Matthias Klein
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering
- Cellular and Molecular Neuroscience top 10%
- Cognitive Neuroscience top 10%
- Mechanical Engineering
- Co-authors
- Hermann OppermannGeorge G. MalliarasYulong ShenJ. C. ScottFlorian SolzbacherPrashant TathireddyMarek SmagaSohee Kim
- Topics
- Electronic Packaging and Soldering Technologies (18 papers)3D IC and TSV technologies (16 papers)Neuroscience and Neural Engineering (10 papers)
- Cited by
- Cellular and Molecular NeuroscienceElectrical and Electronic EngineeringCognitive Neuroscience
- Journals
- Physical Review LettersSHILAP Revista de lepidopterologíaPhysical review. B, Condensed matter
- Partner nations
- GermanyUnited StatesJapan
In The Last Decade
Matthias Klein
56 papers receiving 808 citations
Peers
Comparison fields: 5 of 57
- Electrical and Electronic Engineering 567
- Biomedical Engineering 226
- Cellular and Molecular Neuroscience 211
- Cognitive Neuroscience 129
- Mechanical Engineering 104
Countries citing papers authored by Matthias Klein
This map shows the geographic impact of Matthias Klein's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Matthias Klein with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Matthias Klein more than expected).
Fields of papers citing papers by Matthias Klein
This network shows the impact of papers produced by Matthias Klein. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Matthias Klein. The network helps show where Matthias Klein may publish in the future.
Co-authorship network of co-authors of Matthias Klein
This figure shows the co-authorship network connecting the top 25 collaborators of Matthias Klein. A scholar is included among the top collaborators of Matthias Klein based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Matthias Klein. Matthias Klein is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 4 | |
| 4 | 21 | |
| 5 | 4 | |
| 6 | 1 | |
| 7 | 26 | |
| 8 | 36 | |
| 9 | Progress in thermal characterisation methods and thermal interface technology within the “Nanopack” project | 2 |
| 10 | A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level | 2 |
| 11 | 4 | |
| 12 | 113 | |
| 13 | FEA Simulation of Thin Film Coils to Power Wireless Neural Interfaces | 3 |
| 14 | 26 | |
| 15 | 9 | |
| 16 | 5 | |
| 17 | Modular systems for sensor integration | 2 |
| 18 | 6 | |
| 19 | Space Charge Limited Current in the Single Electron Regime | 2 |
| 20 | 9 |
About Matthias Klein
Matthias Klein is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering and Cellular and Molecular Neuroscience, having authored 62 papers that have together received 849 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (16 papers) and Neuroscience and Neural Engineering (10 papers). The work is most often cited by research in Cellular and Molecular Neuroscience (211 citations), Electrical and Electronic Engineering (567 citations) and Cognitive Neuroscience (129 citations). Matthias Klein has collaborated with scholars based in Germany, United States and Japan. Frequent co-authors include Hermann Oppermann, George G. Malliaras, Yulong Shen, J. C. Scott, Florian Solzbacher, Prashant Tathireddy, Marek Smaga, Sohee Kim, H. Reichl and Michael Toepper. Their work appears in journals such as Physical Review Letters, SHILAP Revista de lepidopterología and Physical review. B, Condensed matter.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.