M. J. Wolf

796 citations

41 papers · 606 indexed · h-index 13

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies 30
- Electronic Packaging and Soldering Technologies 21
- Electrodeposition and Electroless Coatings 4
- Integrated Circuits and Semiconductor Failure Analysis 4
- Semiconductor materials and devices 4
Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies 8
Biomedical Engineering
- Advanced Surface Polishing Techniques 6
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability 6
Renewable Energy, Sustainability and the Environment

Co-authors: H. Reichl Bernhard Wunderle Armin Klumpp Peter Ramm Kai Zoschke O. Ehrmann Robert Wieland B. Michel
Cited by: Electrical and Electronic Engineering Automotive Engineering Biomedical Engineering
Journals: IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Microelectronic Engineering (2 papers)Journal of Manufacturing and Materials Processing (2 papers)
Partner nations: Germany Switzerland Netherlands

In The Last Decade

M. J. Wolf

39 papers receiving 579 citations

Peers

Countries citing papers authored by M. J. Wolf

Since Specialization

Citations

This map shows the geographic impact of M. J. Wolf's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. J. Wolf with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. J. Wolf more than expected).

Fields of papers citing papers by M. J. Wolf

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. J. Wolf. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. J. Wolf. The network helps show where M. J. Wolf may publish in the future.

