Andreas Ostmann

1.7k total citations
134 papers, 1.4k citations indexed

About

Andreas Ostmann is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Mechanical Engineering. According to data from OpenAlex, Andreas Ostmann has authored 134 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 107 papers in Electrical and Electronic Engineering, 23 papers in Automotive Engineering and 23 papers in Mechanical Engineering. Recurrent topics in Andreas Ostmann's work include 3D IC and TSV technologies (86 papers), Electronic Packaging and Soldering Technologies (72 papers) and Additive Manufacturing and 3D Printing Technologies (21 papers). Andreas Ostmann is often cited by papers focused on 3D IC and TSV technologies (86 papers), Electronic Packaging and Soldering Technologies (72 papers) and Additive Manufacturing and 3D Printing Technologies (21 papers). Andreas Ostmann collaborates with scholars based in Germany, South Korea and Taiwan. Andreas Ostmann's co-authors include H. Reichl, R. Aschenbrenner, Dionysios Manessis, Thomas Löher, Eckart Hoene, Erik Jung, Alexander Neumann, Mingliang Huang, Young-Doo Jeon and E. Zakel and has published in prestigious journals such as Physical review. B, Condensed matter, Applied Physics Letters and Solar Energy Materials and Solar Cells.

In The Last Decade

Andreas Ostmann

122 papers receiving 1.3k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Andreas Ostmann Germany 22 1.1k 328 276 98 82 134 1.4k
R. Aschenbrenner Germany 22 1.3k 1.1× 297 0.9× 398 1.4× 81 0.8× 66 0.8× 151 1.6k
Seung Wook Yoon Singapore 23 1.4k 1.2× 405 1.2× 176 0.6× 172 1.8× 108 1.3× 100 1.5k
Tanja Braun Germany 15 728 0.6× 133 0.4× 214 0.8× 61 0.6× 50 0.6× 123 925
Pekka Ruuskanen Finland 16 519 0.5× 226 0.7× 414 1.5× 139 1.4× 192 2.3× 55 1.0k
Fumihiro Inoue Japan 18 867 0.8× 106 0.3× 270 1.0× 180 1.8× 35 0.4× 158 1.1k
D. Pinjala Singapore 19 877 0.8× 475 1.4× 269 1.0× 43 0.4× 28 0.3× 84 1.3k
Shiquan Wang China 17 358 0.3× 323 1.0× 500 1.8× 73 0.7× 102 1.2× 38 1.2k
Klaus‐Jürgen Wolter Germany 14 650 0.6× 250 0.8× 199 0.7× 29 0.3× 117 1.4× 137 906
Chi Zhang China 16 449 0.4× 332 1.0× 294 1.1× 76 0.8× 90 1.1× 168 1.1k
Darvin Edwards United States 15 781 0.7× 424 1.3× 134 0.5× 101 1.0× 77 0.9× 35 991

Countries citing papers authored by Andreas Ostmann

Since Specialization
Citations

This map shows the geographic impact of Andreas Ostmann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Andreas Ostmann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Andreas Ostmann more than expected).

Fields of papers citing papers by Andreas Ostmann

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Andreas Ostmann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Andreas Ostmann. The network helps show where Andreas Ostmann may publish in the future.

Co-authorship network of co-authors of Andreas Ostmann

This figure shows the co-authorship network connecting the top 25 collaborators of Andreas Ostmann. A scholar is included among the top collaborators of Andreas Ostmann based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Andreas Ostmann. Andreas Ostmann is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Pitilakis, Alexandros, Anna C. Tasolamprou, Dionysios Manessis, et al.. (2022). Multifunctional Metasurface Architecture for Amplitude, Polarization and Wave-Front Control. Physical Review Applied. 17(6). 30 indexed citations
2.
Löher, Thomas, et al.. (2022). PCB Embedding Technology for the Miniaturization of complex electronic systems. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 21–24. 4 indexed citations
3.
Meier, Karsten, Jan Meyer, Friedrich‐Leonhard Schein, et al.. (2019). Reliability of Substrate Embedded Rectifiers for High Voltage Applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 276–281. 1 indexed citations
4.
Kahle, R., Friedrich‐Leonhard Schein, & Andreas Ostmann. (2019). Evaluation of adaptive processes for the embedding of bare dies in IC substrates. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–4. 2 indexed citations
5.
Ostmann, Andreas, et al.. (2015). Development of a microcamera with embedded image processor using panel level packaging. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 2 indexed citations
6.
Manessis, Dionysios, et al.. (2015). Development of advanced power modules for electric vehicle applications. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6. 3 indexed citations
7.
Manessis, Dionysios, et al.. (2014). A “microSD”sized RF transceiver manufactured as an embedded system-in-package. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6.
8.
Manessis, Dionysios, et al.. (2013). Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–6. 4 indexed citations
9.
Manessis, Dionysios, et al.. (2011). Chip embedding technology developments leading to the emergence of miniaturized system-in-packages. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 2 indexed citations
10.
Ostmann, Andreas, et al.. (2011). Modular microelectronics by System-in-Packages with embedded components. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–5. 1 indexed citations
11.
Manessis, Dionysios, et al.. (2009). Advancements in bumping technologies for flip chip and WLCSP packaging. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–6. 1 indexed citations
12.
Löher, Thomas, et al.. (2008). Stretchable electronic systems for wearable and textile applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 9–12. 12 indexed citations
13.
Manessis, Dionysios, et al.. (2008). Embedded Chip Packages – Technology and Applications. 10(1).
14.
Manessis, Dionysios, R. Aschenbrenner, Andreas Ostmann, & H. Reichl. (2008). Latest developments in bumping technologies for flip chip and WLCSP packaging. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 15. 1–6. 1 indexed citations
15.
Baets, Johan De, Fabrice Axisa, Dominique Brosteaux, et al.. (2007). Stretchable conductor technology for elastic electronic systems. Ghent University Academic Bibliography (Ghent University). 3 indexed citations
16.
Braun, Tanja, J. Bauer, Dionysios Manessis, et al.. (2007). Microtechnology For Realization Of Dielectrophoresis Enhanced Microwells For Biomedical Applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 74. 406–410. 2 indexed citations
17.
Becker, K.-F., Alexander Neumann, Andreas Ostmann, et al.. (2005). A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing. Journal of Electronic Packaging. 127(1). 1–6. 8 indexed citations
18.
Huang, Mingliang, et al.. (2005). Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders. Applied Physics Letters. 86(18). 76 indexed citations
19.
Manessis, Dionysios, et al.. (2002). Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 3 indexed citations
20.
Ostmann, Andreas, et al.. (2000). Qualification of the system electroless nickel bumps and PbSn5 for high temperature applications. 102–106. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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