Andreas Ostmann
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- 3D IC and TSV technologies 86
- Electronic Packaging and Soldering Technologies 72
- Electromagnetic Compatibility and Noise Suppression 14
- Semiconductor Lasers and Optical Devices 14
- Silicon Carbide Semiconductor Technologies 10
- Mechanical Engineering top 10%
- Advanced Materials and Mechanics 10
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies 21
- Biomedical Engineering top 10%
- Advanced Sensor and Energy Harvesting Materials 11
- General Materials Science top 10%
- Co-authors
- H. ReichlR. AschenbrennerDionysios ManessisThomas LöherEckart HoeneErik JungAlexander NeumannMingliang Huang
- Journals
- Journal of Electronic Materials (2 papers)Microelectronics Reliability (2 papers)physica status solidi (a) (1 paper)
- Partner nations
- GermanySouth KoreaFinland
In The Last Decade
Andreas Ostmann
122 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 59
- Electrical and Electronic Engineering 1.1k
- Mechanical Engineering 328
- Automotive Engineering 80
- Biomedical Engineering 276
- General Materials Science 17
Countries citing papers authored by Andreas Ostmann
This map shows the geographic impact of Andreas Ostmann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Andreas Ostmann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Andreas Ostmann more than expected).
Fields of papers citing papers by Andreas Ostmann
This network shows the impact of papers produced by Andreas Ostmann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Andreas Ostmann. The network helps show where Andreas Ostmann may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Andreas Ostmann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 30 | |
| 2 | 2022 | 4 | |
| 3 | 2021 | 0 | |
| 4 | 2019 | 1 | |
| 5 | 2019 | 2 | |
| 6 | Development of a microcamera with embedded image processor using panel level packaging | 2015 | 2 |
| 7 | Development of advanced power modules for electric vehicle applications | 2015 | 3 |
| 8 | Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration | 2013 | 4 |
| 9 | Modular microelectronics by System-in-Packages with embedded components | 2011 | 1 |
| 10 | Chip embedding technology developments leading to the emergence of miniaturized system-in-packages | 2011 | 2 |
| 11 | Advancements in bumping technologies for flip chip and WLCSP packaging | 2009 | 1 |
| 12 | 2008 | 12 | |
| 13 | 2008 | 0 | |
| 14 | Stretchable conductor technology for elastic electronic systems | 2007 | 3 |
| 15 | 2006 | 24 | |
| 16 | 2005 | 76 | |
| 17 | 2003 | 17 | |
| 18 | Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping | 2002 | 3 |
| 19 | 2002 | 8 | |
| 20 | 2002 | 24 |
About Andreas Ostmann
Andreas Ostmann is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Industrial and Manufacturing Engineering, having authored 134 papers that have together received 1.4k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (86 papers), Electronic Packaging and Soldering Technologies (72 papers), Additive Manufacturing and 3D Printing Technologies (21 papers), Electromagnetic Compatibility and Noise Suppression (14 papers), Semiconductor Lasers and Optical Devices (14 papers), Advanced Sensor and Energy Harvesting Materials (11 papers), Advanced Materials and Mechanics (10 papers) and Silicon Carbide Semiconductor Technologies (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.1k citations), Mechanical Engineering (328 citations) and Automotive Engineering (80 citations). Andreas Ostmann has collaborated with scholars based in Germany, South Korea and Finland. Frequent co-authors include H. Reichl, R. Aschenbrenner, Dionysios Manessis, Thomas Löher, Eckart Hoene, Erik Jung, Alexander Neumann, Mingliang Huang, Young-Doo Jeon and E. Zakel. Their work appears in journals such as Journal of Electronic Materials, Microelectronics Reliability, physica status solidi (a), Physical Review Applied and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.