Bernhard Wunderle
About
In The Last Decade
Bernhard Wunderle
287 papers receiving 2.5k citations
Peers
Comparison fields: 5 of 76
- Electrical and Electronic Engineering 1.8k
- Mechanical Engineering 869
- Mechanics of Materials 780
- Biomedical Engineering 423
- Materials Chemistry 414
Countries citing papers authored by Bernhard Wunderle
This map shows the geographic impact of Bernhard Wunderle's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bernhard Wunderle with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bernhard Wunderle more than expected).
Fields of papers citing papers by Bernhard Wunderle
This network shows the impact of papers produced by Bernhard Wunderle. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bernhard Wunderle. The network helps show where Bernhard Wunderle may publish in the future.
Co-authorship network of co-authors of Bernhard Wunderle
This figure shows the co-authorship network connecting the top 25 collaborators of Bernhard Wunderle. A scholar is included among the top collaborators of Bernhard Wunderle based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bernhard Wunderle. Bernhard Wunderle is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 8 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 0 | |
| 5 | 7 | |
| 6 | 1 | |
| 7 | 1 | |
| 8 | 4 | |
| 9 | 9 | |
| 10 | 7 | |
| 11 | Packaging and Characterization of Silicon and SiC-based Power Inverter Module with Double Sided Cooling | 2 |
| 12 | Modelling and characterisation of smart power devices | 5 |
| 13 | Reliability Analysis of Low Temperature Low Pressure Ag-Sinter Die Attach | 20 |
| 14 | Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards | 4 |
| 15 | Combined and accelerated in-situ measurement method for reliability and aging analyses of thermal interface materials | 6 |
| 16 | Fracture mechanical test methods for interface crack evaluation of electronic packages | 4 |
| 17 | DoE simulations and measurements with the microDAC stress chip for material and package investigations | 2 |
| 18 | Miniaturized black body radiator for IR-detector calibration — Design and development | 3 |
| 19 | A Multiscale Modeling Approach for Microelectronic Packaging Applications | 5 |
| 20 | Progress in thermal characterisation methods and thermal interface technology within the “Nanopack” project | 2 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.