L.W. Schaper

915 total citations
64 papers, 669 citations indexed

About

L.W. Schaper is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, L.W. Schaper has authored 64 papers receiving a total of 669 indexed citations (citations by other indexed papers that have themselves been cited), including 54 papers in Electrical and Electronic Engineering, 16 papers in Electronic, Optical and Magnetic Materials and 11 papers in Biomedical Engineering. Recurrent topics in L.W. Schaper's work include 3D IC and TSV technologies (32 papers), Semiconductor materials and devices (24 papers) and Electronic Packaging and Soldering Technologies (23 papers). L.W. Schaper is often cited by papers focused on 3D IC and TSV technologies (32 papers), Semiconductor materials and devices (24 papers) and Electronic Packaging and Soldering Technologies (23 papers). L.W. Schaper collaborates with scholars based in United States and United Kingdom. L.W. Schaper's co-authors include S. L. Burkett, Zia Ur Rahman, Simon S. Ang, W.D. Brown, Hameed A. Naseem, Li Cai, Ajay P. Malshe, Y.L. Low, J.P. Parkerson and Chen Shen and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Proceedings of the IEEE.

In The Last Decade

L.W. Schaper

60 papers receiving 635 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
L.W. Schaper United States	15	563	117	110	108	62	64	669
A. Farcy France	17	834 1.5×	109 0.9×	115 1.0×	199 1.8×	38 0.6×	102	936
Joeri De Vos Belgium	17	797 1.4×	176 1.5×	74 0.7×	109 1.0×	75 1.2×	98	861
Zai‐Fa Zhou China	13	311 0.6×	247 2.1×	85 0.8×	73 0.7×	86 1.4×	81	517
Kripesh Vaidyanathan Singapore	13	611 1.1×	162 1.4×	54 0.5×	56 0.5×	123 2.0×	33	718
Ritwik Chatterjee United States	16	909 1.6×	108 0.9×	60 0.5×	85 0.8×	39 0.6×	31	952
A. Katsuki Japan	12	569 1.0×	223 1.9×	96 0.9×	90 0.8×	191 3.1×	69	753
S. Kadomura Japan	11	499 0.9×	79 0.7×	75 0.7×	170 1.6×	29 0.5×	43	542
M. Kobrinsky United States	12	448 0.8×	83 0.7×	101 0.9×	156 1.4×	69 1.1×	23	581
Sung-Hwan Hwang United States	11	367 0.7×	107 0.9×	81 0.7×	53 0.5×	74 1.2×	28	498
T.C. Chai Singapore	13	821 1.5×	143 1.2×	53 0.5×	96 0.9×	68 1.1×	48	868

Countries citing papers authored by L.W. Schaper

Since Specialization

Citations

This map shows the geographic impact of L.W. Schaper's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.W. Schaper with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.W. Schaper more than expected).

Fields of papers citing papers by L.W. Schaper

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by L.W. Schaper. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.W. Schaper. The network helps show where L.W. Schaper may publish in the future.

Co-authorship network of co-authors of L.W. Schaper

This figure shows the co-authorship network connecting the top 25 collaborators of L.W. Schaper. A scholar is included among the top collaborators of L.W. Schaper based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with L.W. Schaper. L.W. Schaper is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Liu, Yang, et al.. (2011). Integration of Tantalum Pentoxide Capacitors With Through-Silicon Vias. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(10). 1508–1516. 5 indexed citations

Burkett, S. L., et al.. (2008). Fabrication and testing of through-silicon vias used in three-dimensional integration. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 26(6). 1834–1840. 24 indexed citations

Gordon, Matt, et al.. (2007). Optical Emission Spectroscopy in a Reactive Ion Etching System. 189–193. 2 indexed citations

Schaper, L.W., et al.. (2007). High Density Double and Triple Layer Tantalum Pentoxide Decoupling Capacitors. IEEE Transactions on Components and Packaging Technologies. 30(4). 563–568. 5 indexed citations

Gordon, Matt, et al.. (2007). Finite Element Analysis of Power Dissipation and Stress in 3-D Stack-Up Geometries. 194–198. 1 indexed citations

Lam, Timothy T.-Y., Li Cai, S. L. Burkett, et al.. (2006). Copper electroplating to fill blind vias for three-dimensional integration. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 24(4). 1277–1282. 24 indexed citations

Lam, Timothy T.-Y., et al.. (2006). Back side exposure of variable size through silicon vias. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 24(5). 2460–2466. 16 indexed citations

Schaper, L.W., Simon S. Ang, & Y.L. Low. (2005). Design of the Interconnected Mesh Power System (IMPS) MCM Topology. 543–548. 1 indexed citations

Parkerson, J.P., et al.. (2002). Design considerations for using integrated passive components. 345–350. 3 indexed citations

10.

Brown, W.D., et al.. (2002). Modeling and simulation of thin film decoupling capacitors. 7. 205–208. 1 indexed citations

11.

Schaper, L.W., et al.. (2002). Seamless high off-chip connectivity [IC packaging]. 39–44. 3 indexed citations

12.

Schaper, L.W., et al.. (2002). High frequency characteristics of MCM decoupling capacitors. 358–364. 10 indexed citations

13.

Parkerson, J.P. & L.W. Schaper. (2002). Advanced interconnected mesh power system (IMPS) MCM topologies. 123–126. 1 indexed citations

14.

Low, Y.L., L.W. Schaper, & Simon S. Ang. (2002). A low-cost MCM design topology-the interconnected mesh power system (IMPS). 200–205. 3 indexed citations

15.

Schaper, L.W., et al.. (2002). The "Stealth" decoupling capacitor. 724–729. 16 indexed citations

16.

Schaper, L.W., et al.. (1999). Modeling and electrical analysis of seamless high off-chip connectivity (SHOCC) interconnects. IEEE Transactions on Advanced Packaging. 22(3). 309–320. 20 indexed citations

17.

Glover, Michael D., J.P. Parkerson, & L.W. Schaper. (1996). a Signal Noise Comparison of the Interconnected Mesh Power System (imps) with a Standard Four-Layer Mcm Topology. 2794. 216. 1 indexed citations

18.

Malshe, Ajay P., et al.. (1995). Artifacts in SPM measurements of thin films and coatings. Thin Solid Films. 270(1-2). 356–361. 11 indexed citations

19.

Bhat, Deepak, Ajay P. Malshe, Hameed A. Naseem, et al.. (1995). A preliminary investigation of the effect of post-deposition polishing of diamond films on the machining behavior of diamond-coated cutting tools. Diamond and Related Materials. 4(7). 921–929. 38 indexed citations

20.

Schaper, L.W., et al.. (1984). Interconnection Costs of Various Substrates-The Myth of Cheap Wire. IEEE Transactions on Components Hybrids and Manufacturing Technology. 7(3). 261–263. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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