Co-authorship network

The 25 scholars most cited alongside M. J. Wolf, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with M. J. Wolf Line = papers co-authored together M. J. Wolf links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Injection Compression Molding of LDS-MID for Millimeter Wave Applications Journal of Manufacturing and Materials Processing ·M. J. Wolf,Laro Bonvehí,Wolfgang Eberhardt,Muhamad Rasat Muhamad,André Zimmermann	2023	3
2	Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications Journal of Manufacturing and Materials Processing ·M. J. Wolf,Laro Bonvehí,Thomas Guenther,Pam Bunner,Wolfgang Eberhardt,André Zimmermann	2023	2
3	Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integration Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·刘江啸,Iuliana Panchenko,M. J. Wolf	2022	1
4	Grain Structure Analysis of Cu/SiO₂ Hybrid Bond Interconnects after Reliability Testing Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Iuliana Panchenko,Yizi Liang,Ruth Tone,Sheng-De Jin,Nadhifah Nur Hafshah,Daniel Mas Fontcuberta,M. J. Wolf	2020	13
5	3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating Microelectronic Engineering ·Samuel Bulu Renda,Daniel Mas Fontcuberta,Wolfgang Hähnlein,Volker Neumann,Łukasz Szumiec,Christian Wenzel,X-D Peng,Matthias Albert,M. J. Wolf,Johann W. Bartha	2018	20
6	Characterisation of Cu/Cu bonding using self-assembled monolayer Soldering and Surface Mount Technology ·L. Stoetzer,Iuliana Panchenko,Sicheng Du,Łukasz Szumiec,Marion Geidel,M. J. Wolf,Klaus‐Dieter Lang	2018	10
7	Cu-In fine-pitch-interconnects: influence of processing conditions on the interconnection quality Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·刘江啸,عمر العبيدي,Jörg Meyer,Iuliana Panchenko,M. J. Wolf	2018	8
8	Stress investigations in 3D-integrated silicon microstructures Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·M. Stiebing,Emanuel Lörtscher,Reut Shor,D. Vogel,M. J. Wolf,Thomas Brunschwiler,Bernhard Wunderle	2016	2
9	Challenges in the reliability of 3D integration using TSVs Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·M. Stiebing,D. Vogel,Reut Shor,M. J. Wolf,Bernhard Wunderle	2015	14
10	3D IC Stack Characterization Using Multi-Scale X-Ray Tomography Ehrenfried Zschech,玲服部,Markus Löffler,M. Gall,M. J. Wolf	2015	0
11	Development of process and design criteria for stress management in through silicon vias Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·O. Hölck,M. C. Nuss,Hongkuan Yang,Xiaohai Chen,R.A. Goldbohm,明針谷,Sharon McAvoy,H. Walter,M. J. Wolf,Olaf Wittler,K.-D. Lang	2014	12
12	Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs) IEEE Transactions on Components Packaging and Manufacturing Technology ·Ivan Ndip,Kai Zoschke,Martha Patricia Castilla Valdez,M. J. Wolf,Stephan Guttowski,H. Reichl,Klaus‐Dieter Lang,Heino Henke	2013	64
13	Via last technology for direct stacking of processor and flash Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Craig D. Bishop,X-D Peng,严会喜,Daniel Mas Fontcuberta,Frank Windrich,明針谷,R.A. Goldbohm,Н. Вербицкая,Kai Zoschke,Maryam Mehrdadian,Hermann Oppermann,M. J. Wolf,K.-D. Lang	2012	12
14	Technologies for 3D wafer level heterogeneous integration Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·M. J. Wolf,Peter Ramm,Armin Klumpp,H. Reichl	2008	33
15	High aspect ratio TSV copper filling with different seed layers Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·M. J. Wolf,Rong Li Chen,Bernhard Wunderle,Nils Jürgensen,Zhijian Chen,O. Ehrmann,Albrecht Uhlig,Bernd Michel,H. Reichl	2008	90
16	Through silicon via technology — processes and reliability for wafer-level 3D system integration Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Peter Ramm,M. J. Wolf,Armin Klumpp,Robert Wieland,Bernhard Wunderle,B. Michel,H. Reichl	2008	90
17	Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging Adrielli Reis,Abid Rohmanu,M. J. Wolf,B. M�ther,O. Ehrmann,Jin Yu,H. Reichl	2005	8
18	Negative Ames-test of cis-di(thiocyanato)-N,N'-bis(4,4'-dicarboxy-2,2'-bipyridine)Ru(II), the sensitizer dye of the nanocrystalline TiO2 solar cell Solar Energy Materials and Solar Cells ·Johannes G. de Vries,Bert Scholtens,俞晓兰,Michaël Grätzel,Azzurra Muzzonigro,Shelly D. Burnside,M. J. Wolf,Andreas Hinsch,J.M. Kroon,Hoi Tong Lam,Mariano Rodríguez Peña,Shi Hao Yao,Robert S. Lathers,Anders Hagfeldt,Christopher R. Bradbury,Philip T. M. Carlsson,Henrik Pettersson,Osamu OKUDA,Kongzheng Guo	2000	4
19	Photoinduced Charge Injection from Vibronically Hot Excited Molecules of a Dye Sensitizer into Acceptor States of Wide-Bandgap Oxide Semiconductors Zeitschrift für Physikalische Chemie ·Jacques‐E. Moser,M. J. Wolf,Frank Lenzmann,Michaël Grätzel	1999	42
20	Substrate Bowing of Multilayer Thick Film Circuits Tanisha Gupta,Herbert Balke,M. J. Wolf	1986	1

About M. J. Wolf

M. J. Wolf is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Bioengineering, having authored 41 papers that have together received 606 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (21 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Copper Interconnects and Reliability (6 papers), Advanced Surface Polishing Techniques (6 papers), Electrodeposition and Electroless Coatings (4 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and Semiconductor materials and devices (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (540 citations), Automotive Engineering (82 citations) and Biomedical Engineering (126 citations). M. J. Wolf has collaborated with scholars based in Germany, Switzerland and Netherlands. Frequent co-authors include H. Reichl, Bernhard Wunderle, Armin Klumpp, Peter Ramm, Kai Zoschke, O. Ehrmann, Robert Wieland, B. Michel, Nils Jürgensen and Michaël Grätzel. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronic Engineering, Journal of Manufacturing and Materials Processing, Solar Energy Materials and Solar Cells and IEEE Transactions on Advanced Packaging.

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