Peter Ramm
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- 3D IC and TSV technologies 44
- Electronic Packaging and Soldering Technologies 18
- Semiconductor materials and devices 16
- Advanced MEMS and NEMS Technologies 11
- Semiconductor Lasers and Optical Devices 9
- Cognitive Neuroscience top 5%
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies 13
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- Cell Image Analysis Techniques 7
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- Metal and Thin Film Mechanics 7
Peter Ramm
81 papers receiving 1.6k citations
Peers
Comparison fields: 5 of 126
- Electrical and Electronic Engineering 996
- Endocrine and Autonomic Systems 113
- Cognitive Neuroscience 296
- Cellular and Molecular Neuroscience 273
- Automotive Engineering 157
Countries citing papers authored by Peter Ramm
This map shows the geographic impact of Peter Ramm's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Peter Ramm with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Peter Ramm more than expected).
Fields of papers citing papers by Peter Ramm
This network shows the impact of papers produced by Peter Ramm. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Peter Ramm. The network helps show where Peter Ramm may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Peter Ramm, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2019 | 77 | |
| 2 | 2015 | 14 | |
| 3 | 3D process technology | 2014 | 1 |
| 4 | Handbook of 3D integration : technology and applications of 3D integrated circuits | 2012 | 129 |
| 5 | Technology and applications of 3D integrated circuits | 2012 | 4 |
| 6 | 2011 | 24 | |
| 7 | 2011 | 3 | |
| 8 | 2010 | 1 | |
| 9 | 3D stacked MEMS and ICs in a miniaturized sensor node | 2009 | 1 |
| 10 | 3D integration technologies | 2009 | 5 |
| 11 | Electrostatic wafer handling for thin wafer processing | 2009 | 5 |
| 12 | 3D Integration: Technology and Applications | 2008 | 19 |
| 13 | 2008 | 33 | |
| 14 | 2005 | 17 | |
| 15 | 1995 | 11 | |
| 16 | 1994 | 21 | |
| 17 | 1991 | 14 | |
| 18 | 1990 | 9 | |
| 19 | 1990 | 129 | |
| 20 | 1983 | 57 |
About Peter Ramm
Peter Ramm is a scholar working on Biophysics, Automotive Engineering and Electrical and Electronic Engineering, having authored 84 papers that have together received 1.7k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (44 papers), Electronic Packaging and Soldering Technologies (18 papers), Semiconductor materials and devices (16 papers), Additive Manufacturing and 3D Printing Technologies (13 papers), Advanced MEMS and NEMS Technologies (11 papers), Semiconductor Lasers and Optical Devices (9 papers), Cell Image Analysis Techniques (7 papers) and Metal and Thin Film Mechanics (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (996 citations), Endocrine and Autonomic Systems (113 citations) and Cognitive Neuroscience (296 citations). Peter Ramm has collaborated with scholars based in Germany, Canada and Norway. Frequent co-authors include Armin Klumpp, Barrie J. Frost, Carlyle Smith, Robert Wieland, Josef Weber, Philip E. Garrou, Christopher A. Bower, R. Merkel, W. Weber and S.A. Kuhn. Their work appears in journals such as Microelectronic Engineering, Thin Solid Films, Japanese Journal of Applied Physics, Applied Surface Science and Microsystem Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.