B. Michel

3.6k total citations
211 papers, 2.7k citations indexed

About

B. Michel is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, B. Michel has authored 211 papers receiving a total of 2.7k indexed citations (citations by other indexed papers that have themselves been cited), including 145 papers in Electrical and Electronic Engineering, 91 papers in Mechanics of Materials and 70 papers in Mechanical Engineering. Recurrent topics in B. Michel's work include Electronic Packaging and Soldering Technologies (120 papers), 3D IC and TSV technologies (54 papers) and Mechanical Behavior of Composites (39 papers). B. Michel is often cited by papers focused on Electronic Packaging and Soldering Technologies (120 papers), 3D IC and TSV technologies (54 papers) and Mechanical Behavior of Composites (39 papers). B. Michel collaborates with scholars based in Germany, United Kingdom and Spain. B. Michel's co-authors include R. Dudek, Bernhard Wunderle, Andreas Schubert, H. Reichl, D. Vogel, H. Walter, E. Auerswald, Astrid Gollhardt, Olaf Wittler and J.R. Morante and has published in prestigious journals such as Applied Physics Letters, Nanotechnology and Engineering Fracture Mechanics.

In The Last Decade

B. Michel

201 papers receiving 2.6k citations

Peers

B. Michel
Comparison fields: 5 of 83
  • Electrical and Electronic Engineering 2.1k
  • Mechanics of Materials 855
  • Mechanical Engineering 834
  • Biomedical Engineering 435
  • Materials Chemistry 286
Replace Seungbae Park with:
Seungbae Park United States
Y.C. Chan Hong Kong
Bernhard Wunderle Germany
Kuo‐Ning Chiang Taiwan
Luu Nguyen United States
Soon-Bok Lee South Korea
Suresh K. Sitaraman United States
D.C. Whalley United Kingdom
Chongdu Cho South Korea
Wen‐Hwa Chen Taiwan
Seungbae Park United States View profile →
Citations per field, relative to B. Michel
B. Michel · 1×
Citations per year, relative to B. Michel
B. Michel · 1×

Countries citing papers authored by B. Michel

Since Specialization
Citations

This map shows the geographic impact of B. Michel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Michel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Michel more than expected).

Fields of papers citing papers by B. Michel

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by B. Michel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Michel. The network helps show where B. Michel may publish in the future.

Co-authorship network of co-authors of B. Michel

This figure shows the co-authorship network connecting the top 25 collaborators of B. Michel. A scholar is included among the top collaborators of B. Michel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with B. Michel. B. Michel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
# Work Indexed citations
1 2
2
Reliability Analysis of Low Temperature Low Pressure Ag-Sinter Die Attach
20
3
Combined and accelerated in-situ measurement method for reliability and aging analyses of thermal interface materials
6
4
Fracture mechanical test methods for interface crack evaluation of electronic packages
4
5
DoE simulations and measurements with the microDAC stress chip for material and package investigations
2
6
Miniaturized black body radiator for IR-detector calibration — Design and development
3
7 3
8
Progress in thermal characterisation methods and thermal interface technology within the “Nanopack” project
2
9
Active components embedded into organic boards - Accelerated design by means of finite element simulation and micro deformation measurements
0
10 12
11 36
12 5
13 1
14 7
15 2
16 2
17 1
18 3
19 1
20 3

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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