpp, Barrie J. Frost, Carlyle Smith, Robert Wieland, Josef Weber, Philip E. Garrou, Christopher A. Bower, R. Merkel, S.A. Kuhn and W. Weber and has published in prestigious journals such as Journal of The Electrochemical Society, Brain Research and SLEEP.

In The Last Decade

Peter Ramm

81 papers receiving 1.6k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Peter Ramm Germany	24	996	296	273	268	160	84	1.7k
Yudong Yao United States	19	577 0.6×	293 1.0×	514 1.9×	77 0.3×	383 2.4×	64	1.7k
Pedro P. Irazoqui United States	33	1.7k 1.7×	640 2.2×	961 3.5×	1.5k 5.6×	111 0.7×	108	3.5k
Ferruccio Pisanello Italy	27	454 0.5×	324 1.1×	718 2.6×	1.1k 4.0×	133 0.8×	101	2.4k
Xiaobin He China	24	594 0.6×	616 2.1×	673 2.5×	323 1.2×	350 2.2×	90	2.1k
Ying Wu China	29	662 0.7×	1.0k 3.5×	537 2.0×	91 0.3×	210 1.3×	144	2.6k
D. Alistair Steyn‐Ross New Zealand	26	292 0.3×	925 3.1×	338 1.2×	47 0.2×	91 0.6×	88	1.6k
Hyunwook Park South Korea	24	647 0.6×	416 1.4×	74 0.3×	330 1.2×	102 0.6×	150	2.3k
Takao Satô Japan	24	545 0.5×	682 2.3×	213 0.8×	507 1.9×	122 0.8×	349	2.6k
Sanghyeon Kim South Korea	34	2.3k 2.3×	97 0.3×	241 0.9×	586 2.2×	390 2.4×	280	4.0k
Patrick Degenaar United Kingdom	23	695 0.7×	572 1.9×	1.3k 4.9×	697 2.6×	231 1.4×	129	2.1k

Countries citing papers authored by Peter Ramm

Since Specialization

Citations

This map shows the geographic impact of Peter Ramm's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Peter Ramm with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Peter Ramm more than expected).

Fields of papers citing papers by Peter Ramm

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Peter Ramm. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Peter Ramm. The network helps show where Peter Ramm may publish in the future.

Co-authorship network of co-authors of Peter Ramm

This figure shows the co-authorship network connecting the top 25 collaborators of Peter Ramm. A scholar is included among the top collaborators of Peter Ramm based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Peter Ramm. Peter Ramm is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Dahiya, Abhishek Singh, Jérôme Thireau, Jamila Boudaden, et al.. (2019). Review—Energy Autonomous Wearable Sensors for Smart Healthcare: A Review. Journal of The Electrochemical Society. 167(3). 37516–37516. 77 indexed citations

Garrou, Philip E., Mitsumasa Koyanagi, & Peter Ramm. (2014). 3D process technology. Wiley-VCH eBooks. 1 indexed citations

Garrou, Philip E., Christopher A. Bower, & Peter Ramm. (2012). Technology and applications of 3D integrated circuits. Wiley-VCH eBooks. 4 indexed citations

Garrou, Philip E., Christopher A. Bower, & Peter Ramm. (2012). Handbook of 3D integration : technology and applications of 3D integrated circuits. DR-NTU (Nanyang Technological University). 129 indexed citations

Taklo, Maaike M. Visser, Armin Klumpp, Peter Ramm, et al.. (2011). Characterization and Failure Analysis of 3D Integrated Systems using a novel plasma-FIB system. AIP conference proceedings. 24 indexed citations

Scheiter, T., et al.. (2010). High performance 3D interconnects based on electrochemical etch and liquid metal fill. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–7. 1 indexed citations

Taklo, Maaike M. Visser, et al.. (2009). 3D stacked MEMS and ICs in a miniaturized sensor node. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 74–77. 1 indexed citations

Landesberger, Christof, et al.. (2009). Electrostatic wafer handling for thin wafer processing. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–5. 5 indexed citations

Ramm, Peter, Armin Klumpp, Josef Weber, & Maaike M. Visser Taklo. (2009). 3D integration technologies. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 71–73. 5 indexed citations

10.

Ramm, Peter, Armin Klumpp, Josef Weber, & Maaike M. Visser Taklo. (2009). 3D System-on-Chip technologies for More than Moore systems. Microsystem Technologies. 16(7). 1051–1055. 50 indexed citations

11.

Garrou, Philip E., Christopher A. Bower, & Peter Ramm. (2008). 3D Integration: Technology and Applications. Wiley-VCH eBooks. 19 indexed citations

12.

Wieland, Robert, et al.. (2008). Thin substrate handling by electrostatic force. 1–4. 3 indexed citations

13.

Ramm, Peter. (2005). Image-based screening: a technology in transition. Current Opinion in Biotechnology. 16(1). 41–48. 17 indexed citations

14.

Vogg, Günther, et al.. (2004). Spectroscopic techniques for characterization of high-mobility strained-Si CMOS. Materials Science in Semiconductor Processing. 8(1-3). 267–271. 11 indexed citations

15.

Ramm, Peter, Martin Hale, & Colin Jones. (2000). Geodetic infrastructure - A cooperative future. Australian Surveyor. 45(2). 29–34. 2 indexed citations

16.

Ruhl, G., et al.. (1995). Deposition of titanium nitride/tungsten layers for application in vertically integrated circuits technology. Applied Surface Science. 91(1-4). 382–387. 11 indexed citations

17.

Lang, Walter, Peter Steiner, F. Kozlowski, & Peter Ramm. (1995). Influence of rapid thermal oxidation on differently prepared porous silicon. Thin Solid Films. 255(1-2). 224–227. 7 indexed citations

18.

Ramm, Peter. (1994). Advanced image analysis systems in cell, molecular and neurobiology applications. Journal of Neuroscience Methods. 54(2). 131–149. 21 indexed citations

19.

Palacios, J.M., Guadalupe Mengod, M. Teresa Vilaró, & Peter Ramm. (1991). Recent trends in receptor analysis techniques and instrumentation. Journal of Chemical Neuroanatomy. 4(5). 343–353. 14 indexed citations

20.

Ramm, Peter & Barrie J. Frost. (1983). Regional Metabolic Activity in the Rat Brain During Sleep-Wake Activity. SLEEP. 6(3). 196–216. 57 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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