Kai Zoschke

811 total citations
64 papers, 624 citations indexed

About

Kai Zoschke is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Nuclear and High Energy Physics. According to data from OpenAlex, Kai Zoschke has authored 64 papers receiving a total of 624 indexed citations (citations by other indexed papers that have themselves been cited), including 63 papers in Electrical and Electronic Engineering, 16 papers in Biomedical Engineering and 7 papers in Nuclear and High Energy Physics. Recurrent topics in Kai Zoschke's work include 3D IC and TSV technologies (45 papers), Electronic Packaging and Soldering Technologies (27 papers) and Advanced MEMS and NEMS Technologies (18 papers). Kai Zoschke is often cited by papers focused on 3D IC and TSV technologies (45 papers), Electronic Packaging and Soldering Technologies (27 papers) and Advanced MEMS and NEMS Technologies (18 papers). Kai Zoschke collaborates with scholars based in Germany, Finland and Switzerland. Kai Zoschke's co-authors include H. Reichl, O. Ehrmann, Hermann Oppermann, T. Fritzsch, M. J. Wolf, Klaus‐Dieter Lang, Michael J. Topper, Martin Wilke, J.K. Wolf and Ivan Ndip and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, Sensors and Actuators A Physical and Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment.

In The Last Decade

Kai Zoschke

64 papers receiving 604 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Kai Zoschke Germany 14 586 167 53 38 34 64 624
Qiaoling Tong China 14 609 1.0× 114 0.7× 64 1.2× 18 0.5× 82 2.4× 27 675
Jaber Derakhshandeh Belgium 15 497 0.8× 141 0.8× 33 0.6× 10 0.3× 55 1.6× 91 608
K. Hamada Japan 10 170 0.3× 79 0.5× 7 0.1× 49 1.3× 45 1.3× 52 295
J.T.M. Stevenson United Kingdom 13 502 0.9× 264 1.6× 13 0.2× 5 0.1× 84 2.5× 93 603
V. Seidemann Germany 12 369 0.6× 255 1.5× 9 0.2× 7 0.2× 147 4.3× 23 518
Keiji Tatani Taiwan 9 307 0.5× 61 0.4× 26 0.5× 4 0.1× 7 0.2× 12 334
G. Lullo Italy 12 443 0.8× 39 0.2× 26 0.5× 3 0.1× 103 3.0× 46 507
Hayato Iwamoto Japan 15 728 1.2× 146 0.9× 55 1.0× 2 0.1× 39 1.1× 76 796
Nutapong Somjit United Kingdom 15 704 1.2× 235 1.4× 21 0.4× 4 0.1× 70 2.1× 92 794
M.A. Schmidt United States 12 444 0.8× 177 1.1× 23 0.4× 2 0.1× 211 6.2× 25 531

Countries citing papers authored by Kai Zoschke

Since Specialization
Citations

This map shows the geographic impact of Kai Zoschke's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kai Zoschke with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kai Zoschke more than expected).

Fields of papers citing papers by Kai Zoschke

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kai Zoschke. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kai Zoschke. The network helps show where Kai Zoschke may publish in the future.

Co-authorship network of co-authors of Kai Zoschke

This figure shows the co-authorship network connecting the top 25 collaborators of Kai Zoschke. A scholar is included among the top collaborators of Kai Zoschke based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kai Zoschke. Kai Zoschke is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zoschke, Kai, Hermann Oppermann, Nils Jürgensen, et al.. (2020). Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 432–438. 5 indexed citations
2.
Zoschke, Kai, et al.. (2018). Development of a High Resolution Magnetic Field Position Sensor System Based on a Through Silicon Via First Integration Concept. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 916–925. 3 indexed citations
3.
Kasiński, Krzysztof, P. Gryboś, Piotr Kmon, et al.. (2017). Development of a Four-Side Buttable X-Ray Detection Module With Low Dead Area Using the UFXC32k Chips With TSVs. IEEE Transactions on Nuclear Science. 64(8). 2433–2440. 8 indexed citations
4.
Zoschke, Kai & Klaus‐Dieter Lang. (2016). Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 223–228. 2 indexed citations
5.
Pennicard, David, S. Smoljanin, T. Fritzsch, et al.. (2016). Development of edgeless TSV X-ray detectors. Journal of Instrumentation. 11(2). C02043–C02043. 12 indexed citations
6.
Zoschke, Kai, Thorsten Fischer, Hermann Oppermann, & Klaus‐Dieter Lang. (2014). Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 209–214. 5 indexed citations
7.
Zoschke, Kai, Martin Wilke, Matthias Wegner, et al.. (2014). Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 49. 1204–1211. 5 indexed citations
8.
Zoschke, Kai, et al.. (2013). Vacuum packaging at wafer level for MEMS using gold-tin metallurgy. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 4 indexed citations
9.
Zoschke, Kai, Martin Wilke, Nils Jürgensen, et al.. (2013). Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1500–1507. 22 indexed citations
10.
Ndip, Ivan, Kai Zoschke, M. J. Wolf, et al.. (2013). Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs). IEEE Transactions on Components Packaging and Manufacturing Technology. 4(3). 504–515. 64 indexed citations
11.
Ruffieux, David, et al.. (2013). A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-$\mu$W RTC Mode and Programmable HF Clocks. IEEE Journal of Solid-State Circuits. 49(1). 212–222. 14 indexed citations
12.
Kaynak, Mehmet, Matthias Wietstruck, J. Drews, et al.. (2012). Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads. OPen Access Repositorium der Universität Ulm (OPARU) (Ulm University). 17. 1–3. 10 indexed citations
13.
Zoschke, Kai, et al.. (2011). Wafer-level glass-caps for advanced optical applications. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1642–1648. 5 indexed citations
14.
Zoschke, Kai, J.K. Wolf, Nils Jürgensen, et al.. (2011). TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 836–843. 52 indexed citations
15.
Kaynak, Mehmet, Matthias Wietstruck, J. Drews, et al.. (2011). MEMS module integration into SiGe BiCMOS technology for embedded system applications. OPen Access Repositorium der Universität Ulm (OPARU) (Ulm University). 1–4. 3 indexed citations
16.
Zoschke, Kai, et al.. (2010). Anodic bonding at low voltage using microstructured borosilicate glass thin-films. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–4. 6 indexed citations
17.
Fischer, Thorsten, et al.. (2009). Thin hermetic passivation of semiconductors using low temperature borosilicate glass - benchmark of a new wafer-level packaging technology. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 886–891. 2 indexed citations
18.
Zoschke, Kai, Armin Klumpp, Robert Wieland, et al.. (2009). 3D integration of image sensor SiP using TSV silicon interposer. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 795–800. 18 indexed citations
19.
Kim, Sohee, Oliver Scholz, Kai Zoschke, et al.. (2006). FEA Simulation of Thin Film Coils to Power Wireless Neural Interfaces. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1(2006). 705–708. 3 indexed citations
20.
Zoschke, Kai, J.K. Wolf, Michael J. Topper, et al.. (2004). Thin film integration of passives - single components, filters, integrated passive devices. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 294–301. 33 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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