M. J. Wolf

796 total citations
41 papers, 606 citations indexed

About

M. J. Wolf is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, M. J. Wolf has authored 41 papers receiving a total of 606 indexed citations (citations by other indexed papers that have themselves been cited), including 39 papers in Electrical and Electronic Engineering, 12 papers in Biomedical Engineering and 8 papers in Automotive Engineering. Recurrent topics in M. J. Wolf's work include 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (21 papers) and Additive Manufacturing and 3D Printing Technologies (8 papers). M. J. Wolf is often cited by papers focused on 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (21 papers) and Additive Manufacturing and 3D Printing Technologies (8 papers). M. J. Wolf collaborates with scholars based in Germany, Switzerland and Netherlands. M. J. Wolf's co-authors include H. Reichl, Bernhard Wunderle, Armin Klumpp, Peter Ramm, Kai Zoschke, O. Ehrmann, Robert Wieland, B. Michel, Nils Jürgensen and Frank Lenzmann and has published in prestigious journals such as Solar Energy Materials and Solar Cells, Microelectronic Engineering and Zeitschrift für Physikalische Chemie.

In The Last Decade

M. J. Wolf

39 papers receiving 579 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
M. J. Wolf Germany 13 540 126 82 59 49 41 606
Lixi Wan China 12 494 0.9× 119 0.9× 30 0.4× 88 1.5× 65 1.3× 137 612
Cong Li China 17 834 1.5× 175 1.4× 80 1.0× 59 1.0× 65 1.3× 81 887
Ran He Japan 11 570 1.1× 52 0.4× 56 0.7× 83 1.4× 61 1.2× 31 619
Dongyoung Kim South Korea 14 429 0.8× 155 1.2× 36 0.4× 82 1.4× 65 1.3× 53 535
Riko I Made Singapore 13 399 0.7× 96 0.8× 49 0.6× 127 2.2× 100 2.0× 45 527
Daniele Vella Slovenia 12 360 0.7× 63 0.5× 156 1.9× 220 3.7× 49 1.0× 27 491
Thomas Signamarcheix France 14 685 1.3× 164 1.3× 42 0.5× 136 2.3× 64 1.3× 38 741
Angelika Schmitt Germany 6 293 0.5× 85 0.7× 153 1.9× 105 1.8× 18 0.4× 9 435
V. Fakhfouri Switzerland 9 232 0.4× 200 1.6× 33 0.4× 80 1.4× 28 0.6× 25 363
Viorel Drăgoi Austria 13 630 1.2× 179 1.4× 104 1.3× 49 0.8× 64 1.3× 107 707

Countries citing papers authored by M. J. Wolf

Since Specialization
Citations

This map shows the geographic impact of M. J. Wolf's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. J. Wolf with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. J. Wolf more than expected).

Fields of papers citing papers by M. J. Wolf

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. J. Wolf. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. J. Wolf. The network helps show where M. J. Wolf may publish in the future.

Co-authorship network of co-authors of M. J. Wolf

This figure shows the co-authorship network connecting the top 25 collaborators of M. J. Wolf. A scholar is included among the top collaborators of M. J. Wolf based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. J. Wolf. M. J. Wolf is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wolf, M. J., et al.. (2023). Injection Compression Molding of LDS-MID for Millimeter Wave Applications. Journal of Manufacturing and Materials Processing. 7(5). 184–184. 3 indexed citations
2.
Wolf, M. J., et al.. (2023). Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications. Journal of Manufacturing and Materials Processing. 7(4). 139–139. 2 indexed citations
3.
Panchenko, Iuliana, et al.. (2022). Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integration. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 343–349. 1 indexed citations
4.
Panchenko, Iuliana, et al.. (2020). Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testing. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–7. 13 indexed citations
5.
Neumann, Volker, et al.. (2018). 3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating. Microelectronic Engineering. 205. 20–25. 20 indexed citations
6.
Panchenko, Iuliana, et al.. (2018). Characterisation of Cu/Cu bonding using self-assembled monolayer. Soldering and Surface Mount Technology. 30(2). 106–111. 10 indexed citations
7.
Meyer, Jörg, et al.. (2018). Cu-In fine-pitch-interconnects: influence of processing conditions on the interconnection quality. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–6. 8 indexed citations
8.
Lörtscher, Emanuel, et al.. (2016). Stress investigations in 3D-integrated silicon microstructures. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 970. 1–6. 2 indexed citations
9.
Vogel, D., et al.. (2015). Challenges in the reliability of 3D integration using TSVs. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–8. 14 indexed citations
10.
Zschech, Ehrenfried, et al.. (2015). 3D IC Stack Characterization Using Multi-Scale X-Ray Tomography. 20(1).
11.
Brand, Sebastian, et al.. (2015). Acoustic GHz-microscopy and its potential applications in 3D-integration technologies. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 14 indexed citations
12.
Hölck, O., M. C. Nuss, H. Walter, et al.. (2014). Development of process and design criteria for stress management in through silicon vias. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 625–630. 12 indexed citations
13.
Ndip, Ivan, Kai Zoschke, M. J. Wolf, et al.. (2013). Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs). IEEE Transactions on Components Packaging and Manufacturing Technology. 4(3). 504–515. 64 indexed citations
14.
Wolf, M. J., Bernhard Wunderle, Nils Jürgensen, et al.. (2008). High aspect ratio TSV copper filling with different seed layers. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 563–570. 90 indexed citations
15.
Ramm, Peter, M. J. Wolf, Armin Klumpp, et al.. (2008). Through silicon via technology — processes and reliability for wafer-level 3D system integration. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 90 indexed citations
16.
Wolf, M. J., Peter Ramm, Armin Klumpp, & H. Reichl. (2008). Technologies for 3D wafer level heterogeneous integration. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 123–126. 33 indexed citations
17.
18.
Vries, Johannes G. de, Bert Scholtens, Michaël Grätzel, et al.. (2000). Negative Ames-test of cis-di(thiocyanato)-N,N'-bis(4,4'-dicarboxy-2,2'-bipyridine)Ru(II), the sensitizer dye of the nanocrystalline TiO2 solar cell. Solar Energy Materials and Solar Cells. 60(1). 43–49. 4 indexed citations
19.
Moser, Jacques‐E., M. J. Wolf, Frank Lenzmann, & Michaël Grätzel. (1999). Photoinduced Charge Injection from Vibronically Hot Excited Molecules of a Dye Sensitizer into Acceptor States of Wide-Bandgap Oxide Semiconductors. Zeitschrift für Physikalische Chemie. 212(1). 85–92. 42 indexed citations
20.
Balke, Herbert, et al.. (1986). Substrate Bowing of Multilayer Thick Film Circuits. 3(3). 21–23. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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